JPS5623765A - Molded type electronic device - Google Patents
Molded type electronic deviceInfo
- Publication number
- JPS5623765A JPS5623765A JP9729579A JP9729579A JPS5623765A JP S5623765 A JPS5623765 A JP S5623765A JP 9729579 A JP9729579 A JP 9729579A JP 9729579 A JP9729579 A JP 9729579A JP S5623765 A JPS5623765 A JP S5623765A
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- package
- electronic device
- type electronic
- molded type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
PURPOSE:To reduce an interval space between lead wires and a package in a molded type electronic device by forming a hole at the portion passing the lead wires from the package. CONSTITUTION:A hole 3 is perforated at the lead wires 2 over the outer surface of a package 1. Thus, it increases the resin self-clamping strength and decreases the cross area of the portion passing the resin with the lead wires to largely reduce the interval between the package and the lead wires. Accordingly, it can improve a moisture resistance reliability.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9729579A JPS5623765A (en) | 1979-08-01 | 1979-08-01 | Molded type electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9729579A JPS5623765A (en) | 1979-08-01 | 1979-08-01 | Molded type electronic device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2866688A Division JPS63211659A (en) | 1988-02-12 | 1988-02-12 | Manufacture of resin-molded semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5623765A true JPS5623765A (en) | 1981-03-06 |
JPS6216553B2 JPS6216553B2 (en) | 1987-04-13 |
Family
ID=14188499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9729579A Granted JPS5623765A (en) | 1979-08-01 | 1979-08-01 | Molded type electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5623765A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5842246A (en) * | 1981-09-07 | 1983-03-11 | Toshiba Corp | Semiconductor device |
JPS5845681A (en) * | 1981-09-07 | 1983-03-16 | Toshiba Corp | Memory system |
JPS59119751A (en) * | 1982-12-25 | 1984-07-11 | Rohm Co Ltd | Semiconductor device |
JPS59103446U (en) * | 1982-12-28 | 1984-07-12 | 富士通株式会社 | semiconductor equipment |
JPS59147448A (en) * | 1983-02-12 | 1984-08-23 | Fujitsu Ltd | Lead frame for loading semiconductor element and semiconductor device manufactured by using said lead frame and manufacture thereof |
JPS6350136U (en) * | 1986-09-19 | 1988-04-05 | ||
US6953054B2 (en) | 2003-01-17 | 2005-10-11 | Showa Corporation | Relief valve |
US7429791B2 (en) | 2000-08-31 | 2008-09-30 | Nec Corporation | Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof |
JP2013175597A (en) * | 2012-02-24 | 2013-09-05 | Sumitomo Electric Device Innovations Inc | Package |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5356545U (en) * | 1976-10-15 | 1978-05-15 |
-
1979
- 1979-08-01 JP JP9729579A patent/JPS5623765A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5356545U (en) * | 1976-10-15 | 1978-05-15 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5842246A (en) * | 1981-09-07 | 1983-03-11 | Toshiba Corp | Semiconductor device |
JPS5845681A (en) * | 1981-09-07 | 1983-03-16 | Toshiba Corp | Memory system |
JPS59119751A (en) * | 1982-12-25 | 1984-07-11 | Rohm Co Ltd | Semiconductor device |
JPS59103446U (en) * | 1982-12-28 | 1984-07-12 | 富士通株式会社 | semiconductor equipment |
JPS59147448A (en) * | 1983-02-12 | 1984-08-23 | Fujitsu Ltd | Lead frame for loading semiconductor element and semiconductor device manufactured by using said lead frame and manufacture thereof |
JPS6348430B2 (en) * | 1983-02-12 | 1988-09-29 | Fujitsu Ltd | |
JPS6350136U (en) * | 1986-09-19 | 1988-04-05 | ||
US7429791B2 (en) | 2000-08-31 | 2008-09-30 | Nec Corporation | Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof |
US6953054B2 (en) | 2003-01-17 | 2005-10-11 | Showa Corporation | Relief valve |
JP2013175597A (en) * | 2012-02-24 | 2013-09-05 | Sumitomo Electric Device Innovations Inc | Package |
Also Published As
Publication number | Publication date |
---|---|
JPS6216553B2 (en) | 1987-04-13 |
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