JPS6428998A - Manufacture of electromagnetic wave shield molding - Google Patents

Manufacture of electromagnetic wave shield molding

Info

Publication number
JPS6428998A
JPS6428998A JP18609287A JP18609287A JPS6428998A JP S6428998 A JPS6428998 A JP S6428998A JP 18609287 A JP18609287 A JP 18609287A JP 18609287 A JP18609287 A JP 18609287A JP S6428998 A JPS6428998 A JP S6428998A
Authority
JP
Japan
Prior art keywords
film
housing
conductive layer
electromagnetic wave
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18609287A
Other languages
Japanese (ja)
Other versions
JPH0557758B2 (en
Inventor
Shinichi Wakita
Fumio Nakaya
Hisatoshi Murakami
Tsunehiko Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP18609287A priority Critical patent/JPS6428998A/en
Publication of JPS6428998A publication Critical patent/JPS6428998A/en
Publication of JPH0557758B2 publication Critical patent/JPH0557758B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0011—Electromagnetic wave shielding material

Abstract

PURPOSE:To form a uniform thickness of a film and to obtain a sufficient electromagnetic shielding effect by so mounting a film in a metal mold as to direct a conductive layer toward a molding plastic and injection molding the plastic. CONSTITUTION:An electromagnetic wave shielding layer 6 is formed by thermally transferring a conductive layer obtained by coating by a printing method conductive paste on a film and thermally curing it to the whole inner surface of the housing 4 from the film in case of injection molding the housing 4, and formed of one bottom portion 6a and 4 side faces 6b corresponding to one upper bottom plate 4a and 4 side plates 4b of the housing 4, respectively. The coated paste is heated together with a film 8, for example, at 130-180 deg.C for 10-60 min, to be thermally cured. When conductive copper paste is used, a conductive layer 5 having uniform film quantity and thickness and 10<-4>-10<-5>OMEGA.cm of volumetric intrinsic resistivity is obtained.
JP18609287A 1987-07-24 1987-07-24 Manufacture of electromagnetic wave shield molding Granted JPS6428998A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18609287A JPS6428998A (en) 1987-07-24 1987-07-24 Manufacture of electromagnetic wave shield molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18609287A JPS6428998A (en) 1987-07-24 1987-07-24 Manufacture of electromagnetic wave shield molding

Publications (2)

Publication Number Publication Date
JPS6428998A true JPS6428998A (en) 1989-01-31
JPH0557758B2 JPH0557758B2 (en) 1993-08-24

Family

ID=16182227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18609287A Granted JPS6428998A (en) 1987-07-24 1987-07-24 Manufacture of electromagnetic wave shield molding

Country Status (1)

Country Link
JP (1) JPS6428998A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03230918A (en) * 1990-02-04 1991-10-14 Kooki Eng:Kk Manufacture of metallic foil-plastic composite injection molding and its product
WO2005051062A1 (en) * 2003-11-19 2005-06-02 Joinset Co., Ltd. Multi-functional metal shield case and method for making the same
JP2009107136A (en) * 2007-10-26 2009-05-21 Yuri Kagi Kofun Yugenkoshi In-mold film
EP2106895A1 (en) * 2008-04-02 2009-10-07 Pegatron Corporation Case of electronic device and method for manufacturing the same
JP2017191829A (en) * 2016-04-12 2017-10-19 凸版印刷株式会社 Shield molding and method of manufacturing the same
WO2019203159A1 (en) * 2018-04-19 2019-10-24 東洋インキＳｃホールディングス株式会社 Conductive composition for molded film, molded film, molded article, and method for production thereof
US10486347B2 (en) 2014-11-14 2019-11-26 Toyota Jidosha Kabushiki Kaisha Method of manufacturing electromagnetic wave shield housing

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5956797U (en) * 1982-10-07 1984-04-13 東芝ケミカル株式会社 Electromagnetic shield case
JPS61225900A (en) * 1985-03-29 1986-10-07 大日本印刷株式会社 Transfer sheet for shielding electromagnetic wave

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5956797U (en) * 1982-10-07 1984-04-13 東芝ケミカル株式会社 Electromagnetic shield case
JPS61225900A (en) * 1985-03-29 1986-10-07 大日本印刷株式会社 Transfer sheet for shielding electromagnetic wave

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03230918A (en) * 1990-02-04 1991-10-14 Kooki Eng:Kk Manufacture of metallic foil-plastic composite injection molding and its product
WO2005051062A1 (en) * 2003-11-19 2005-06-02 Joinset Co., Ltd. Multi-functional metal shield case and method for making the same
JP2009107136A (en) * 2007-10-26 2009-05-21 Yuri Kagi Kofun Yugenkoshi In-mold film
EP2106895A1 (en) * 2008-04-02 2009-10-07 Pegatron Corporation Case of electronic device and method for manufacturing the same
US10486347B2 (en) 2014-11-14 2019-11-26 Toyota Jidosha Kabushiki Kaisha Method of manufacturing electromagnetic wave shield housing
JP2017191829A (en) * 2016-04-12 2017-10-19 凸版印刷株式会社 Shield molding and method of manufacturing the same
WO2019203159A1 (en) * 2018-04-19 2019-10-24 東洋インキＳｃホールディングス株式会社 Conductive composition for molded film, molded film, molded article, and method for production thereof
JP2019189680A (en) * 2018-04-19 2019-10-31 東洋インキＳｃホールディングス株式会社 Conductive composition for molding film, molding film, molded body, and manufacturing method therefor

Also Published As

Publication number Publication date
JPH0557758B2 (en) 1993-08-24

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees