JPH0520257B2 - - Google Patents
Info
- Publication number
- JPH0520257B2 JPH0520257B2 JP62303579A JP30357987A JPH0520257B2 JP H0520257 B2 JPH0520257 B2 JP H0520257B2 JP 62303579 A JP62303579 A JP 62303579A JP 30357987 A JP30357987 A JP 30357987A JP H0520257 B2 JPH0520257 B2 JP H0520257B2
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- pattern
- resist pattern
- circuit
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は表面に所定のソルダーレジストパタ
ーンを形成したプリント回路基板の射出成形方法
に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for injection molding a printed circuit board having a predetermined solder resist pattern formed on its surface.
（従来の技術）
プリント回路基板の製法として、例えば銅箔と
基板材の間に接着等の目的でプリプレグを載置し
ホツトプレスで積層した後エツチングによつて回
路パターンを形成し、しかる後ソルダーレジスト
パターンの形成、電気部品の実装と複雑な工程を
必要とした。また射出成形による方法も、基板の
射出成形後に回路部の形成等複雑な工程を別途必
要とした。(Prior art) As a manufacturing method for a printed circuit board, for example, a prepreg is placed between a copper foil and a board material for the purpose of adhesion, etc., laminated by hot pressing, a circuit pattern is formed by etching, and then a solder resist is applied. It required complex processes such as pattern formation and electrical component mounting. Furthermore, the injection molding method also requires complicated steps such as forming a circuit section after the injection molding of the substrate.
（発明が解決しようとする問題点）
本発明はこのような事情を背景として為された
ものであつて、基板の射出成形時に回路部、ソル
ダーレジストパターンをも一体同時に成形するこ
とにより、従来の複雑かつ多岐に亘る製造工程を
飛躍的に簡略化、効率化するとともに、電気部品
を実装する場合のハンダ付け工程におけるハンダ
ブリツジ等の不具合を防止可能なプリント回路基
板を得ようとするものである。(Problems to be Solved by the Invention) The present invention has been made against the background of the above-mentioned circumstances, and it is possible to solve the problem by molding the circuit part and the solder resist pattern at the same time when injection molding the board. The purpose of this invention is to dramatically simplify and improve the efficiency of a complicated and diverse manufacturing process, and to obtain a printed circuit board that can prevent problems such as solder bridging during the soldering process when electrical components are mounted.
（問題を解決するための手段）
所定のソルダーレジストパターンを形成した回
路パターンをキヤリアシート表面に形成した回路
フイルムを、基板形状を有するキヤビテイ内に配
した後、該キヤビテイに基板を構成する溶融樹脂
を注入して、所定のソルダーレジストパターンを
形成した回路パターンと一体に基板を成形し、し
かる後キヤリアシートを除去して表面に所定のソ
ルダーレジストパターンを形成したプリント回路
基板を得る。(Means for Solving the Problem) A circuit film having a circuit pattern formed on the surface of a carrier sheet with a predetermined solder resist pattern is placed in a cavity having the shape of a substrate, and then the molten resin constituting the substrate is placed in the cavity. is injected to form a board integrally with a circuit pattern on which a predetermined solder resist pattern is formed, and then the carrier sheet is removed to obtain a printed circuit board on which a predetermined solder resist pattern is formed.
（実施例） 実施例を図面に従つて説明する。(Example) Examples will be described according to the drawings.
添付の第１図は本発明を実施するための射出成
形装置の一例を示す要部断面を含む正面図、第２
図は回路フイルムの一例を示す一部拡大断面図、
第３図は本発明により得られたプリント回路基板
の一例を示す斜視図、第４図は第３図に示された
プリント回路基板に電気部品を実装した場合の一
部拡大断面図である。第１図において、１は型締
装置の固定盤で、対向する位置に型締ラム２の前
進または後退によりステー３に沿つて該固定盤１
に近接または離間が可能な可動盤４が設けられて
いる。５はステー３に螺合せる複数のステーナツ
トである。固定盤１には固定側金型６が可動盤４
には可動側金型７が取り付けられている。８はプ
リント回路基板の基板形状が規定するキヤビテイ
であり、９はスプルーブツシユである。１０は該
キヤビテイ８に溶融原料を注入するための通路で
あるスプルーである。２０はキヤビテイ８に対し
て所定の位置に配された回路フイルム（構成につ
いては第２図において詳述する）であり、２１は
該回路フイルムの送りローラ、２２は巻き取りロ
ーラである。３１は射出装置３０の加熱筒であり
３２は該加熱筒３１の先端に設けたノズルであ
り、図示はしないが加熱筒３１内には原料を可塑
化溶融及び射出するために回転且つ往復動するス
クリユが設けられている。第２図には前記回路フ
イルム２０の一例が部分拡大図として示されてい
る。回路フイルム２０はPETや特に耐熱性が必
要な場合にはPI等よりなる連続せるキヤリアシ
ート２３に離型層２４を介してソルダーレジスト
２７およびレジスト剥離部２８から成るソルダー
レジストパターンを形成した回路パターン２６が
形成されてなるものである。回路パターン２６側
には成形時において原料樹脂との付着性を高める
ために接着層２５が形成されている。尚本例では
接着層２５、ソルダーレジストパターンを形成し
た回路パターン２６は成形品毎に対応した所定の
大きさとして連続せるキヤリアシート２３上にバ
ツチ式に配している。ここでソルダーレジストパ
ターンの形成について述べると、例えばベースフ
イルム、感光層、保護フイルムよりなる市販のド
ライフイルムレジストの保護フイルムをはがし感
光層を回路パターン２６側にしてドライフイルム
レジストと回路パターン２６とを接着し、露光・
現像処理にてソルダーレジストパターン形成後、
ドライフイルムレジストのベースフイルムを剥離
することによりソルダーレジストパターン形成済
の回路パターン２６を得ることができる。 The attached FIG.
