JPS575351A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS575351A
JPS575351A JP7919480A JP7919480A JPS575351A JP S575351 A JPS575351 A JP S575351A JP 7919480 A JP7919480 A JP 7919480A JP 7919480 A JP7919480 A JP 7919480A JP S575351 A JPS575351 A JP S575351A
Authority
JP
Japan
Prior art keywords
resin
lead
leads
penetrating
boundary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7919480A
Other languages
Japanese (ja)
Inventor
Muramasu Oomori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7919480A priority Critical patent/JPS575351A/en
Publication of JPS575351A publication Critical patent/JPS575351A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent water content from penetrating through the contacting surface of an electrode lead and resin by forming narrow width of the boundary between the resin of the lead and the atmospheric air when the electrode lead is led externally from a semiconductor element sealed in the resin. CONSTITUTION:Electrode leads 11, 12, 13 for base, collector and emitter respectively are so disposed parallel to each other so that the collector lead 12 is located at the center, and a semiconductor pellet 14 is soldered to the lead 12. Narrow parts 11', 12', 13' are formed at the respective leads 11, 12, 13, and resin 17 is so formed as to seal the upper part at the boundary of the parts 11', 12', 13'. Thus, it can prevent water content from penetrating through the contacting surface between the resin 17 and the leads 11, 12, 13, thereby enhancing the moisture resistance of the element.
JP7919480A 1980-06-12 1980-06-12 Semiconductor device Pending JPS575351A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7919480A JPS575351A (en) 1980-06-12 1980-06-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7919480A JPS575351A (en) 1980-06-12 1980-06-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS575351A true JPS575351A (en) 1982-01-12

Family

ID=13683159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7919480A Pending JPS575351A (en) 1980-06-12 1980-06-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS575351A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4589010A (en) * 1981-04-28 1986-05-13 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4589010A (en) * 1981-04-28 1986-05-13 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor

Similar Documents

Publication Publication Date Title
JPS5745959A (en) Resin-sealed semiconductor device
JPS5315763A (en) Resin sealed type semiconductor device
JPS575351A (en) Semiconductor device
JPS5623765A (en) Molded type electronic device
JPS5788752A (en) Lead frame and semiconductor device prepared by using the same
JPS56115550A (en) Manufacture of semiconductor device
JPS5662346A (en) Lead frame and semicondcutor device having thereof
JPS5772337A (en) Semiconductor device
JPS5455172A (en) Semiconductor device
JPS5317274A (en) Electrode structure of semiconductor element
JPS5240972A (en) Packaging construction of semiconductor device
JPS57114277A (en) Semiconductor device
JPS52125272A (en) Substrate to which semiconductor device is mounted
JPS56104465A (en) Semiconductor device
JPS5362471A (en) Semiconductor device
JPS54146577A (en) Semiconductor device
JPS5732660A (en) Semiconductor device
JPS56147453A (en) Semiconductor device
JPS551530A (en) Moisture detecting method in package cavity
JPS5258371A (en) Production of resin sealed type electronic part
JPS5762548A (en) Semiconductor device
JPS5779629A (en) Integrated circuit device
JPS5348471A (en) Production of resin seal type semiconductor device
JPS5710954A (en) Semiconductor device
JPS5333057A (en) Bump type semiconductor device