JPS6437075A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPS6437075A JPS6437075A JP19346387A JP19346387A JPS6437075A JP S6437075 A JPS6437075 A JP S6437075A JP 19346387 A JP19346387 A JP 19346387A JP 19346387 A JP19346387 A JP 19346387A JP S6437075 A JPS6437075 A JP S6437075A
- Authority
- JP
- Japan
- Prior art keywords
- board
- resin
- boundary
- thermal expansion
- close
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To prevent a large internal stress from being applied to the boundary between resin and a board during a curing process and avoid the warpage of the whole board by a method wherein fillers made of material whose thermal expansion coefficient is close to that of the board are condensed near the board surface in the resin. CONSTITUTION:Circuit components 6 are mounted on a board 1 and molded with hard resin 8a to form a circuit board. Fillers 8b made of material whose thermal expansion coefficient is close to that of the board 1 are condensed near the board 1 surface in the resin 8a. Therefore, the thermal expansion coefficient of the resin 8a at the boundary between the board 1 and the resin 8a is close to that of the board 1 and the contraction of the resin 8a while the resin 8a is cured takes place mainly near the resin surface so that a large internal stress is not applied to the boundary between the board 1 and the resin 8a. With this constitution, the warpage of the whole board 1 is avoided and the circuit components 6 and so forth in the resin 8a are not damaged.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19346387A JPS6437075A (en) | 1987-07-31 | 1987-07-31 | Circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19346387A JPS6437075A (en) | 1987-07-31 | 1987-07-31 | Circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6437075A true JPS6437075A (en) | 1989-02-07 |
Family
ID=16308423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19346387A Pending JPS6437075A (en) | 1987-07-31 | 1987-07-31 | Circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6437075A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001244638A (en) * | 1999-12-20 | 2001-09-07 | Matsushita Electric Ind Co Ltd | Module with built-in circuit and its manufacturing method |
JP2019068030A (en) * | 2017-09-28 | 2019-04-25 | 株式会社デンソー | Electronic device and manufacturing method of the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS596512A (en) * | 1982-07-02 | 1984-01-13 | Nissin Electric Co Ltd | Manufacture of molded coil |
-
1987
- 1987-07-31 JP JP19346387A patent/JPS6437075A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS596512A (en) * | 1982-07-02 | 1984-01-13 | Nissin Electric Co Ltd | Manufacture of molded coil |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001244638A (en) * | 1999-12-20 | 2001-09-07 | Matsushita Electric Ind Co Ltd | Module with built-in circuit and its manufacturing method |
JP2019068030A (en) * | 2017-09-28 | 2019-04-25 | 株式会社デンソー | Electronic device and manufacturing method of the same |
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