JPS6423561A - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- JPS6423561A JPS6423561A JP17974187A JP17974187A JPS6423561A JP S6423561 A JPS6423561 A JP S6423561A JP 17974187 A JP17974187 A JP 17974187A JP 17974187 A JP17974187 A JP 17974187A JP S6423561 A JPS6423561 A JP S6423561A
- Authority
- JP
- Japan
- Prior art keywords
- bending
- lead
- molding
- stress
- outer lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To relieve an effect of molding stress at the time of a bending operation so as to upgrade reliability and to stabilize quality, by projecting an outer lead from a main body of a semiconductor package and bending/molding the lead in the vicinity of a side end of the main body and on a position of a groove formed on a surface in the bending direction. CONSTITUTION:A groove 5 is formed beforehand on a bending position 4 and on a surface in the bending direction of an outer lead 3. Since the groove 5 exists in this way upon the bending/molding of the outer lead 3, bending stress becomes small and so a bending operation is facilitated. Accordingly the bending stress has no effect on the inner lead. Hence the bending formation of the outer lead is facilitated, and the effect of the bending stress on the inner lead is much relaxed, so that mold resin is prevented from cracking and damp-proof performance is prevented from being lowered due to deterioration in adhesiveness between the mold resin and the inner lead.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17974187A JPS6423561A (en) | 1987-07-18 | 1987-07-18 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17974187A JPS6423561A (en) | 1987-07-18 | 1987-07-18 | Semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6423561A true JPS6423561A (en) | 1989-01-26 |
Family
ID=16071056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17974187A Pending JPS6423561A (en) | 1987-07-18 | 1987-07-18 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6423561A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5076344A (en) * | 1989-03-07 | 1991-12-31 | Aluminum Company Of America | Die-casting process and equipment |
US5579945A (en) * | 1993-08-23 | 1996-12-03 | Hosokawa Yoko Co., Ltd. | Container housing containing disposable container |
KR100280086B1 (en) * | 1995-10-19 | 2001-02-01 | 마이클 디. 오브라이언 | Lead Frame Structure of Semiconductor Package |
US6271480B1 (en) | 1997-05-09 | 2001-08-07 | Nec Corporation | Electronic device |
-
1987
- 1987-07-18 JP JP17974187A patent/JPS6423561A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5076344A (en) * | 1989-03-07 | 1991-12-31 | Aluminum Company Of America | Die-casting process and equipment |
US5579945A (en) * | 1993-08-23 | 1996-12-03 | Hosokawa Yoko Co., Ltd. | Container housing containing disposable container |
KR100280086B1 (en) * | 1995-10-19 | 2001-02-01 | 마이클 디. 오브라이언 | Lead Frame Structure of Semiconductor Package |
US6271480B1 (en) | 1997-05-09 | 2001-08-07 | Nec Corporation | Electronic device |
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