JPH0194691A - Printed circuit board and manufacture thereof - Google Patents
Printed circuit board and manufacture thereofInfo
- Publication number
- JPH0194691A JPH0194691A JP25222887A JP25222887A JPH0194691A JP H0194691 A JPH0194691 A JP H0194691A JP 25222887 A JP25222887 A JP 25222887A JP 25222887 A JP25222887 A JP 25222887A JP H0194691 A JPH0194691 A JP H0194691A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit
- cavity
- resin
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- 238000001746 injection moulding Methods 0.000 claims abstract description 19
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 8
- 239000000057 synthetic resin Substances 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920006269 PPS film Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】 (産業上の利用分野) この発明はプリント回路基板およびその製法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a printed circuit board and its manufacturing method.
(従来の技術)
従来のプリント回路基板の製法としては、例えば銅板と
基板材をホットプレスで積層した後この銅板面をエツチ
ングによって回路パターンに加工する方法や、あるいは
基板材に導電性インクをス・クリーン印刷したり無電解
メツキによって回路パターンを形成する方法が多用され
ている。(Prior art) Conventional methods for manufacturing printed circuit boards include, for example, laminating a copper plate and a board material using hot pressing, and then etching the surface of the copper plate to form a circuit pattern, or printing conductive ink on the board material. - Methods of forming circuit patterns by clean printing or electroless plating are often used.
近年、基板の素材として、従来のガラスエポキシ等に代
って、耐熱性および電気特性に優れたポリサルフォン、
ポリエーテルサルフォン、ポリエーテルイミド等の熱可
塑性樹脂が出現し、この熱可塑性樹脂によっ−て基板本
体を射出成形する試みが行なわれている。この射出成形
による基板本体の成形にあっては、該素材樹脂が有する
耐熱性および誘電率、誘電正接等の電気特性の向上に加
えて、基板形状、透孔および取付部等の付加形状を一体
に成形でき、従来のような爾後の切削やプレス等の後加
工が不要になるという大きな利点を有している。この射
出成形によって得られた基板本体は前述した印刷または
メツキ等の手段によってその表面に回路パターンが形成
される。In recent years, polysulfone, which has excellent heat resistance and electrical properties, has been used as a material for substrates, replacing conventional glass epoxy.
Thermoplastic resins such as polyether sulfone and polyetherimide have appeared, and attempts have been made to injection mold substrate bodies using these thermoplastic resins. In molding the board body by injection molding, in addition to improving the electrical properties of the resin material such as heat resistance, dielectric constant, and dielectric loss tangent, the shape of the board and additional shapes such as through holes and mounting parts are integrated. It has the great advantage of eliminating the need for post-processing such as cutting and pressing as required in the past. A circuit pattern is formed on the surface of the substrate body obtained by injection molding by the above-described printing or plating method.
(発明が解決しようとする問題点)
この発明は、上述の従来技術を背景として、基板の射出
成形時に、回路部も一体に成形すること、さらに詳しく
言えば基板の両面側に回路部を一体に成形したプリント
回路基板およびその製法を提案するものであ・る。(Problems to be Solved by the Invention) Based on the background of the above-mentioned prior art, the present invention aims at integrally molding the circuit parts during injection molding of the board, and more specifically, by integrally molding the circuit parts on both sides of the board. This paper proposes a molded printed circuit board and its manufacturing method.
すなわち、上述した従来技術にあっては、基板の射出成
形後に1回路部の形成工程を必要とするのであるが、こ
の発明では、基板の射出成形と同時に当該基板の両面に
回路部を形成することによって、この種のプリント回路
基板の製造工程を飛躍的に簡略化し、かつ効率化しよう
とするものである。That is, while the above-mentioned conventional technology requires a step of forming one circuit section after the injection molding of the substrate, in the present invention, the circuit sections are formed on both sides of the substrate at the same time as the injection molding of the substrate. This is intended to dramatically simplify and improve the efficiency of the manufacturing process for this type of printed circuit board.
(問題点を解決するための手段)
すなわち、この発明に係るプリント回路基板は、プリン
ト回路を構成する電導体よりなる回路パターンを表面に
接着した合成樹脂のキャリアフィルムが、樹脂基板の表
裏両表面に該基板の射出成形による賦形時に一体に接合
されていることを特徴とする。(Means for Solving the Problems) That is, in the printed circuit board according to the present invention, a synthetic resin carrier film on which a circuit pattern made of an electrical conductor constituting a printed circuit is bonded is attached to both the front and back surfaces of the resin board. It is characterized in that the substrate is integrally joined when the substrate is formed by injection molding.
