JPS6423561A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS6423561A
JPS6423561A JP17974187A JP17974187A JPS6423561A JP S6423561 A JPS6423561 A JP S6423561A JP 17974187 A JP17974187 A JP 17974187A JP 17974187 A JP17974187 A JP 17974187A JP S6423561 A JPS6423561 A JP S6423561A
Authority
JP
Japan
Prior art keywords
bending
lead
molding
stress
outer lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17974187A
Other languages
Japanese (ja)
Inventor
Shoichi Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP17974187A priority Critical patent/JPS6423561A/en
Publication of JPS6423561A publication Critical patent/JPS6423561A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To relieve an effect of molding stress at the time of a bending operation so as to upgrade reliability and to stabilize quality, by projecting an outer lead from a main body of a semiconductor package and bending/molding the lead in the vicinity of a side end of the main body and on a position of a groove formed on a surface in the bending direction. CONSTITUTION:A groove 5 is formed beforehand on a bending position 4 and on a surface in the bending direction of an outer lead 3. Since the groove 5 exists in this way upon the bending/molding of the outer lead 3, bending stress becomes small and so a bending operation is facilitated. Accordingly the bending stress has no effect on the inner lead. Hence the bending formation of the outer lead is facilitated, and the effect of the bending stress on the inner lead is much relaxed, so that mold resin is prevented from cracking and damp-proof performance is prevented from being lowered due to deterioration in adhesiveness between the mold resin and the inner lead.
JP17974187A 1987-07-18 1987-07-18 Semiconductor package Pending JPS6423561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17974187A JPS6423561A (en) 1987-07-18 1987-07-18 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17974187A JPS6423561A (en) 1987-07-18 1987-07-18 Semiconductor package

Publications (1)

Publication Number Publication Date
JPS6423561A true JPS6423561A (en) 1989-01-26

Family

ID=16071056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17974187A Pending JPS6423561A (en) 1987-07-18 1987-07-18 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS6423561A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5076344A (en) * 1989-03-07 1991-12-31 Aluminum Company Of America Die-casting process and equipment
US5579945A (en) * 1993-08-23 1996-12-03 Hosokawa Yoko Co., Ltd. Container housing containing disposable container
KR100280086B1 (en) * 1995-10-19 2001-02-01 마이클 디. 오브라이언 Lead Frame Structure of Semiconductor Package
US6271480B1 (en) 1997-05-09 2001-08-07 Nec Corporation Electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5076344A (en) * 1989-03-07 1991-12-31 Aluminum Company Of America Die-casting process and equipment
US5579945A (en) * 1993-08-23 1996-12-03 Hosokawa Yoko Co., Ltd. Container housing containing disposable container
KR100280086B1 (en) * 1995-10-19 2001-02-01 마이클 디. 오브라이언 Lead Frame Structure of Semiconductor Package
US6271480B1 (en) 1997-05-09 2001-08-07 Nec Corporation Electronic device

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