JP2019068030A - Electronic device and manufacturing method of the same - Google Patents

Electronic device and manufacturing method of the same Download PDF

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JP2019068030A
JP2019068030A JP2018058055A JP2018058055A JP2019068030A JP 2019068030 A JP2019068030 A JP 2019068030A JP 2018058055 A JP2018058055 A JP 2018058055A JP 2018058055 A JP2018058055 A JP 2018058055A JP 2019068030 A JP2019068030 A JP 2019068030A
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resin layer
circuit board
printed circuit
resin
sealing portion
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JP7187795B2 (en
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一欽 柳原
Kazuyoshi Yanagihara
一欽 柳原
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Denso Corp
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Denso Corp
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Abstract

To provide an electronic device which can inhibit solder life from being shortened by influence of stress of an electronic component mounted by solder even when a filler added to a resin sinks during hardening of the resin, and to provide a manufacturing method of the electronic device.SOLUTION: A second sealing part 8 is formed in advance on the rear surface 2b side of a printed circuit board 2 which has electronic components 3, 4 mounted on both surfaces by means of solder 5 and 6. A second resin layer 8b is laminated on a first resin layer 8a covering the electronic component 4. The printed circuit board 2 is disposed in a recessed part 1a of a housing 1 with its surface 2a upside. First and third sealing parts 7 and 9 are formed by supplying a liquid resin to the recessed parts 1a and 1b of the housing 1. The first resin layer 7a covers a part of the electronic component 3. Fillers 7c and 8c sink in the first resin layers 7a and 8a, and the first resin layers 7a and 8a have heat expansion coefficients smaller than those of the second resin layers 7b and 8b. Reduction of stress on the solder 5 and 6 of the electronic components 3 and 4 enables a solder crack rate to be reduced.SELECTED DRAWING: Figure 1

Description

本発明は、電子装置および電子装置の製造方法に関する。   The present invention relates to an electronic device and a method of manufacturing the electronic device.

電子装置として、プリント基板などに電子部品を実装してケース内に配置した状態で樹脂封止をする構成のものがある。樹脂封止をするのは、電子部品を実装したプリント基板を樹脂で封止することで、防水、防塵、耐振動性を向上させるためである。この場合、一般に封止樹脂では、密着させるプリント基板・はんだ・ケースとの熱膨張による歪みを小さくするため、樹脂に無機フィラを添加している。   As an electronic device, there is one having a configuration in which resin sealing is performed in a state where an electronic component is mounted on a printed circuit board or the like and disposed in a case. The resin sealing is performed in order to improve waterproof, dust resistance, and vibration resistance by sealing the printed circuit board on which the electronic component is mounted with a resin. In this case, in general, in the sealing resin, an inorganic filler is added to the resin in order to reduce distortion due to thermal expansion of the printed circuit board, the solder, and the case to be adhered.

しかしながら、樹脂層として液状封止材を用いる場合に、ケース内への樹脂注入から硬化までの間に、そのフィラが沈降するため、樹脂上面にはフィラを含まない層が形成されることがある。プリント基板に電子部品を両面実装で配置する電子装置を樹脂封止する場合には、プリント基板の裏面側すなわち下面側では、樹脂とプリント基板の界面にフィラを含まない層が形成される。このため、フィラを含まない樹脂層の熱膨張の歪みが大きく、電子部品を実装する部分に設けているはんだは、寿命が低下しやすくなるという課題がある。   However, when a liquid sealing material is used as the resin layer, the filler may precipitate between the injection of the resin into the case and the curing, so that a layer containing no filler may be formed on the upper surface of the resin. . In the case of resin sealing an electronic device in which an electronic component is disposed on both sides of a printed circuit board, a layer containing no filler is formed on the interface between the resin and the printed circuit board on the back surface side, that is, the lower surface side of the printed circuit board. For this reason, the distortion of the thermal expansion of the resin layer which does not contain a filler is large, and the solder provided in the part which mounts an electronic component has the subject that a lifetime becomes easy to fall.

これに対して材料組成を変更することにより、樹脂中のフィラの沈降を抑制することができるようにした技術がある。しかし、完全に樹脂上面のフィラの沈降を抑制することは難しく、しかも、コスト面でも実用化には課題が残るものであった。   On the other hand, there is a technique in which the settling of the filler in the resin can be suppressed by changing the material composition. However, it is difficult to completely suppress the sedimentation of the filler on the upper surface of the resin, and there are still problems in practical use in terms of cost.

特開２００９−２０３４３１号公報JP, 2009-203431, A

本発明は、上記事情を考慮してなされたもので、その目的は、樹脂に添加するフィラが樹脂硬化の際に沈降する場合でも、はんだ実装した電子部品の応力の影響によるはんだ寿命の低下を抑制できるようにした電子装置および電子装置の製造方法を提供することにある。   The present invention has been made in consideration of the above circumstances, and its object is to reduce the solder life of a solder-mounted electronic component under the influence of stress even when the filler added to the resin precipitates during resin curing. It is an object of the present invention to provide an electronic device and a method of manufacturing the electronic device which can be suppressed.

請求項１に記載の電子装置は、電子部品がはんだを用いて実装されたプリント基板と、前記プリント基板が格納される筐体と、前記筐体内に形成され、前記プリント基板の両面に前記電子部品を含む部分を覆う第１樹脂層および前記第１樹脂層に接する第２樹脂層を有する第１封止部および第２封止部とを備え、前記第１および第２封止部は、添加材の沈降により、前記第１樹脂層の線膨張率が、前記第２樹脂層の線膨張率よりも小さくなるように形成されている。   The electronic device according to claim 1 is formed in a printed circuit board on which electronic components are mounted using solder, a case in which the printed circuit board is stored, and the case, and the electronic device is formed on both sides of the printed circuit board A first sealing portion and a second sealing portion having a first resin layer covering a portion including a part and a second resin layer in contact with the first resin layer, the first and second sealing portions comprising The linear expansion coefficient of the first resin layer is formed to be smaller than the linear expansion coefficient of the second resin layer by the sedimentation of the additive.