また、この発明のプリント回路基板の製法は、基板形状
を有するキャビティの基板表面側位置および基板裏面側
位置に、合成樹脂のキャリアフィルム表面にプリント回
路を構成する電導体よりなる回路パターンを形成した回
路フィルムを、前記キャリアフィルム面がキャビティ側
となるように配した後、該キャビティ内に基板を構成す
る溶融樹脂を注入し前記キャリアフィルムと当該溶融樹
脂とを一体に接合しつつ基板を成形することを特徴とす
る方法に係る。In addition, the method for manufacturing a printed circuit board of the present invention includes forming a circuit pattern made of conductors constituting a printed circuit on the surface of a carrier film made of synthetic resin at a position on the front side of the board and at a position on the back side of the board of the cavity having the shape of the board. After arranging the circuit film so that the surface of the carrier film faces the cavity, a molten resin constituting the substrate is injected into the cavity, and the carrier film and the molten resin are integrally joined and the substrate is formed. The present invention relates to a method characterized in that:
(作用)
この発明では、あらかじめ合成樹脂のキャリアフィルム
にプリント回路を構成する電導体よりなる回路パターン
が形成された表面測用回路フィルムおよび裏面側用回路
フィルムが用意される。そして、基板の射出成形時に、
表面測用回路フィルムをキャビティの基板表面側位置に
、また裏面側用回路フィルムを同じくキャビティの基板
裏面側位置にそれらのキャリアフィルム面がキャビティ
側となるように配する。そして型締め後、基板を構成す
る溶融樹脂を該キャビティ内に注入する。(Function) In the present invention, a front side circuit film and a back side circuit film are prepared in which a circuit pattern made of conductors constituting a printed circuit is formed on a synthetic resin carrier film in advance. Then, during injection molding of the board,
The circuit film for the front side is placed on the front side of the substrate in the cavity, and the circuit film for the back side is placed on the back side of the substrate in the cavity so that their carrier film surfaces face the cavity side. After the mold is clamped, molten resin constituting the substrate is injected into the cavity.
キャビティに注入された溶融樹脂は前記各回路フィルム
のキャリアフィルムと一体に接合しつつ基板形状に賦形
され1表裏面に所定の回路パターンを有するプリント基
板が得られる。The molten resin injected into the cavity is formed into a substrate shape while being integrally joined with the carrier film of each of the circuit films, thereby obtaining a printed circuit board having a predetermined circuit pattern on both front and back surfaces.
なお、キャリアフィルムが基板を構成する樹脂と同種か
または相溶性のある樹脂からなる場合には、両者の接合
は融合状態となって極めて強固となる。Note that when the carrier film is made of the same type of resin or a resin that is compatible with the resin constituting the substrate, the bonding between the two becomes a fused state and becomes extremely strong.
(実施例) 以下添付の図面に従って実施例を説明する。(Example) Embodiments will be described below with reference to the accompanying drawings.
添付の図面の第1図はこの発明方法を実施する射出成形
装置の一例を示す要部の断面図、第2図は回路フィルム
の一例を示す一部拡大断面図、第3図は同じく回路フィ
ルムの他の例を示す一部拡大断面図、第4図は成形前の
状態を示す金型の一部拡大断面図、第5図はその成形時
の一部拡大断面図、第6図はこの発明によって得られた
プリント回路基板の部分拡大断面図である。Figure 1 of the accompanying drawings is a cross-sectional view of essential parts showing an example of an injection molding apparatus for carrying out the method of the present invention, Figure 2 is a partially enlarged cross-sectional view showing an example of a circuit film, and Figure 3 is a similar circuit film. Fig. 4 is a partially enlarged sectional view of the mold showing the state before molding, Fig. 5 is a partially enlarged sectional view of the mold during molding, and Fig. 6 is a partially enlarged sectional view showing another example of FIG. 3 is a partially enlarged sectional view of a printed circuit board obtained by the invention.
第′1図にはこの発明方法を実施する射出成形装置が示
される。FIG. 1 shows an injection molding apparatus for carrying out the method of the invention.
