JPS5752156A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5752156A
JPS5752156A JP12830680A JP12830680A JPS5752156A JP S5752156 A JPS5752156 A JP S5752156A JP 12830680 A JP12830680 A JP 12830680A JP 12830680 A JP12830680 A JP 12830680A JP S5752156 A JPS5752156 A JP S5752156A
Authority
JP
Japan
Prior art keywords
outer frame
lead
bridge
frame
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12830680A
Other languages
Japanese (ja)
Inventor
Yoshimasa Kudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12830680A priority Critical patent/JPS5752156A/en
Publication of JPS5752156A publication Critical patent/JPS5752156A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the opening of a bonding and to prevent the damage of a resin sealing layer by forming a connecting hand of narrow width at the connecting part of the bridge of a lead frame and the outer frame and forming a hole at the outer frame. CONSTITUTION:A connecting hand 11a of narrow width is formed at the connecting part of the bridge 15 of a lead frame body 10 made of an outer frame 11, a partition frame 12, an islant 13 a lead 14 and a bridge 15 with the outer frame 11, and a hole 16 is formed at the outer frame 11. In this manner, the opening of the bonding due to the displacement of the position of the lead can be prevented, the tensile strength applied to a resin layer at the time of curing and contracting the resin layer at the time of curing and conracting the resin sealing layer is alleviated, thereby preventing the damage at the resin sealing layer.
JP12830680A 1980-09-16 1980-09-16 Lead frame for semiconductor device Pending JPS5752156A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12830680A JPS5752156A (en) 1980-09-16 1980-09-16 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12830680A JPS5752156A (en) 1980-09-16 1980-09-16 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5752156A true JPS5752156A (en) 1982-03-27

Family

ID=14981512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12830680A Pending JPS5752156A (en) 1980-09-16 1980-09-16 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5752156A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61216872A (en) * 1985-03-20 1986-09-26 Dengensha Mfg Co Ltd Welding current measuring instrument
JPS6296866A (en) * 1985-08-06 1987-05-06 ダイナミック　システムズ　インコーポレーテッド Method and device for measuring current effective value
JPS62203682A (en) * 1986-02-28 1987-09-08 Dengensha Mfg Co Ltd Welding current waveform monitoring device
JPS6336982A (en) * 1986-07-31 1988-02-17 Dengensha Mfg Co Ltd Resistance weld quality monitor
JPH01100684U (en) * 1987-12-24 1989-07-06
JPH0955465A (en) * 1995-08-16 1997-02-25 Nec Corp Lead frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102562A (en) * 1975-03-07 1976-09-10 Hitachi Ltd RIIDOFUREEMU

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102562A (en) * 1975-03-07 1976-09-10 Hitachi Ltd RIIDOFUREEMU

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61216872A (en) * 1985-03-20 1986-09-26 Dengensha Mfg Co Ltd Welding current measuring instrument
JPH0244630B2 (en) * 1985-03-20 1990-10-04 Dengensha Mfg Co Ltd
JPS6296866A (en) * 1985-08-06 1987-05-06 ダイナミック　システムズ　インコーポレーテッド Method and device for measuring current effective value
JPS62203682A (en) * 1986-02-28 1987-09-08 Dengensha Mfg Co Ltd Welding current waveform monitoring device
JPS6336982A (en) * 1986-07-31 1988-02-17 Dengensha Mfg Co Ltd Resistance weld quality monitor
JPH01100684U (en) * 1987-12-24 1989-07-06
JPH0237508Y2 (en) * 1987-12-24 1990-10-11
JPH0955465A (en) * 1995-08-16 1997-02-25 Nec Corp Lead frame

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