上記構成を採用することにより、プリント基板の両面に実装した電子部品は、第１封止部および第２封止部により樹脂封止する場合に、いずれの電子部品も添加材の沈降によって線膨張率が小さく設定された第１樹脂層で覆うように形成されているので、電子部品を実装するためのはんだの劣化による不具合の発生を抑制することができる。   By adopting the above configuration, when electronic components mounted on both sides of the printed circuit board are resin-sealed by the first sealing portion and the second sealing portion, any electronic components also undergo linear expansion due to sedimentation of the additive. Since it is formed so that it may cover with the 1st resin layer set up with a small rate, generation | occurrence | production of the defect by deterioration of the solder for mounting an electronic component can be suppressed.

第１実施形態を示す縦断側面図Longitudinal side view showing the first embodiment 作用説明図（その１）Function explanation figure (the 1) 作用説明図（その２）Operation explanation figure (the 2) 製造工程の説明図（その１）Explanatory drawing of the manufacturing process (part 1) 製造工程の説明図（その２）Explanatory drawing of a manufacturing process (the 2) 製造工程の説明図（その３）Explanatory drawing of a manufacturing process (the 3) 製造工程の説明図（その４）Explanatory drawing of a manufacturing process (the 4) 製造工程の説明図（その５）Explanatory drawing of a manufacturing process (the 5) 第２実施形態を示す縦断側面図Longitudinal side view showing the second embodiment 製造工程の説明図（その１）Explanatory drawing of the manufacturing process (part 1) 製造工程の説明図（その２）Explanatory drawing of a manufacturing process (the 2) 製造工程の説明図（その３）Explanatory drawing of a manufacturing process (the 3) 第３実施形態を示す縦断側面図Longitudinal side view showing the third embodiment プリント基板の縦断側面図Longitudinal side view of printed circuit board

（第１実施形態）
以下、本発明の第１実施形態について、図１〜図８を参照して説明する。
電子装置の全体構成の断面を示す図１において、筐体１は、上面が開口された矩形容器状をなす樹脂製のもので、内部には２段に凹部１ａ、１ｂが形成される。開口側の凹部１ａの底部に凹部１ａよりも開口が狭い凹部１ｂが設けられている。凹部１ａと凹部１ｂとの間に、プリント基板２を載置可能な段差部が形成される。プリント基板２には、表面２ａに複数の電子部品３が実装され、裏面２ｂに複数の電子部品４が実装されている。プリント基板２は、例えば弾性率が１６ＧＰａ程度の材料で形成されている。 First Embodiment
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 8.
In FIG. 1 showing a cross section of the entire configuration of the electronic device, a housing 1 is made of a rectangular container-like resin whose upper surface is opened, and concave portions 1a and 1b are formed in two steps inside. At the bottom of the recess 1 a on the opening side, a recess 1 b whose opening is narrower than the recess 1 a is provided. A stepped portion on which the printed circuit board 2 can be mounted is formed between the recess 1 a and the recess 1 b. On the printed circuit board 2, a plurality of electronic components 3 are mounted on the front surface 2a, and a plurality of electronic components 4 are mounted on the back surface 2b. The printed circuit board 2 is formed of, for example, a material having an elastic modulus of about 16 GPa.

電子部品３、４は、図１ではそれぞれ１個を代表で示しているが、複数個実装されている。電子部品３、４は、トランジスタ、抵抗、コイル、コンデンサなどの種々の電子部品であり、ここでは、後述するように、それぞれはんだ５、６により面実装されている。プリント基板２は、筐体１の凹部１ａ内に格納され、上面２ａは凹部１ａ内、下面２ｂは凹部１ｂ内にそれぞれ面する状態とされている。   Although each of the electronic components 3 and 4 is shown as a representative in FIG. 1, a plurality of the electronic components 3 and 4 are mounted. The electronic components 3 and 4 are various electronic components such as a transistor, a resistor, a coil, and a capacitor, and are surface-mounted by the solders 5 and 6, respectively, as described later. The printed circuit board 2 is stored in the recess 1 a of the housing 1, and the upper surface 2 a faces the inside of the recess 1 a and the lower surface 2 b faces the inside of the recess 1 b.

筐体１の凹部１ａ内には第１封止部７が充填形成され、凹部１ｂ内には第２封止部８および第３封止部９が形成されている。第１封止部７、第２封止部８、第３封止部９は、エポキシなどの液状樹脂にシリカなどの同じ材料からなるフィラ７ｃ、８ｃ、９ｃをそれぞれに添加材として添加したもので、同一の材料である液状樹脂を充填した状態で硬化させて形成されている。なお、第１封止部７および第３封止部９は後述するように同一の工程で形成される。   The first sealing portion 7 is filled and formed in the recess 1 a of the housing 1, and the second sealing portion 8 and the third sealing portion 9 are formed in the recess 1 b. The first sealing portion 7, the second sealing portion 8 and the third sealing portion 9 are obtained by adding fillers 7c, 8c and 9c made of the same material such as silica to liquid resins such as epoxy as additives. It is formed by curing in the state of being filled with liquid resin which is the same material. The first sealing portion 7 and the third sealing portion 9 are formed in the same step as described later.