基板形状を規定するキャビティ10は、固定型11、可
動型15および中間型20とによって形成される。固定
型11および可動型15のキャビティプレート12およ
び16の表面は、通常平面(または必要に応じて曲面)
の板面状に形成される。中間型20のキャビテイ面21
は基板の厚みを規定する。なお、取付部等の基板の機能
的形状部は必要に応じて適宜形成されることはいうまで
もない0図中の符号25は中間型20のためのガイドピ
ンである。A cavity 10 defining the shape of the substrate is formed by a fixed mold 11, a movable mold 15, and an intermediate mold 20. The surfaces of the cavity plates 12 and 16 of the fixed mold 11 and the movable mold 15 are usually flat (or curved as necessary).
It is formed in the shape of a plate. Cavity surface 21 of intermediate mold 20
defines the thickness of the substrate. Incidentally, it goes without saying that functionally shaped parts of the substrate such as attachment parts are appropriately formed as necessary, and reference numeral 25 in FIG. 0 is a guide pin for the intermediate mold 20.
まず、固定型11側について説明すると、第1図に図示
したように、固定盤13に取付けられた固定型11のキ
ャビティプレー)12表面には、基板表面側回路部を構
成する回路パターン31がキャリアフィルム32表面に
形成された表面側回路フィルム30が配される0回路フ
ィルム30はそのキャリアフィルム32がキャビティ1
0側となるように配置される0図の符号25はスプルー
孔、26はスプルーブツシュ、38は表面側回路フィル
ム30の送りローラ、39は巻取ローラ、■は射出成形
機の加熱筒先端の射出ノズル部を表わす。First, to explain the side of the fixed mold 11, as shown in FIG. The zero-circuit film 30 on which the front-side circuit film 30 formed on the surface of the carrier film 32 is arranged has the carrier film 32 in the cavity 1.
Reference numeral 25 in Figure 0, which is arranged to be on the 0 side, is a sprue hole, 26 is a sprue bush, 38 is a feed roller for the front circuit film 30, 39 is a take-up roller, and ■ is the tip of the heating cylinder of the injection molding machine. represents the injection nozzle part of.
一方、可動盤17に取付けられた可動型15のキャビテ
ィプレート16表面には、基板裏面の回路部を構成する
回路パターン41がキャリアシート42表面に形成され
た裏面側回路フィルム40が配される。この裏面側回路
フィルム40.も、表面側回路フィルム30と同様に、
そのキャリアフィルム42がキャビティ10側となるよ
うに、配置される0図の符号38は該回路フィルム40
の送りローラ、49は巻取ローラである。On the other hand, on the surface of the cavity plate 16 of the movable mold 15 attached to the movable platen 17, a back side circuit film 40 having a circuit pattern 41 forming a circuit section on the back side of the substrate formed on the surface of a carrier sheet 42 is disposed. This back side circuit film 40. Similarly to the front side circuit film 30,
The reference numeral 38 in FIG.
49 is a feed roller, and 49 is a take-up roller.
中間型20は、この発明においては、キャビティ10の
基板両面側位置に回路フィルム30および40を配する
必要から設けられものである。符号29は連結ロッドを
表わす。In the present invention, the intermediate mold 20 is provided because it is necessary to arrange the circuit films 30 and 40 at positions on both sides of the substrate in the cavity 10. Reference numeral 29 represents a connecting rod.
この発明において使用される回路フィルム30または4
0は、第2図または第3図に図示したように、合成樹脂
のキャリアフィルム32(42)の表面にプリント回路
を構成する銅箔等の電導体よりなる回路パターン31(
41)を形成したものである。第2図は蒸着またはメツ
キ法によって回路パターン31(41)を形成したもの
で、同図の符号33(43)は表面に残ったマスキング
部、34(44)は接着剤層である。これらのマスキン
グ部33(43)および接着剤層34(44)は基板成
形時の熱によって溶融する。また、第3図の回路フィル
ム30(40)はキャリアフィルム32(42)の上面
に印刷によって直接回路パターン31(41)を形成し
たものである。Circuit film 30 or 4 used in this invention
0, as shown in FIG. 2 or 3, a circuit pattern 31(
41). FIG. 2 shows a circuit pattern 31 (41) formed by vapor deposition or plating, in which reference numeral 33 (43) is a masking portion remaining on the surface, and 34 (44) is an adhesive layer. These masking portions 33 (43) and adhesive layers 34 (44) are melted by heat during substrate molding. Further, the circuit film 30 (40) in FIG. 3 has a circuit pattern 31 (41) formed directly on the upper surface of a carrier film 32 (42) by printing.