The figure is a partially enlarged sectional view showing an example of a circuit film.
FIG. 3 is a perspective view showing an example of a printed circuit board obtained according to the present invention, and FIG. 4 is a partially enlarged sectional view of the printed circuit board shown in FIG. 3 with electrical components mounted thereon. In FIG. 1, reference numeral 1 denotes a fixed plate of the mold clamping device, and when the mold clamping ram 2 moves forward or backward, the fixed plate 1 is moved along the stay 3 to the opposite position.
A movable platen 4 is provided which can be moved close to or away from the. A plurality of stay nuts 5 are screwed onto the stay 3. The fixed side mold 6 is on the fixed platen 1 and the movable platen 4
A movable mold 7 is attached to the movable mold 7. 8 is a cavity defined by the board shape of the printed circuit board, and 9 is a sprue bush. 10 is a sprue which is a passage for injecting molten raw material into the cavity 8. 20 is a circuit film (the structure of which will be explained in detail in FIG. 2) arranged at a predetermined position with respect to the cavity 8; 21 is a feed roller for the circuit film; and 22 is a take-up roller. 31 is a heating cylinder of the injection device 30, and 32 is a nozzle provided at the tip of the heating cylinder 31. Although not shown, inside the heating cylinder 31 is a nozzle that rotates and reciprocates in order to plasticize, melt, and inject the raw material. A scroll is provided. FIG. 2 shows an example of the circuit film 20 as a partially enlarged view. The circuit film 20 is a circuit pattern in which a solder resist pattern consisting of a solder resist 27 and a resist peeled portion 28 is formed on a continuous carrier sheet 23 made of PET or PI when heat resistance is particularly required, with a release layer 24 interposed therebetween. 26 is formed. An adhesive layer 25 is formed on the circuit pattern 26 side to improve adhesion to the raw resin during molding. In this example, the adhesive layer 25 and the circuit pattern 26 formed with the solder resist pattern are arranged in batches on the continuous carrier sheet 23 in a predetermined size corresponding to each molded product. Here, to describe the formation of the solder resist pattern, for example, peel off the protective film of a commercially available dry film resist consisting of a base film, a photosensitive layer, and a protective film, and place the dry film resist and the circuit pattern 26 with the photosensitive layer facing the circuit pattern 26. Glue, expose and
After forming a solder resist pattern through development processing,
By peeling off the base film of the dry film resist, a circuit pattern 26 on which a solder resist pattern has been formed can be obtained.
次に作動について説明する。 Next, the operation will be explained.
第１図において巻き取りローラ２２、送りロー
ラ２１及び光電管（図示せず）等の作用によつて
回路フイルム２０の回路パターン２６がキヤビテ
イ８に対して所定の位置に配されていることが確
認された後、可動盤４に取りつけられた可動側金
型７が型締ラム２の作動によりステー３に沿つて
型閉めされる。固定盤１に取りつけられた固定側
金型６と可動側金型７は型締完了した製品キヤビ
テイ８を形成する。 In FIG. 1, it is confirmed that the circuit pattern 26 of the circuit film 20 is placed at a predetermined position with respect to the cavity 8 by the actions of the take-up roller 22, the feed roller 21, the phototube (not shown), etc. After that, the movable mold 7 attached to the movable platen 4 is closed along the stay 3 by the operation of the mold clamping ram 2. A fixed side mold 6 and a movable side mold 7 attached to the fixed platen 1 form a product cavity 8 that has been completely clamped.