第２封止部８は、プリント基板２の裏面２ｂ側の表面に実装された電子部品４を覆うように設けられ、この裏面２ｂに接する部分が、第１樹脂層８ａとして形成され、この第１樹脂層８ａに重なるように第２樹脂層８ｂが形成されている。第１樹脂層８ａにはフィラ８ｃが多く充填され、第２樹脂層８ｂにはフィラ８ｃがほとんど含まれていない。   The second sealing portion 8 is provided to cover the electronic component 4 mounted on the front surface of the printed circuit board 2 on the back surface 2b side, and a portion in contact with the back surface 2b is formed as a first resin layer 8a. The second resin layer 8 b is formed to overlap the first resin layer 8 a. The first resin layer 8a is filled with a large amount of filler 8c, and the second resin layer 8b contains almost no filler 8c.

第１封止部７および第３封止部９は、同じく後述するように、プリント基板２の表面２ａを上にして、筐体１内に載置した状態で液状樹脂を凹部１ａ、１ｂ内に充填して硬化形成している。第１封止部７は、凹部１ａ内に形成され、プリント基板２の表面２ａおよび電子部品３を覆うように第１樹脂層７ａが形成され、この上部に接するように第２樹脂層７ｂが形成されている。第１封止部７に添加されたフィラ７ｃは硬化時に沈降するので、第１樹脂層７ａにはフィラ７ｃが多く充填され、第２樹脂層７ｂにはフィラ７ｃがほとんど含まれていない状態となっている。   As described later, the first sealing portion 7 and the third sealing portion 9 have liquid resin placed in the concave portions 1a and 1b with the front surface 2a of the printed circuit board 2 facing up and placed in the housing 1 Is filled and hardened. The first sealing portion 7 is formed in the recess 1 a, and the first resin layer 7 a is formed to cover the surface 2 a of the printed board 2 and the electronic component 3, and the second resin layer 7 b is in contact with the upper portion. It is formed. Since the filler 7c added to the first sealing portion 7 precipitates at the time of curing, the first resin layer 7a is filled with a large amount of the filler 7c and the second resin layer 7b hardly contains the filler 7c. It has become.

同様に、第３封止部９は、凹部１ｂ内に形成されるが、筐体１の内底面部に第１樹脂層９ａが形成され、この上部に第２樹脂層９ｂが形成されている。第３封止部９に添加されたフィラ９ｃは硬化時に沈降し、凹部１ａ内からはフィラ７ｃがほとんど供給されないので、第１樹脂層９ａにはフィラ９ｃが多く充填され、第２樹脂層９ｂにはフィラ９ｃがほとんど含まれない状態となっている。なお、この状態で、プリント基板２の裏面２ｂおよび電子部品４を覆う部分には、第２封止部８の第１樹脂層８ａが形成されているので、第２樹脂層９ｂは、第２封止部８を除いた領域を充填するように形成されている。   Similarly, although the third sealing portion 9 is formed in the recess 1b, the first resin layer 9a is formed on the inner bottom surface portion of the housing 1, and the second resin layer 9b is formed on the upper portion thereof. . The filler 9c added to the third sealing portion 9 precipitates at the time of curing, and the filler 7c is hardly supplied from the inside of the concave portion 1a. Therefore, the first resin layer 9a is filled with a large amount of the filler 9c, and the second resin layer 9b Is almost free of filler 9c. In this state, since the first resin layer 8a of the second sealing portion 8 is formed on the back surface 2b of the printed circuit board 2 and the portion covering the electronic component 4, the second resin layer 9b It is formed to fill the area excluding the sealing portion 8.

上記構成において、第１封止部７、第２封止部８、第３封止部９においては、それぞれフィラ７ｃ、８ｃ、９ｃが多く含有された部分つまり第１樹脂層７ａ、８ａ、９ａでは、線膨張率αが２０ｐｐｍ以下となっている。これに対して、第２樹脂層７ｂ、８ｂ、９ｂでは、線膨張率αが２０ｐｐｍ以下とならず、２０ｐｐｍを超えて例えば５０ｐｐｍの範囲に及ぶ大きい値となっている。すなわち、フィラ７ｃ、８ｃ、９ｃが含有されているか否かによって線膨張率αの大きさに大きな差が発生する。第２樹脂層７ｂ、８ｂ、９ｂは、樹脂硬化の過程でフィラ７ｃ、８ｃ、９ｃが沈降することで、フィラ７ｃ、８ｃ、９ｃがほとんど含まれない状態となり、線膨張率αが大きくなる傾向にある。   In the above configuration, in the first sealing portion 7, the second sealing portion 8 and the third sealing portion 9, portions in which many fillers 7c, 8c and 9c are contained, that is, the first resin layers 7a, 8a and 9a. Then, the linear expansion coefficient α is 20 ppm or less. On the other hand, in the second resin layers 7b, 8b and 9b, the linear expansion coefficient α is not 20 ppm or less, and is a large value exceeding 20 ppm and extending to, for example, 50 ppm. That is, a large difference occurs in the magnitude of the linear expansion coefficient α depending on whether or not the fillers 7c, 8c, and 9c are contained. In the second resin layers 7b, 8b, 9b, the fillers 7c, 8c, 9c precipitate in the process of resin curing, so that the fillers 7c, 8c, 9c are hardly contained, and the linear expansion coefficient α tends to increase. It is in.

この構成においては、筐体１内におけるプリント基板２は、表面２ａおよび裏面２ｂのそれぞれに実装されている電子部品３、４は、いずれも第１封止部７、第２封止部８の第１樹脂層７ａ、８ａにより覆われた状態に設けられている。つまり、電子部品３、４が実装された部分には、フィラ７ｃ、８ｃが充填された線膨張率αが２０ｐｐｍ以下の第１樹脂層７ａ、８ａが設けられている。   In this configuration, the printed circuit board 2 in the housing 1 has the electronic components 3 and 4 mounted on the front surface 2 a and the back surface 2 b respectively of the first sealing portion 7 and the second sealing portion 8. It is provided in the state covered by the 1st resin layers 7a and 8a. That is, the first resin layers 7a and 8a having a linear expansion coefficient α of 20 ppm or less filled with the fillers 7c and 8c are provided in the parts where the electronic components 3 and 4 are mounted.

