JPS5242390A - Semiconductor light receiving device - Google Patents

Semiconductor light receiving device

Info

Publication number
JPS5242390A
JPS5242390A JP50118341A JP11834175A JPS5242390A JP S5242390 A JPS5242390 A JP S5242390A JP 50118341 A JP50118341 A JP 50118341A JP 11834175 A JP11834175 A JP 11834175A JP S5242390 A JPS5242390 A JP S5242390A
Authority
JP
Japan
Prior art keywords
receiving device
light receiving
semiconductor light
semiconductor
materail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50118341A
Other languages
Japanese (ja)
Inventor
Hideaki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP50118341A priority Critical patent/JPS5242390A/en
Publication of JPS5242390A publication Critical patent/JPS5242390A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE: To obtain a light receiving device having corrected spectral sensitivity by so composing the receiving device that a resin materail having a desired spectral transmissivity provided in close contact with the receiving surface of a semiconductor receiving element serves as at least a part of an enclosure.
COPYRIGHT: (C)1977,JPO&Japio
JP50118341A 1975-09-30 1975-09-30 Semiconductor light receiving device Pending JPS5242390A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50118341A JPS5242390A (en) 1975-09-30 1975-09-30 Semiconductor light receiving device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50118341A JPS5242390A (en) 1975-09-30 1975-09-30 Semiconductor light receiving device

Publications (1)

Publication Number Publication Date
JPS5242390A true JPS5242390A (en) 1977-04-01

Family

ID=14734268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50118341A Pending JPS5242390A (en) 1975-09-30 1975-09-30 Semiconductor light receiving device

Country Status (1)

Country Link
JP (1) JPS5242390A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552106U (en) * 1978-06-15 1980-01-09
JPS57194587A (en) * 1981-05-26 1982-11-30 Nec Corp Semiconductor light receiving device
JPS60119760A (en) * 1983-11-30 1985-06-27 Nitto Electric Ind Co Ltd Resin-sealed semiconductor device
US5098630A (en) * 1985-03-08 1992-03-24 Olympus Optical Co., Ltd. Method of molding a solid state image pickup device
US5949073A (en) * 1996-05-07 1999-09-07 Matsushita Electric Industrial Co., Ltd. Photo detector
EP1589586A1 (en) * 2003-01-20 2005-10-26 Sharp Kabushiki Kaisha Transparent resin composition for optical sensor filter, optical sensor and production method therefor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552106U (en) * 1978-06-15 1980-01-09
JPS57194587A (en) * 1981-05-26 1982-11-30 Nec Corp Semiconductor light receiving device
JPS60119760A (en) * 1983-11-30 1985-06-27 Nitto Electric Ind Co Ltd Resin-sealed semiconductor device
JPH021374B2 (en) * 1983-11-30 1990-01-11 Nitto Denko Corp
US5098630A (en) * 1985-03-08 1992-03-24 Olympus Optical Co., Ltd. Method of molding a solid state image pickup device
US5949073A (en) * 1996-05-07 1999-09-07 Matsushita Electric Industrial Co., Ltd. Photo detector
EP1589586A1 (en) * 2003-01-20 2005-10-26 Sharp Kabushiki Kaisha Transparent resin composition for optical sensor filter, optical sensor and production method therefor
EP1589586A4 (en) * 2003-01-20 2010-10-13 Sharp Kk Transparent resin composition for optical sensor filter, optical sensor and production method therefor

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