JPS6481392A - Injection molding of printed circuit board - Google Patents
Injection molding of printed circuit boardInfo
- Publication number
- JPS6481392A JPS6481392A JP23919887A JP23919887A JPS6481392A JP S6481392 A JPS6481392 A JP S6481392A JP 23919887 A JP23919887 A JP 23919887A JP 23919887 A JP23919887 A JP 23919887A JP S6481392 A JPS6481392 A JP S6481392A
- Authority
- JP
- Japan
- Prior art keywords
- film
- board
- cavity
- circuit
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To simplify and enhance the efficiency of the steps of manufacturing a printed circuit board by so disposing a circuit film in a board cavity that its carrier film face is at the side of the cavity, and forming a circuit simultane ously upon injection molding of the board. CONSTITUTION:In a circuit film 30, a circuit pattern 31 made of a copper foil by depositing or a plating method is formed on the surface of a carrier film 32. A masking section 33 and adhesive layers 34, 35 are melted by the heat at the time of molding the board. The film 30 is so disposed in a board cavity 10 that the face of the film 32 is at the side of the cavity. Melted resin P for forming the board is poured in the cavity 10, the film 32 of the film 30 is inte grally adhered to the melted resin, and a board is molded. The film 32 of the film 30 is pressed from its back face to densely press the pattern 31 to a cavity plate 13, and the surface of the board is formed in the same plane with the board resin P.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23919887A JPS6481392A (en) | 1987-09-24 | 1987-09-24 | Injection molding of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23919887A JPS6481392A (en) | 1987-09-24 | 1987-09-24 | Injection molding of printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6481392A true JPS6481392A (en) | 1989-03-27 |
JPH0563111B2 JPH0563111B2 (en) | 1993-09-09 |
Family
ID=17041185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23919887A Granted JPS6481392A (en) | 1987-09-24 | 1987-09-24 | Injection molding of printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6481392A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04206989A (en) * | 1990-11-30 | 1992-07-28 | Nitto Boseki Co Ltd | Printed wiring and manufacture thereof |
GB2340666A (en) * | 1998-08-17 | 2000-02-23 | Ford Motor Co | Method of laminating a flexible circuit to a substrate. |
-
1987
- 1987-09-24 JP JP23919887A patent/JPS6481392A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04206989A (en) * | 1990-11-30 | 1992-07-28 | Nitto Boseki Co Ltd | Printed wiring and manufacture thereof |
GB2340666A (en) * | 1998-08-17 | 2000-02-23 | Ford Motor Co | Method of laminating a flexible circuit to a substrate. |
US6197145B1 (en) | 1998-08-17 | 2001-03-06 | Ford Motor Company | Method of laminating a flexible circuit to a substrate |
GB2340666B (en) * | 1998-08-17 | 2003-10-29 | Ford Motor Co | Method of laminating a flexible circuit to substrate |
Also Published As
Publication number | Publication date |
---|---|
JPH0563111B2 (en) | 1993-09-09 |
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