図２および図３は、プリント基板２に実装した電子部品３および４の近傍の第１封止部７、第２封止部８について、その構成を断面で模式的に示している。プリント基板２には、表面２ａに電子部品３、裏面２ｂに電子部品４がそれぞれはんだ５、６により面実装されている。この場合、プリント基板２には、表面２ａおよび裏面２ｂに、銅箔などをパターニングして形成したランド５ａ、６ａが電子部品３、４に対応して配置されている。電子部品３および４は、それぞれの電極３ａ、４ａとプリント基板２のランド５ａ、６ａとの間を、はんだ５、６により電気的に接続された状態に実装されている。   2 and 3 schematically show the configuration of the first sealing portion 7 and the second sealing portion 8 in the vicinity of the electronic components 3 and 4 mounted on the printed circuit board 2 in cross section. The electronic component 3 is surface-mounted on the front surface 2 a of the printed circuit board 2 by the solders 5 and 6 on the back surface 2 b. In this case, lands 5 a and 6 a formed by patterning a copper foil or the like on the front surface 2 a and the back surface 2 b are arranged on the front surface 2 a and the back surface 2 b corresponding to the electronic components 3 and 4. The electronic components 3 and 4 are mounted in a state of being electrically connected by the solders 5 and 6 between the respective electrodes 3a and 4a and the lands 5a and 6a of the printed circuit board 2.

図２に示すように、第２封止部８は、プリント基板２の裏面２ｂを上向きに配置し、上から液状樹脂を供給配置して硬化させて形成している。このとき、電子部品４を配置した領域は、後述するように、液状樹脂が流れないように囲いが装着されている。フィラ８ｃを添加した液状樹脂をプリント基板２の裏面２ｂ上に供給配置して硬化する際に、液状樹脂内に包含されている気泡８ｄは上方に浮かびあがり、フィラ８ｃは重力により沈降する傾向にある。   As shown in FIG. 2, the second sealing portion 8 is formed by disposing the back surface 2 b of the printed circuit board 2 upward, supplying the liquid resin from above, and curing it. At this time, in the region where the electronic component 4 is disposed, an enclosure is mounted so that the liquid resin does not flow, as described later. When the liquid resin to which the filler 8c is added is disposed and cured on the back surface 2b of the printed circuit board 2, the bubbles 8d contained in the liquid resin float upward and the filler 8c tends to settle by gravity. is there.

これにより、硬化後の第２封止部８は、気泡８ｄが少なくフィラ８ｃが多く充填された第１樹脂層８ａと、フィラ８ｃが少ない第２樹脂層８ｂとが積層した状態に形成される。この場合、第１樹脂層８ａは、電子部品４およびこれを実装するためのはんだ６を内包した状態に形成されている。   As a result, the cured second sealing portion 8 is formed in a state in which the first resin layer 8a having a small number of air bubbles 8d and being filled with a large amount of fillers 8c and the second resin layer 8b having a small number of fillers 8c are stacked. . In this case, the first resin layer 8a is formed in a state in which the electronic component 4 and the solder 6 for mounting the electronic component 4 are included.

次に、図３に示すように、第１封止部７は、プリント基板２の表面２ａを上向きにして筐体１内に配置し、上から液状樹脂を供給配置して硬化させて形成している。フィラ７ｃを添加した液状樹脂をプリント基板２の裏面２ｂ上に供給配置して硬化させる際に、液状樹脂内に包含されている気泡は上方に浮かびあがり、フィラ７ｃは重力により沈降する。   Next, as shown in FIG. 3, the first sealing portion 7 is disposed in the housing 1 with the surface 2 a of the printed circuit board 2 facing upward, and the liquid resin is supplied from the top and cured to form ing. When the liquid resin to which the filler 7c is added is disposed on the back surface 2b of the printed board 2 and cured, the bubbles contained in the liquid resin float upward and the filler 7c settles by gravity.

これにより、硬化後の第１封止部７は、気泡が少なくフィラ７ｃが多く充填された第１樹脂層７ａと、フィラ７ｃが少ない第２樹脂層７ｂとが積層した状態に形成される。この場合、第１樹脂層７ａは、電子部品３およびこれを実装するためのはんだ５を内包した状態に形成されている。   As a result, the cured first sealing portion 7 is formed in a state in which the first resin layer 7a having a small amount of air bubbles and being filled with a large amount of filler 7c and the second resin layer 7b having a small number of fillers 7c are stacked. In this case, the first resin layer 7a is formed in a state in which the electronic component 3 and the solder 5 for mounting the electronic component 3 are included.

上記のようにプリント基板２の表面２ａおよび裏面２ｂのいずれの電子部品３、４についても、第１樹脂層７ａ、８ａで覆われた状態に設けられるので、熱応力による歪がはんだ５、６に与える影響を低減することができ、この結果、はんだクラック率を低減させて長寿命化を図ることができる構成とすることができる。   As described above, since any of the electronic components 3 and 4 on the front surface 2a and the back surface 2b of the printed circuit board 2 is provided in the state covered with the first resin layers 7a and 8a, the distortion due to the thermal stress becomes solder 5, 6 As a result, the solder crack rate can be reduced to prolong the life of the device.

