JPS5212571A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPS5212571A JPS5212571A JP50088327A JP8832775A JPS5212571A JP S5212571 A JPS5212571 A JP S5212571A JP 50088327 A JP50088327 A JP 50088327A JP 8832775 A JP8832775 A JP 8832775A JP S5212571 A JPS5212571 A JP S5212571A
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- bonding device
- semi
- make
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To make possible the assembly of a semi-conductor device with many bonding parts, and besides, in even assembling a semi-conductor with various items, to make it possible by simple adjustment.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50088327A JPS5212571A (en) | 1975-07-21 | 1975-07-21 | Wire bonding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50088327A JPS5212571A (en) | 1975-07-21 | 1975-07-21 | Wire bonding device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5212571A true JPS5212571A (en) | 1977-01-31 |
JPS5436832B2 JPS5436832B2 (en) | 1979-11-12 |
Family
ID=13939785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50088327A Granted JPS5212571A (en) | 1975-07-21 | 1975-07-21 | Wire bonding device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5212571A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63257236A (en) * | 1987-04-14 | 1988-10-25 | Mitsubishi Electric Corp | Wire bonding |
-
1975
- 1975-07-21 JP JP50088327A patent/JPS5212571A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63257236A (en) * | 1987-04-14 | 1988-10-25 | Mitsubishi Electric Corp | Wire bonding |
JPH0523498B2 (en) * | 1987-04-14 | 1993-04-02 | Mitsubishi Electric Corp |
Also Published As
Publication number | Publication date |
---|---|
JPS5436832B2 (en) | 1979-11-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5211784A (en) | Photo semiconductor device | |
JPS522277A (en) | Soldering device | |
JPS5212571A (en) | Wire bonding device | |
JPS5240063A (en) | Lead frame | |
JPS5233480A (en) | Semiconductor device | |
JPS5285474A (en) | Semiconductor device | |
JPS5325360A (en) | Production of semiconductor device | |
JPS52126183A (en) | Preparation of semiconductor device | |
JPS52112754A (en) | Mos transistor constant-voltage circuit | |
JPS51132968A (en) | Semiconductor device | |
JPS52143186A (en) | Taping device | |
JPS51123005A (en) | Analog presser | |
JPS51135164A (en) | Device of changing the direction of wind | |
JPS547865A (en) | Semiconductor device | |
JPS51112292A (en) | Semiconductor device | |
JPS53148521A (en) | Hapten-antibody complex and its preparation | |
JPS51146961A (en) | Hair-keeper for hair-curler | |
JPS527660A (en) | Modulation circuit | |
JPS5333057A (en) | Bump type semiconductor device | |
JPS5278371A (en) | Metal ribbon for semiconductor device | |
JPS542664A (en) | Semiconductor device | |
JPS51147731A (en) | Concentrated control circuit | |
JPS5370671A (en) | Production of semiconductor device | |
JPS51132720A (en) | Solid image-pickup device | |
JPS524185A (en) | Magnetic resistor element |