JPS5676542A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS5676542A
JPS5676542A JP15293379A JP15293379A JPS5676542A JP S5676542 A JPS5676542 A JP S5676542A JP 15293379 A JP15293379 A JP 15293379A JP 15293379 A JP15293379 A JP 15293379A JP S5676542 A JPS5676542 A JP S5676542A
Authority
JP
Japan
Prior art keywords
resin
tab
pellet
semiconductor device
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15293379A
Other languages
Japanese (ja)
Inventor
Susumu Okikawa
Hiroshi Mikino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15293379A priority Critical patent/JPS5676542A/en
Publication of JPS5676542A publication Critical patent/JPS5676542A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the moisture resistance of a resin-sealed semiconductor device by forming a through-hole or cutout to which resin can be introduced at a part of tab except the part fixed with a pellet and at the pellet, thereby preventing the exfoliation of the resin and the crack of the resin. CONSTITUTION:In a lead frame integrally formed with a tab 11 and an inner lead wire 12 by stamping a metallic plate and forming it, through holes 16, 16A or a cutout 16B is formed at the part to which a semiconductor pellet 13 is fixed on the peripheral part of the tab 11. Even if the tab 11 is deformed by the hardening stress of the resin 15 to thereby cause stress thereat in this manner, it can prevent the exfoliation between the resin 15 and the tab 11 and between the resin 15 and the pellet 13 by the resin introduced into the hole 16 around the tab 11 and the pellet 13, and can also prevent the crack of the resin.
JP15293379A 1979-11-28 1979-11-28 Resin-sealed semiconductor device Pending JPS5676542A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15293379A JPS5676542A (en) 1979-11-28 1979-11-28 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15293379A JPS5676542A (en) 1979-11-28 1979-11-28 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5676542A true JPS5676542A (en) 1981-06-24

Family

ID=15551307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15293379A Pending JPS5676542A (en) 1979-11-28 1979-11-28 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5676542A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4482915A (en) * 1981-07-06 1984-11-13 Matsushita Electronics Corp. Lead frame for plastic encapsulated semiconductor device
US4556896A (en) * 1982-08-30 1985-12-03 International Rectifier Corporation Lead frame structure
JPS6116555A (en) * 1984-07-03 1986-01-24 Hitachi Chem Co Ltd Plastic sealed type semiconductor device
JPH01278757A (en) * 1988-05-02 1989-11-09 Matsushita Electron Corp Lead frame
JPH0252357U (en) * 1989-09-20 1990-04-16
US4942454A (en) * 1987-08-05 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed semiconductor device
JPH02292850A (en) * 1989-05-06 1990-12-04 Matsushita Electron Corp Lead frame
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit
US5440170A (en) * 1990-09-10 1995-08-08 Fujitsu Limited Semiconductor device having a die pad with rounded edges and its manufacturing method
JP2001085591A (en) * 1999-08-24 2001-03-30 Fairchild Korea Semiconductor Kk Lead frame using chip pad as heat dissipation passage and semiconductor package including it
JP2010192930A (en) * 2010-04-30 2010-09-02 Rohm Co Ltd Island exposing type semiconductor device
US20180370343A1 (en) * 2015-12-22 2018-12-27 Tokai Kogyo Co., Ltd. Weather strip for automobile
US20190263238A1 (en) * 2015-12-22 2019-08-29 Tokai Kogyo Co., Ltd. Sealing member and attachment structure thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5253665A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Semiconductor device
JPS5414674A (en) * 1977-07-06 1979-02-03 Hitachi Ltd Lead fram an resin-sealed electronic parts using it

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5253665A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Semiconductor device
JPS5414674A (en) * 1977-07-06 1979-02-03 Hitachi Ltd Lead fram an resin-sealed electronic parts using it

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4482915A (en) * 1981-07-06 1984-11-13 Matsushita Electronics Corp. Lead frame for plastic encapsulated semiconductor device
US4556896A (en) * 1982-08-30 1985-12-03 International Rectifier Corporation Lead frame structure
JPS6116555A (en) * 1984-07-03 1986-01-24 Hitachi Chem Co Ltd Plastic sealed type semiconductor device
US4942454A (en) * 1987-08-05 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed semiconductor device
JPH01278757A (en) * 1988-05-02 1989-11-09 Matsushita Electron Corp Lead frame
JPH02292850A (en) * 1989-05-06 1990-12-04 Matsushita Electron Corp Lead frame
JPH0252357U (en) * 1989-09-20 1990-04-16
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit
US5440170A (en) * 1990-09-10 1995-08-08 Fujitsu Limited Semiconductor device having a die pad with rounded edges and its manufacturing method
JP2001085591A (en) * 1999-08-24 2001-03-30 Fairchild Korea Semiconductor Kk Lead frame using chip pad as heat dissipation passage and semiconductor package including it
JP2010192930A (en) * 2010-04-30 2010-09-02 Rohm Co Ltd Island exposing type semiconductor device
US20180370343A1 (en) * 2015-12-22 2018-12-27 Tokai Kogyo Co., Ltd. Weather strip for automobile
US20190263238A1 (en) * 2015-12-22 2019-08-29 Tokai Kogyo Co., Ltd. Sealing member and attachment structure thereof
US10870338B2 (en) * 2015-12-22 2020-12-22 Tokai Kogyo Co., Ltd. Sealing member and attachment structure thereof

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