次に、図４〜図８を参照して本実施形態における電子装置の製造方法について説明する。なお、以下の説明では、樹脂封止の工程を主として述べる。図４は、プリント基板２に電子部品３および４をはんだ５および６により実装した状態を示している。プリント基板２の裏面２ｂを上にして、プリント基板２よりも狭い領域で、すべての電子部品４を含む領域に囲いとなる成形用の枠体１１を配置している。枠体１１は、枠状部材として設けられるもので、プリント基板２の裏面２ｂに密着させるように装着される。   Next, a method of manufacturing an electronic device according to the present embodiment will be described with reference to FIGS. In the following description, the resin sealing step is mainly described. FIG. 4 shows a state in which the electronic components 3 and 4 are mounted on the printed circuit board 2 by the solders 5 and 6. With the back surface 2 b of the printed circuit board 2 upward, the molding frame 11 serving as an enclosure is disposed in an area including all the electronic components 4 in an area narrower than the printed circuit board 2. The frame 11 is provided as a frame-like member, and is mounted so as to be in close contact with the back surface 2 b of the printed circuit board 2.

この後、図５に示すように、プリント基板２の裏面２ｂ上にエポキシ系の液状樹脂を供給配置する。液状樹脂は、枠体１１の高さを超えない量を供給する。液状樹脂にはフィラ８ｃが添加されている。液状樹脂が硬化していく過程で、フィラ８ｃは沈降する傾向にあるので、同一の材料を用いてフィラ８ｃを多く含む第１樹脂層８ａとその上部のフィラ８ｃが少ない第２樹脂層８ｂが積層された第２封止部８が形成される。電子部品４ははんだ６とともにほぼ第１樹脂層８ａに包含された状態に形成される。   Thereafter, as shown in FIG. 5, an epoxy-based liquid resin is supplied and disposed on the back surface 2 b of the printed circuit board 2. The liquid resin supplies an amount not exceeding the height of the frame 11. The filler 8c is added to the liquid resin. Since the filler 8c tends to settle in the process of hardening the liquid resin, the first resin layer 8a containing many fillers 8c using the same material and the second resin layer 8b containing few fillers 8c on the upper part thereof are used. The stacked second sealing portion 8 is formed. The electronic component 4 is formed together with the solder 6 substantially in a state included in the first resin layer 8 a.

次に、図６に示すように、プリント基板２の裏面２ｂに装着した枠体１１を取り外し、形成された第２封止部８を裏面２ｂ上に残した状態とする。
続いて、図７に示すように、プリント基板２の表面２ａを上に向けた状態で、筐体１内に収容する。プリント基板２の表面２ａが凹部１ａ内に上向きに配置され、裏面２が凹部１ｂ内に下向きに配置された状態となる。 Next, as shown in FIG. 6, the frame 11 attached to the back surface 2b of the printed circuit board 2 is removed, and the formed second sealing portion 8 is left on the back surface 2b.
Subsequently, as shown in FIG. 7, the printed circuit board 2 is accommodated in the housing 1 with the surface 2 a of the printed circuit board 2 facing upward. The front surface 2a of the printed circuit board 2 is disposed upward in the recess 1a, and the back surface 2 is disposed downward in the recess 1b.

次に、図８に示すように、筐体１の凹部１ａ、１ｂ内に液状樹脂を供給する。このとき、凹部１ｂには図示しない隙間を介して凹部１ａから液状樹脂が流入して充填される。この場合、液状樹脂が硬化する過程で、凹部１ａ側のフィラ７ｃは凹部１ａ内で沈降するが、凹部１ｂ側に移動する量は少ない。   Next, as shown in FIG. 8, the liquid resin is supplied into the concave portions 1 a and 1 b of the housing 1. At this time, the liquid resin flows from the concave portion 1a into the concave portion 1b through the gap (not shown) and is filled. In this case, in the process of curing the liquid resin, the filler 7c on the side of the recess 1a settles in the recess 1a, but the amount of movement to the side of the recess 1b is small.

この結果、凹部１ｂ内では、プリント基板２の裏面２ｂに近い部分ではフィラ９ｃが沈降により少なくなり、凹部１ｂ底面側に移動した状態となる。これにより、筐体１の凹部１ａ内に第１封止部７が形成される。また、筐体１の凹部１ｂ内に第２封止部８を包囲するように第３封止部９が形成される。   As a result, in the recess 1 b, the filler 9 c is reduced by sedimentation in a portion close to the back surface 2 b of the printed circuit board 2, and the filler 9 c is moved to the bottom surface of the recess 1 b. Thereby, the first sealing portion 7 is formed in the concave portion 1 a of the housing 1. In addition, the third sealing portion 9 is formed in the recess 1 b of the housing 1 so as to surround the second sealing portion 8.

このような第１実施形態によれば、プリント基板２の表面２ａ、裏面２ｂのそれぞれに電子部品３、４を実装したものに対して、電子部品３を含んだ部分にフィラ７ｃを沈降させた第１樹脂層７ａを有する第１封止部７を設け、電子部品４を含んだ部分にフィラ８ｃを沈降させた第１樹脂層８ａを有する第２封止部８を設ける構成とした。   According to the first embodiment, the filler 7c is made to settle in the portion including the electronic component 3 with respect to the electronic components 3 and 4 mounted on the front surface 2a and the back surface 2b of the printed circuit board 2, respectively. The first sealing portion 7 having the first resin layer 7a is provided, and the second sealing portion 8 having the first resin layer 8a in which the filler 8c is precipitated is provided in the portion including the electronic component 4.

これにより、電子部品３、４を実装するはんだ５、６の部分に線膨張率αが小さい第１樹脂層７ａ、８ａを設けることで、プリント基板２の両面において、実装している電子部品３、４のはんだクラック率の低減を抑制でき、長寿命化を図ることができる。   Thereby, the electronic parts 3 mounted on both sides of the printed circuit board 2 are provided by providing the first resin layers 7a and 8a having a small linear expansion coefficient α in the portions of the solders 5 and 6 on which the electronic parts 3 and 4 are mounted. The reduction of the solder crack rate can be suppressed, and the life can be extended.