なお1表面側回路フィルム30には、基板の射出成形時
に、該フィルム30がスプルー孔25を塞ぐことなく、
射出ノズル■からの溶解樹脂がキャビティ10内へ注入
されることができるように、該回路フィルム30のスプ
ルー孔25に対応する位置に鎖孔と同じかわずかに大き
い大きさを有する透孔部35が形成されている。Note that the first surface side circuit film 30 has a structure in which the film 30 does not block the sprue holes 25 during injection molding of the board.
In order to inject the melted resin from the injection nozzle (2) into the cavity 10, a through hole 35 having the same size or slightly larger than the chain hole is provided at a position corresponding to the sprue hole 25 of the circuit film 30. is formed.
第4図および第5図には成形時における金型キャビティ
の一部拡大断面図が示される。第4図に図示したように
、各回路フィルム30.40はそれらのキャリアフィル
ム32.42面がキャビティ側となるように基板キャビ
ティ10内となるように配置され、そして、第5図のよ
うに、固定型11のスプルー孔25および表面側回路フ
ィルム30の透孔部35を介してキャビティ10内に基
板を構成する溶融樹脂Pが注入される。FIGS. 4 and 5 show partially enlarged sectional views of the mold cavity during molding. As shown in FIG. 4, each circuit film 30, 40 is placed within the substrate cavity 10 with the carrier film 32, 42 side facing the cavity, and as shown in FIG. The molten resin P constituting the substrate is injected into the cavity 10 through the sprue hole 25 of the fixed mold 11 and the through hole 35 of the front side circuit film 30.
成形に際して溶融樹脂がキャビティ内に注入されると、
第5図のように、該基板樹脂Pは注入の圧力によって各
回路フィルム30.40のキャリアフィルム32.42
を背面から押圧して表面の各回路パターン31.41を
各キャビティプレート12.16に密に押し付は基板表
面を面一な表面としつつ、各キャリアフィルム32.4
2と一体に接合する。When molten resin is injected into the cavity during molding,
As shown in FIG. 5, the substrate resin P is transferred to the carrier film 32, 42 of each circuit film 30, 40 by the injection pressure.
is pressed from the back side to tightly press each circuit pattern 31.41 on the surface onto each cavity plate 12.16, making the substrate surface flush with each carrier film 32.4.
2 and integrally joined.
このように、基板を構成する溶融樹脂Pはキャビティ内
において各回路フィルム30.40のキャリアフィルム
32.42と一体に接合して基板と回路フィルムとの強
固な一体接合が得られる。In this way, the molten resin P constituting the substrate is integrally bonded to the carrier films 32, 42 of each circuit film 30, 40 within the cavity, resulting in a strong integral bond between the substrate and the circuit film.
なお、前述したように、基板樹脂Pとキャリアフィルム
32との付着性を高めるために接着剤を介在させてもよ
い。Note that, as described above, an adhesive may be used to increase the adhesion between the substrate resin P and the carrier film 32.
さらに、最も好ましい例としては、キャリアフィルム3
2を基板樹脂Pと同種かまたは相溶性のある樹脂によっ
て構成することである。一般にこの種基板の射出成形用
樹脂としては、耐熱性プラスチックとして、PPS、P
EI、PES、PSF等が用いられ、汎用プラスチック
としては、ABS、PMMA、ポリカーボネート等が使
用されるが、可能な限りキャリアフィルム32.42に
は基板樹脂と同種のものを選択するのが望ましい。Furthermore, as the most preferable example, carrier film 3
2 is made of the same type of resin as the substrate resin P or a resin that is compatible with the substrate resin P. In general, heat-resistant plastics such as PPS and PPS are used as resins for injection molding of this type of substrate.
EI, PES, PSF, etc. are used, and general-purpose plastics include ABS, PMMA, polycarbonate, etc., but it is desirable to select the same type of resin as the substrate resin for the carrier film 32, 42 as much as possible.
なお、実施例ではユ基板樹脂としてPPS、キャリアフ
ィルムにPPSフィルムを使用したが、この場合には接
合部が判別不能なほど両者は融合溶着し一体的結合を得
ることができた。さらに、キャリアフィルムとしてPE
Tは各種の基板樹脂と相溶性が良く好ましい材料である
。In the example, PPS was used as the substrate resin and a PPS film was used as the carrier film, but in this case, the two were fused and welded to the extent that the joint was indistinguishable, and an integral bond could be obtained. In addition, PE as a carrier film
T is a preferable material because it has good compatibility with various substrate resins.
