JPS6437075A - Circuit board - Google Patents

Circuit board

Info

Publication number
JPS6437075A
JPS6437075A JP19346387A JP19346387A JPS6437075A JP S6437075 A JPS6437075 A JP S6437075A JP 19346387 A JP19346387 A JP 19346387A JP 19346387 A JP19346387 A JP 19346387A JP S6437075 A JPS6437075 A JP S6437075A
Authority
JP
Japan
Prior art keywords
board
resin
boundary
thermal expansion
close
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19346387A
Other languages
Japanese (ja)
Inventor
Hiroshi Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP19346387A priority Critical patent/JPS6437075A/en
Publication of JPS6437075A publication Critical patent/JPS6437075A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent a large internal stress from being applied to the boundary between resin and a board during a curing process and avoid the warpage of the whole board by a method wherein fillers made of material whose thermal expansion coefficient is close to that of the board are condensed near the board surface in the resin. CONSTITUTION:Circuit components 6 are mounted on a board 1 and molded with hard resin 8a to form a circuit board. Fillers 8b made of material whose thermal expansion coefficient is close to that of the board 1 are condensed near the board 1 surface in the resin 8a. Therefore, the thermal expansion coefficient of the resin 8a at the boundary between the board 1 and the resin 8a is close to that of the board 1 and the contraction of the resin 8a while the resin 8a is cured takes place mainly near the resin surface so that a large internal stress is not applied to the boundary between the board 1 and the resin 8a. With this constitution, the warpage of the whole board 1 is avoided and the circuit components 6 and so forth in the resin 8a are not damaged.
JP19346387A 1987-07-31 1987-07-31 Circuit board Pending JPS6437075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19346387A JPS6437075A (en) 1987-07-31 1987-07-31 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19346387A JPS6437075A (en) 1987-07-31 1987-07-31 Circuit board

Publications (1)

Publication Number Publication Date
JPS6437075A true JPS6437075A (en) 1989-02-07

Family

ID=16308423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19346387A Pending JPS6437075A (en) 1987-07-31 1987-07-31 Circuit board

Country Status (1)

Country Link
JP (1) JPS6437075A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244638A (en) * 1999-12-20 2001-09-07 Matsushita Electric Ind Co Ltd Module with built-in circuit and its manufacturing method
JP2019068030A (en) * 2017-09-28 2019-04-25 株式会社デンソー Electronic device and manufacturing method of the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596512A (en) * 1982-07-02 1984-01-13 Nissin Electric Co Ltd Manufacture of molded coil

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596512A (en) * 1982-07-02 1984-01-13 Nissin Electric Co Ltd Manufacture of molded coil

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244638A (en) * 1999-12-20 2001-09-07 Matsushita Electric Ind Co Ltd Module with built-in circuit and its manufacturing method
JP2019068030A (en) * 2017-09-28 2019-04-25 株式会社デンソー Electronic device and manufacturing method of the same

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