また、プリント基板２の裏面２ｂ側に第２封止部８を予め形成するので、プリント基板２を筐体１内に配置して液状樹脂で封止を行う際に、凹部１ｂ側でフィラ９ｃが沈降しても電子部品４のはんだ６の部分は、第２封止部８の第１樹脂層８ａを確保できる。   In addition, since the second sealing portion 8 is formed in advance on the back surface 2b side of the printed circuit board 2, when the printed circuit board 2 is disposed in the housing 1 and sealed with liquid resin, the filler 9c is formed on the recessed portion 1b side. Even if the solder settles, the portion of the solder 6 of the electronic component 4 can secure the first resin layer 8 a of the second sealing portion 8.

（第２実施形態）
図９から図１２は第２実施形態を示すもので、以下、第１実施形態と異なる部分について説明する。図９に示すように、この実施形態では、第１実施形態の構成に加えて、プリント基板２の裏面２ｂに設けた第２封止部８の側面周囲を囲うように枠体１２を接着固定した構成としている。第３封止部９は、第２封止部８および枠体１２を包囲するように一体に形成されている。枠体１２は、枠状部材として設けられるものである。 Second Embodiment
FIGS. 9 to 12 show a second embodiment, and in the following, parts different from the first embodiment will be described. As shown in FIG. 9, in this embodiment, in addition to the configuration of the first embodiment, the frame 12 is adhesively fixed so as to surround the side periphery of the second sealing portion 8 provided on the back surface 2b of the printed circuit board 2. The configuration is The third sealing portion 9 is integrally formed so as to surround the second sealing portion 8 and the frame 12. The frame 12 is provided as a frame-like member.

図１０から図１２は製造工程を示すもので、以下簡単に説明する。図１０に示すように、プリント基板２は、電子部品３および４をはんだ５および６により実装した状態を示している。プリント基板２の裏面２ｂを上にして、プリント基板２よりも狭い領域で、すべての電子部品４を含む領域に囲いとなる枠体１２が接着固定されている。枠体１２は、例えば第１封止部７、第２封止部８、第３封止部９の線膨張率αを考慮して同程度の線膨張率αを有する樹脂製の材料を使用しており、プリント基板２の裏面２ｂに密着させ、内部に封止樹脂８を充填形成する高さに対応した高さに接着されている。   10 to 12 show the manufacturing process, which will be briefly described below. As shown in FIG. 10, the printed circuit board 2 shows a state in which the electronic components 3 and 4 are mounted by the solders 5 and 6. With the back surface 2b of the printed circuit board 2 up, the frame 12 as an enclosure is adhesively fixed to the area including all the electronic components 4 in the area narrower than the printed circuit board 2. The frame body 12 is made of, for example, a resin material having a linear expansion coefficient α of about the same in consideration of the linear expansion coefficient α of the first sealing unit 7, the second sealing unit 8, and the third sealing unit 9. It is in close contact with the back surface 2b of the printed circuit board 2 and is bonded at a height corresponding to the height at which the sealing resin 8 is filled and formed inside.

次に、図１１に示すように、プリント基板２の裏面２ｂ上にエポキシ系の液状樹脂を供給配置する。液状樹脂は、枠体１２の高さを超えない量を供給する。液状樹脂にはフィラ８ｃが添加されている。液状樹脂が硬化していく過程で、フィラ８ｃは沈降する傾向にあるので、フィラ８ｃを多く含む第１樹脂層８ａとその上部のフィラ８ｃが少ない第２樹脂層８ｂが積層された第２封止部８が形成される。電子部品４ははんだ６とともにほぼ第１樹脂層８ａに包含された状態に形成される。なお、この実施形態では、プリント基板２の裏面２ｂに装着した枠体１２はそのまま残した状態とする。   Next, as shown in FIG. 11, an epoxy-based liquid resin is supplied and disposed on the back surface 2 b of the printed circuit board 2. The liquid resin supplies an amount not exceeding the height of the frame 12. The filler 8c is added to the liquid resin. Since the filler 8c tends to settle in the process of curing the liquid resin, the second seal is formed by laminating the first resin layer 8a containing a large amount of filler 8c and the second resin layer 8b with a small amount of filler 8c on the upper side. Stop 8 is formed. The electronic component 4 is formed together with the solder 6 substantially in a state included in the first resin layer 8 a. In this embodiment, the frame 12 mounted on the back surface 2b of the printed circuit board 2 is left as it is.

続いて、図１２に示すように、プリント基板２の表面２ａを上に向けた状態で、筐体１内に収容する。プリント基板２の表面２ａが凹部１ａ内に上向きに配置され、裏面２が凹部１ｂ内に下向きに配置された状態となる。この状態で、筐体１の凹部１ａ、１ｂ内に液状樹脂を供給し、第１実施形態と同様にして第１封止部７および第３封止部９を形成する。この結果、図９に示した構成の電子装置が形成される。   Subsequently, as shown in FIG. 12, the printed circuit board 2 is accommodated in the housing 1 with the surface 2 a of the printed circuit board 2 facing upward. The front surface 2a of the printed circuit board 2 is disposed upward in the recess 1a, and the back surface 2 is disposed downward in the recess 1b. In this state, liquid resin is supplied into the concave portions 1a and 1b of the housing 1 to form the first sealing portion 7 and the third sealing portion 9 in the same manner as in the first embodiment. As a result, the electronic device having the configuration shown in FIG. 9 is formed.

このような第２実施形態によっても、第１実施形態と同様の効果を得ることができる。なお、この実施形態では、枠体１２をプリント基板２に装着したまま第１封止部７および第３封止部９を形成するので、枠体１２を取り外す手間を省くことができる。   Also by such a second embodiment, the same effect as that of the first embodiment can be obtained. In this embodiment, since the first sealing portion 7 and the third sealing portion 9 are formed while the frame 12 is mounted on the printed circuit board 2, it is possible to save the trouble of removing the frame 12.