一方射出側においては、加熱筒３１の先端に取
り付けられたノズル３２の先端面は固定金型６の
スプルーブツシユ９にシフトシリンダ（図示せ
ず）の作用により密着して押しつけられノズルタ
ツチの状態となる。基板４０（第３図）を構成す
る可塑化溶融された原料樹脂はスクリユの前進作
動によりノズル３１から固定側金型６のスプルー
１０を通つてキヤビテイ８に射出注入される。 On the other hand, on the injection side, the tip surface of the nozzle 32 attached to the tip of the heating cylinder 31 is tightly pressed against the sprue bush 9 of the fixed mold 6 by the action of a shift cylinder (not shown), resulting in a nozzle touch state. Become. The plasticized and melted raw material resin constituting the substrate 40 (FIG. 3) is injected into the cavity 8 from the nozzle 31 through the sprue 10 of the stationary mold 6 by the forward movement of the screw.
なお、ここで基板４０に使用される原料樹脂は
例えばPES、PEI、PPS、PSF等の耐熱性樹脂が
一般的である。原料樹脂の射出注入によつて基板
本体がソルダーレジストパターンを形成した回路
パターン２６とともに一体成形された後、該成形
品からその表面の離型層２４、キヤリアシート２
３が除去される。本例では接着層２５、ソルダー
レジストパターンを形成した回路パターン２６を
成形品に対応する所定の形状として、連続せる離
型層２４、キヤリアシート２３上にバツチ式に配
しているので、送りローラ２１および巻き取りロ
ーラ２２に保持されている離型層２４、キヤリア
シート２３と前記接着層２５、ソルダーレジスト
パターンを形成した回路パターン２６は型開きに
よつて自然に剥離する。しかる後、例えば吸盤を
備えた取出機（図示せず）により成形品を外部へ
取り出し、スプルーの処理を行なう（勿論公知の
ピンポイントゲート方式等の採用によりスプルー
処理を連続して型内で行なうこともできる）こと
により、第３図に示す如き表面に所定のソルダー
レジストパターンを形成したプリント回路基板５
０を得ることができる。 Note that the raw material resin used for the substrate 40 here is generally a heat-resistant resin such as PES, PEI, PPS, or PSF. After the substrate body is integrally molded with the circuit pattern 26 on which the solder resist pattern is formed by injection injection of raw material resin, the molded product is coated with a mold release layer 24 and a carrier sheet 2 on the surface thereof.
3 is removed. In this example, the adhesive layer 25 and the circuit pattern 26 formed with the solder resist pattern are arranged in a batch pattern on the continuous release layer 24 and carrier sheet 23 in a predetermined shape corresponding to the molded product, so that the feed roller 21 and the release layer 24 held by the take-up roller 22, the carrier sheet 23, the adhesive layer 25, and the circuit pattern 26 formed with the solder resist pattern are naturally peeled off by opening the mold. Thereafter, the molded product is taken out to the outside using, for example, a take-out machine (not shown) equipped with a suction cup, and sprue processing is performed (of course, sprue processing is performed continuously within the mold by employing a known pinpoint gate method, etc.). ), the printed circuit board 5 with a predetermined solder resist pattern formed on its surface as shown in FIG.
You can get 0.
（効果）
本発明によれば、基板の射出成形と同時に該基
板面に回路パターンと同時にソルダーレジストパ
ターンを形成することができるので、従来のよう
に別工程により回路パターンやソルダーレジスト
パターンを形成する必要がなくなりこの種プリン
ト回路基板の製造工程を飛躍的に簡略化、効率化
できるようになつた。また第４図はこの発明によ
つて得られたプリント回路基板に電気部品６０を
実装した場合の一例であつて、ソルダーレジスト
２７およびレジスト剥離部２８から成るソルダー
レジストパターンを回路パターン２６の上面に設
けたことにより、ハンダ付け工程においてハンダ
７０の一部が誤まつて所定外の場所に滴下した
り、所定の位置から流出することなどにより起こ
るハンダブリツジを防ぎ、短絡等の不具合を良好
に防止することができる。(Effects) According to the present invention, a solder resist pattern can be formed on the substrate surface at the same time as a circuit pattern at the same time as the injection molding of the substrate, so unlike the conventional method, the circuit pattern and the solder resist pattern can be formed in a separate process. This eliminates the need for this type of printed circuit board, and the manufacturing process for this type of printed circuit board can be dramatically simplified and made more efficient. FIG. 4 shows an example of the case where an electrical component 60 is mounted on a printed circuit board obtained according to the present invention, in which a solder resist pattern consisting of a solder resist 27 and a resist peeling part 28 is placed on the upper surface of the circuit pattern 26. By providing this, it is possible to prevent solder bridging caused by a part of the solder 70 accidentally dripping to an unspecified location or flowing out from a predetermined location during the soldering process, and to effectively prevent problems such as short circuits. be able to.
