JPS5762548A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5762548A
JPS5762548A JP13747080A JP13747080A JPS5762548A JP S5762548 A JPS5762548 A JP S5762548A JP 13747080 A JP13747080 A JP 13747080A JP 13747080 A JP13747080 A JP 13747080A JP S5762548 A JPS5762548 A JP S5762548A
Authority
JP
Japan
Prior art keywords
semiconductor device
mount
displacement
length
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13747080A
Other languages
Japanese (ja)
Inventor
Kaoru Sonobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13747080A priority Critical patent/JPS5762548A/en
Publication of JPS5762548A publication Critical patent/JPS5762548A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

PURPOSE:To facilitate the inspection of the displacement of a mount by forming a projection toward a lead at the end around a base for mounting a semiconductor element. CONSTITUTION:Projections 6 toward at least one or more leads are formed on the periphery of a base 2 for placing a semiconductor element 1 of a lead frame. In this manner, pin number can be readily identified, and when the length of the projec- tion is suitably selected, the displacement of the mount can be detected with the length as a reference, thereby improving the efficiency in the assembling work of the semiconductor device.
JP13747080A 1980-10-01 1980-10-01 Semiconductor device Pending JPS5762548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13747080A JPS5762548A (en) 1980-10-01 1980-10-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13747080A JPS5762548A (en) 1980-10-01 1980-10-01 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5762548A true JPS5762548A (en) 1982-04-15

Family

ID=15199351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13747080A Pending JPS5762548A (en) 1980-10-01 1980-10-01 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5762548A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5594274A (en) * 1993-07-01 1997-01-14 Nec Corporation Lead frame for use in a semiconductor device and method of manufacturing the semiconductor device using the same
JP2011014758A (en) * 2009-07-03 2011-01-20 Renesas Electronics Corp Lead frame and electronic component using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5594274A (en) * 1993-07-01 1997-01-14 Nec Corporation Lead frame for use in a semiconductor device and method of manufacturing the semiconductor device using the same
JP2011014758A (en) * 2009-07-03 2011-01-20 Renesas Electronics Corp Lead frame and electronic component using the same

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