実施例には図示しないが、基板の成形と同時に端子、ピ
ンを立設することも可能である。この場合にはあらかじ
めいずれかのキャビティプレートに所定の端子ピンをイ
ンサートとしてセットし成形がなされる。Although not shown in the embodiments, terminals and pins may be provided upright at the same time as the substrate is molded. In this case, predetermined terminal pins are set as inserts in one of the cavity plates and molded.
(効果)
第6図はこの発明によって得られたプリント回路基板の
一部拡大断面図を示すものであるが1図のように、この
発明にあっては各回路フィルム30.40のキャリアフ
ィルム32.42と基板樹脂Pとがその接合部において
融合しつつ結合されるものであるから一体かつ強固な接
合が得られる。(Effects) FIG. 6 shows a partially enlarged sectional view of the printed circuit board obtained by the present invention. As shown in FIG. 1, in this invention, the carrier film 32 of each circuit film 30. Since the .42 and the substrate resin P are fused and bonded at the bonded portion, an integral and strong bond can be obtained.
また、同図から理解できるように、各回路フィルム30
.40のキャリアフィルム32.42は基板の射出成形
時に回路パターン31.41を包むようにして基板表面
と面一に成形されるので、当該回路パターン31.41
は基板表面にしっかりと包着され固定される。さらに、
回路パターン31.41は基板表面と面一に形成される
ので摺動部分でも摩耗や剥落のおそれなく使用できる。In addition, as can be understood from the figure, each circuit film 30
.. The carrier film 32.42 of No. 40 is molded flush with the surface of the substrate so as to wrap the circuit pattern 31.41 during injection molding of the substrate, so that the circuit pattern 31.41
is tightly wrapped and fixed to the substrate surface. moreover,
Since the circuit patterns 31 and 41 are formed flush with the substrate surface, they can be used even on sliding parts without fear of wear or peeling.
従来のプリント回路基板では、通常基板表面にプリント
回路が突出して形成されるので、プリント回路の接合性
が低く、また他物との接触によって該回路が損傷を受け
たり、剥落したりするおそれがあり、摺動部または他物
との接触部に使用することはむずかしい。In conventional printed circuit boards, the printed circuit is usually formed protruding from the surface of the board, so the bonding of the printed circuit is low, and there is a risk that the circuit may be damaged or peeled off by contact with other objects. However, it is difficult to use it on sliding parts or parts that come into contact with other objects.
この発明によれば、このほかに、キャリアフィルムは成
形時に基板樹脂と一体に接合されるので、耐熱性あるい
は強度のある樹脂であることを必要とせず経済的であり
、また基板の射出成形に際しても型温度や樹脂温度を低
く押えるなどといった特別な制限をすることな〈実施で
き、成形上大きなメリットを享有することができる。According to this invention, in addition, since the carrier film is integrally bonded to the substrate resin during molding, it is economical because it does not require heat-resistant or strong resin, and it is also advantageous when injection molding the substrate. It can be carried out without any special restrictions such as keeping the mold temperature or resin temperature low, and can enjoy great advantages in molding.
このように、この発明によれば、基板の射出成形と同時
にかつ一体に基板の表裏面に回路部を形成することがで
きこの種プリント回路基板の製造工程を飛躍的に簡略化
しかつ効率化することができるのものである。As described above, according to the present invention, circuit parts can be formed on the front and back surfaces of the board simultaneously and integrally with the injection molding of the board, dramatically simplifying and increasing the efficiency of the manufacturing process of this type of printed circuit board. It is something that can be done.