（第３実施形態）
図１３および図１４は第３実施形態を示すもので、以下、第１実施形態と異なる部分について説明する。この実施形態では、プリント基板２に代えて、プリント基板２０を用いる構成としている。 Third Embodiment
13 and 14 show a third embodiment, and in the following, parts different from the first embodiment will be described. In this embodiment, a printed board 20 is used instead of the printed board 2.

全体の構成としては、図１３に示すように、プリント基板２０を用いる構成としたことを除くと、第１実施形態の構成とほぼ同じである。プリント基板２０は、図１４にも断面で示すように、基材２１、２２、２３を有する三層構造となっている。   The overall configuration is substantially the same as the configuration of the first embodiment except that the printed circuit board 20 is used as shown in FIG. The printed circuit board 20 has a three-layer structure having substrates 21, 22, and 23, as shown in cross section in FIG.

基材２１は、プリント基板２０のコア層を構成するもので、例えば弾性率が１６ＧＰａ程度のものを用いている。この場合、基材２１は、第１実施形態で使用したプリント基板２とほぼ同じ材料を用いている。基材２２、２３は、基材２１の両面に貼り合わせるように設けられた層で、弾性率が基材２１よりも小さく、５〜１５ＧＰａ程度のものを用いている。   The base material 21 constitutes the core layer of the printed circuit board 20, and for example, one having an elastic modulus of about 16 GPa is used. In this case, the substrate 21 uses substantially the same material as the printed circuit board 2 used in the first embodiment. The substrates 22 and 23 are layers provided to be bonded to both surfaces of the substrate 21 and have a smaller elastic modulus than the substrate 21 and use about 5 to 15 GPa.

上記のようなプリント基板２０を用いることで、プリント基板２０に実装した電子部品３、４について、はんだ５、６に対する封止樹脂７、８からの応力を受けたときに、基材２２、２３が、従来相当のプリント基板２の弾性率である１６ＧＰａのものよりも小さい弾性率５〜１５ＧＰａ程度の範囲に設定されているので、はんだ５、６への応力を緩和することができる。これによって、さらにはんだクラック率を低減して長寿命化を図ることができるようになる。   By using the printed circuit board 20 as described above, when the electronic components 3 and 4 mounted on the printed circuit board 20 are subjected to stress from the sealing resins 7 and 8 with respect to the solders 5 and 6, the substrates 22 and 23 can be obtained. However, since the elastic modulus is set in the range of about 5 to 15 GPa which is smaller than that of 16 GPa which is the elastic modulus of the printed board 2 corresponding to the conventional one, the stress on the solders 5 and 6 can be relaxed. By this, it is possible to further reduce the solder crack rate and to prolong the life.

（他の実施形態）
なお、本発明は、上述した実施形態のみに限定されるものではなく、その要旨を逸脱しない範囲で種々の実施形態に適用可能であり、例えば、以下のように変形または拡張することができる。 (Other embodiments)
The present invention is not limited to the above-described embodiment, and can be applied to various embodiments without departing from the scope of the present invention. For example, the present invention can be modified or expanded as follows.

上記各実施形態においては、筐体１の凹部１ａ、１ｂを上面に向けた状態を基準としてプリント基板２、２０の表面２ａ、２０ａ、裏面２ｂ、２０ｂを規定したが、電子装置として筐体１を図１のように配置して使用することを前提とするものではなく、適宜の配置状態を適用することができる。   In the above embodiments, the front surfaces 2a and 20a and the back surfaces 2b and 20b of the printed circuit boards 2 and 20 are defined on the basis of the state in which the concave portions 1a and 1b of the housing 1 face the upper surface. It is not premised to arrange and use as shown in FIG. 1, and appropriate arrangement can be applied.

第１実施形態で示した枠体１１や第２実施形態で示した枠体１２は、プリント基板２の裏面２ｂに配置して第２封止部８を形成することができれば、適宜の形状のものを使用することができる。
第３実施形態で使用したプリント基板２０は、第２実施形態においてもプリント基板２に代えて使用することができる。 The frame 11 shown in the first embodiment and the frame 12 shown in the second embodiment can be appropriately shaped as long as they can be disposed on the back surface 2 b of the printed circuit board 2 to form the second sealing portion 8. Can be used.
The printed circuit board 20 used in the third embodiment can be used instead of the printed circuit board 2 also in the second embodiment.

本開示は、実施例に準拠して記述されたが、本開示は当該実施例や構造に限定されるものではないと理解される。本開示は、様々な変形例や均等範囲内の変形をも包含する。加えて、様々な組み合わせや形態、さらには、それらに一要素のみ、それ以上、あるいはそれ以下、を含む他の組み合わせや形態をも、本開示の範疇や思想範囲に入るものである。   Although the present disclosure has been described based on the examples, it is understood that the present disclosure is not limited to the examples and structures. The present disclosure also includes various modifications and variations within the equivalent range. In addition, various combinations and forms, and further, other combinations and forms including only one element, or more or less than these elements are also within the scope and the scope of the present disclosure.

図面中、１は筐体、１ａ、１ｂは凹部、２、２０はプリント基板、３、４は電子部品、５、６ははんだ、７は第１封止部、８は第２封止部、９は第３封止部、７ａ、８ａ、９ａは第１樹脂層、７ｂ、８ｂ、９ｂは第２樹脂層、７ｃ、８ｃ、９ｃはフィラ（添加材）、１１、１２は枠体（枠状部材）、２１、２２、２３は基材である。   In the drawings, 1 is a housing, 1a and 1b are recesses, 2 and 20 are printed boards, 3 and 4 are electronic components, 5 and 6 are solders, 7 is a first sealing portion, 8 is a second sealing portion, 9 is a third sealing portion, 7a, 8a, 9a is a first resin layer, 7b, 8b, 9b is a second resin layer, 7c, 8c, 9c are fillers (additives), 11 and 12 are frames (frame Members 21, 22, 23 are base materials.