第１図は本発明の実施するための射出成形装置
の一例を示す要部断面図、第２図は回路フイルム
の一例を示す一部拡大断面図、第３図は本発明に
より得られたプリント回路基板の一例を示す斜視
図、第４図は第３図に示されたプリント回路基板
に電気部品を実装した場合の一部拡大断面図であ
る。
６：固定側金型、７：可動側金型、８：キヤビ
テイ、２０：回路フイルム、２３：キヤリアシー
ト、２６：回路パターン、２７：ソルダーレジス
ト、２８：レジスト剥離部、３０：射出装置、４
０：基板、５０：プリント回路基板。
FIG. 1 is a sectional view of essential parts showing an example of an injection molding apparatus for carrying out the present invention, FIG. 2 is a partially enlarged sectional view showing an example of a circuit film, and FIG. 3 is a print obtained by the present invention. FIG. 4 is a perspective view showing an example of a circuit board, and FIG. 4 is a partially enlarged sectional view when electrical components are mounted on the printed circuit board shown in FIG. 3. 6: Fixed side mold, 7: Movable side mold, 8: Cavity, 20: Circuit film, 23: Carrier sheet, 26: Circuit pattern, 27: Solder resist, 28: Resist peeling part, 30: Injection device, 4
0: board, 50: printed circuit board.
Claims (1)
パターン上に所定のソルダーレジストパターンを
形成し、該所定のソルダーレジストパターンを形
成した回路パターンをキヤリアシート表面に形成
した回路フイルムを、基板形状を有するキヤビテ
イ内に配した後、該キヤビテイに基板を構成する
溶融樹脂を注入して、所定のソルダーレジストパ
ターンを形成した回路パターンと一体に基板を成
形し、しかる後キヤリアシートを除去して表面に
所定のソルダーレジストパターンを形成したプリ
ント回路基板を得ることを特長とするプリント回
路基板の射出成形方法。1 A predetermined solder resist pattern is formed on a circuit pattern made of a conductor constituting a printed circuit, and a circuit film with the circuit pattern formed with the predetermined solder resist pattern formed on the surface of a carrier sheet is placed in a cavity having a substrate shape. After the carrier sheet is placed inside, the molten resin constituting the board is injected into the cavity, and the board is molded integrally with the circuit pattern on which a predetermined solder resist pattern is formed.Then, the carrier sheet is removed and a predetermined pattern is formed on the surface. A method for injection molding a printed circuit board, characterized by obtaining a printed circuit board on which a solder resist pattern is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30357987A JPH01145114A (en) | 1987-11-30 | 1987-11-30 | Injection molding method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30357987A JPH01145114A (en) | 1987-11-30 | 1987-11-30 | Injection molding method of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01145114A JPH01145114A (en) | 1989-06-07 |
| JPH0520257B2 true JPH0520257B2 (en) | 1993-03-19 |
Family
ID=17922701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30357987A Granted JPH01145114A (en) | 1987-11-30 | 1987-11-30 | Injection molding method of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145114A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3991179T1 (en) * | 1989-09-26 | 1990-10-11 | Rogers Corp | CURVED PLASTIC BODY WITH CIRCUIT PATTERN, AND PRODUCTION METHOD THEREFOR |
| JPH04125117A (en) * | 1990-09-14 | 1992-04-24 | Meiki Co Ltd | Printed circuit board and its injection molding device |
| FR2668959A1 (en) * | 1990-11-08 | 1992-05-15 | Merlin Gerin | METHOD AND DEVICE FOR DEPOSITING A LASER-REACTIVE PAINT LAYER ON A MOLDED PART. |
| JP2011119611A (en) * | 2009-12-07 | 2011-06-16 | Furukawa Electric Co Ltd:The | Injection-molded substrate and injection-molded component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62237793A (en) * | 1986-04-08 | 1987-10-17 | 日本写真印刷株式会社 | Manufacture of printed wiring board |
| JPS6381896A (en) * | 1986-09-26 | 1988-04-12 | 古河電気工業株式会社 | Manufacture of molded unit with transcripted circuit |
| JPS63257293A (en) * | 1987-04-14 | 1988-10-25 | 大日本印刷株式会社 | Manufacture of molded product with printed circuit and transcription sheet for the manufacture |
-
1987
- 1987-11-30 JP JP30357987A patent/JPH01145114A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62237793A (en) * | 1986-04-08 | 1987-10-17 | 日本写真印刷株式会社 | Manufacture of printed wiring board |
| JPS6381896A (en) * | 1986-09-26 | 1988-04-12 | 古河電気工業株式会社 | Manufacture of molded unit with transcripted circuit |
| JPS63257293A (en) * | 1987-04-14 | 1988-10-25 | 大日本印刷株式会社 | Manufacture of molded product with printed circuit and transcription sheet for the manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01145114A (en) | 1989-06-07 |
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