第1図はこの発明方法を実施する射出成形装置の一例を
示す要部の断面図、第2図は回路フィルムの一例を示す
一部拡大断面図、第3図は同じく回路フィルムの他の例
を示す一部拡大断面図、第4図は成形前の状態を示す金
型の一部拡大断面図、第5図はその成形時の一部拡大断
面図、第6図はこの発明によって得られたプリント回路
基板の部分拡大断面図である。
10・・・基板キャビティ、11・・・固定型、15・
・・可動型、12.16・・・キャビティプレート、3
0・・・表面側回路フィルム、31・・・回路パターン
、32・・・キャリアフィルム、40・・・裏面側回路
フィルム、41・・・回路パターン、42・・・キャリ
アフィルム、P・・・基板樹脂。
第1図
第4図
第5図Fig. 1 is a cross-sectional view of essential parts showing an example of an injection molding apparatus for carrying out the method of this invention, Fig. 2 is a partially enlarged sectional view showing an example of a circuit film, and Fig. 3 is another example of the same circuit film. 4 is a partially enlarged sectional view of the mold showing the state before molding, FIG. 5 is a partially enlarged sectional view of the mold during molding, and FIG. 6 is a partially enlarged sectional view of the mold obtained by this invention. FIG. 3 is a partially enlarged sectional view of the printed circuit board. 10... Substrate cavity, 11... Fixed type, 15.
・・Movable type, 12.16 ・Cavity plate, 3
0... Front side circuit film, 31... Circuit pattern, 32... Carrier film, 40... Back side circuit film, 41... Circuit pattern, 42... Carrier film, P... Substrate resin. Figure 1 Figure 4 Figure 5
Claims (3)
ンを表面に接着した合成樹脂のキャリアフィルムが、樹
脂基板の表裏両表面に該基板の射出成形による賦形時に
一体に接合されていることを特徴とするプリント回路基
板。1. A synthetic resin carrier film having a circuit pattern made of conductors constituting a printed circuit adhered to its surface is integrally bonded to both the front and back surfaces of a resin substrate when the substrate is formed by injection molding. printed circuit board.
び基板裏面側位置に、合成樹脂のキャリアフィルム表面
にプリント回路を構成する電導体よりなる回路パターン
を形成した回路フィルムを、前記キャリアフィルム面が
キャビティ側となるように配した後、該キャビティ内に
基板を構成する溶融樹脂を注入し前記キャリアフィルム
と当該溶融樹脂とを一体に接合しつつ基板を成形するこ
とを特徴とするプリント回路基板の製法。2. A circuit film, in which a circuit pattern made of a conductor constituting a printed circuit is formed on the surface of a carrier film made of synthetic resin, is placed on the front side of the board and the back side of the cavity having a board shape, with the surface of the carrier film facing the cavity. A method for producing a printed circuit board, which comprises: injecting a molten resin constituting the board into the cavity and molding the board while integrally joining the carrier film and the molten resin.
たは相溶性のある樹脂からなる特許請求の範囲第1項記
載のプリント回路基板の製法。3. 2. The method of manufacturing a printed circuit board according to claim 1, wherein the carrier film is made of a resin that is the same type or compatible with the resin constituting the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25222887A JPH0194691A (en) | 1987-10-06 | 1987-10-06 | Printed circuit board and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25222887A JPH0194691A (en) | 1987-10-06 | 1987-10-06 | Printed circuit board and manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0194691A true JPH0194691A (en) | 1989-04-13 |
JPH054836B2 JPH054836B2 (en) | 1993-01-20 |
Family
ID=17234298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25222887A Granted JPH0194691A (en) | 1987-10-06 | 1987-10-06 | Printed circuit board and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0194691A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04206989A (en) * | 1990-11-30 | 1992-07-28 | Nitto Boseki Co Ltd | Printed wiring and manufacture thereof |
JPH11307884A (en) * | 1998-04-22 | 1999-11-05 | Shin Etsu Polymer Co Ltd | Integrated printed wiring board mold |
JP2006190748A (en) * | 2005-01-05 | 2006-07-20 | Kobe Steel Ltd | Manufacturing method of porous dielectric substrate equipped with pattern electrode |
-
1987
- 1987-10-06 JP JP25222887A patent/JPH0194691A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04206989A (en) * | 1990-11-30 | 1992-07-28 | Nitto Boseki Co Ltd | Printed wiring and manufacture thereof |
JPH11307884A (en) * | 1998-04-22 | 1999-11-05 | Shin Etsu Polymer Co Ltd | Integrated printed wiring board mold |
JP2006190748A (en) * | 2005-01-05 | 2006-07-20 | Kobe Steel Ltd | Manufacturing method of porous dielectric substrate equipped with pattern electrode |
JP4577715B2 (en) * | 2005-01-05 | 2010-11-10 | 株式会社神戸製鋼所 | Method for manufacturing porous dielectric substrate having pattern electrode |
Also Published As
Publication number | Publication date |
---|---|
JPH054836B2 (en) | 1993-01-20 |
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