Claims (9)

電子部品（３、４）がはんだ（５、６）を用いて実装されたプリント基板（２、２０）と、
前記プリント基板が格納される筐体（１）と、
前記筐体内に形成され、前記プリント基板の両面に前記電子部品を含む部分を覆う第１樹脂層（７ａ、８ａ）および前記第１樹脂層に接する第２樹脂層（７ｂ、８ｂ）を有する第１封止部（７）および第２封止部（８）とを備え、
前記第１および第２封止部は、添加材（７ｃ、８ｃ）の沈降により、前記第１樹脂層の線膨張率が、前記第２樹脂層の線膨張率よりも小さくなるように形成されている電子装置。 A printed circuit board (2, 20) on which electronic components (3, 4) are mounted using solder (5, 6);
A housing (1) in which the printed circuit board is stored;
A first resin layer (7a, 8a) formed in the housing and covering a portion including the electronic component on both surfaces of the printed circuit board, and a second resin layer (7b, 8b) in contact with the first resin layer A first sealing portion (7) and a second sealing portion (8),
The first and second sealing portions are formed such that the linear expansion coefficient of the first resin layer is smaller than the linear expansion coefficient of the second resin layer by the sedimentation of the additive (7c, 8c). Electronic devices. 前記第１樹脂層は、線膨張率が２０ｐｐｍ以下に設定されている請求項１に記載の電子装置。   The electronic device according to claim 1, wherein a linear expansion coefficient of the first resin layer is set to 20 ppm or less. 前記第１樹脂層と前記第２樹脂層とは、同一の材料から成る請求項１または２に記載の電子装置。   The electronic device according to claim 1, wherein the first resin layer and the second resin layer are made of the same material. 前記プリント基板（２０）は、基材の弾性率が５〜１５ＧＰａの範囲に設定されている請求項１から３のいずれか一項に記載の電子装置。   The electronic device according to any one of claims 1 to 3, wherein the elastic modulus of the base material of the printed circuit board (20) is set in a range of 5 to 15 GPa. 前記プリント基板の一方の面には、前記電子部品を囲む枠状部材（１２）が設けられている請求項１から４のいずれか一項に記載の電子装置。   The electronic device according to any one of claims 1 to 4, wherein a frame-like member (12) surrounding the electronic component is provided on one surface of the printed circuit board. 電子部品（３、４）がはんだ（５、６）を用いて実装されたプリント基板（２、２０）を筐体内に格納し、前記プリント基板を封止部で覆うように形成する電子装置の製造方法において、
前記プリント基板の一方の面に、前記電子部品を覆う高さで液状樹脂を充填し、前記液状樹脂を硬化させて下層に第１樹脂層（８ａ）およびその上層に第２樹脂層（８ｂ）を有する第２封止部（８）を形成する過程と、
前記プリント基板を、前記第２封止部を下側に向けて前記筐体内に組み付ける過程と、
前記筐体内に液状樹脂を充填し、前記液状樹脂を硬化させて前記プリント基板の他方の面と接する第１樹脂層（７ａ）および前記第１樹脂層に積層される第２樹脂層（７ｂ）を有する第１封止部（７）を形成するとともに、前記プリント基板の一方の面に形成された前記第２封止部を覆うように第３封止部（９）を形成する過程とを備え、
前記第１および第２封止部の前記第１樹脂層の線膨張率は、添加材の沈降により、前記第２樹脂層の線膨張率よりも小さくなるように形成される電子装置の製造方法。 An electronic device for storing a printed circuit board (2, 20) on which an electronic component (3, 4) is mounted using a solder (5, 6) in a casing and covering the printed circuit board with a sealing portion In the manufacturing method,
A liquid resin is filled on one side of the printed board at a height covering the electronic component, and the liquid resin is cured to form a first resin layer (8a) in the lower layer and a second resin layer (8b) in the upper layer thereof. Forming a second sealing portion (8) having
Assembling the printed circuit board in the housing with the second sealing portion facing downward;
A liquid resin is filled in the case, the liquid resin is cured, and a first resin layer (7a) in contact with the other surface of the printed circuit board and a second resin layer (7b) laminated on the first resin layer Forming a third sealing portion (9) so as to cover the second sealing portion formed on one surface of the printed board while forming the first sealing portion (7) having the Equipped
A method of manufacturing an electronic device, wherein the linear expansion coefficient of the first resin layer of the first and second sealing portions is smaller than the linear expansion coefficient of the second resin layer due to the sedimentation of the additive. . 前記第１封止部および前記第２封止部の前記第１樹脂層の線膨張率は、いずれも２０ｐｐｍ以下となるように形成する請求項６に記載の電子装置の製造方法。   The manufacturing method of the electronic device of Claim 6 formed so that the linear expansion coefficient of the said 1st resin layer of the said 1st sealing part and the said 2nd sealing part may become 20 ppm or less in all. 前記第１樹脂層と前記第２樹脂層とは、同一の材料から成る請求項６または７に記載の電子装置の製造方法。   The method according to claim 6, wherein the first resin layer and the second resin layer are made of the same material. 前記第２封止部を形成する過程に先立って、前記プリント基板の一方の面に前記電子部品を囲む枠状部材（１１、１２）を設ける過程を設けた請求項６から８のいずれか一項に記載の電子装置の製造方法。   The process according to any one of claims 6 to 8, further comprising the step of providing a frame member (11, 12) surrounding the electronic component on one surface of the printed circuit board prior to the step of forming the second sealing portion. The manufacturing method of the electronic device as described in a term.
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