JPH0368554B2 - - Google Patents
Info
- Publication number
- JPH0368554B2 JPH0368554B2 JP61262529A JP26252986A JPH0368554B2 JP H0368554 B2 JPH0368554 B2 JP H0368554B2 JP 61262529 A JP61262529 A JP 61262529A JP 26252986 A JP26252986 A JP 26252986A JP H0368554 B2 JPH0368554 B2 JP H0368554B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- printed circuit
- cavity
- mold
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- -1 UITEM Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明はプリント回路基板の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a printed circuit board.
（従来の技術）
従来のプリント回路基板の製法としては、例え
ば銅板と基板材をホツトプレスで積層した後この
銅板面をエツチングによつて回路パターンに加工
する方法や、あるいは基板材に導電性インクをス
クリーン印刷したり無電解メツキによつて回路パ
ターンを形成する方法が多用されている。(Prior art) Conventional methods for manufacturing printed circuit boards include, for example, laminating a copper plate and a board material by hot pressing and then etching the surface of the copper plate to form a circuit pattern, or applying conductive ink to the board material. Methods of forming circuit patterns by screen printing or electroless plating are often used.
近年、基板の素材として、従来のガラスエポキ
シ等に代つて、耐熱性および電気特性に優れたポ
リサルフオン、ポリエーテルサルフオン、ポリエ
ーテルイミド等の熱可塑性樹脂が出現し、この熱
可塑性樹脂によつて基板本体を射出成形する試み
が行なわれている。この射出成形による基板本体
の成形にあつては、該素材樹脂が有する耐熱性お
よび誘電率、誘電正接等の電気特性の向上に加え
て、基板形状、透孔および取付部等の付加形状を
一体に成形でき、従来のような〓後の切削やプレ
ス等の後加工が不要になるという大きな利点が有
している。この射出成形によつて得られた基板本
体は前述した印刷またはメツキ等の手段によつて
その表面に回路パターンが形成される。 In recent years, thermoplastic resins such as polysulfon, polyethersulfon, and polyetherimide, which have excellent heat resistance and electrical properties, have appeared as materials for substrates, replacing conventional glass epoxy. Attempts have been made to injection mold the substrate body. When molding the board body by injection molding, in addition to improving the heat resistance, dielectric constant, dielectric loss tangent, and other electrical properties of the resin material, the board shape, through holes, mounting parts, and other additional shapes are integrated. It has the great advantage of eliminating the need for post-processing such as cutting and pressing as required in the past. A circuit pattern is formed on the surface of the substrate main body obtained by this injection molding by the above-described printing, plating, or other means.
（発明が解決しようとする問題点）
この発明は、上述の従来技術を背景として、基
板の射出成形時に、回路部も一体に成形すること
も提案するものである。(Problems to be Solved by the Invention) Based on the background of the above-mentioned prior art, the present invention also proposes that the circuit portion is also integrally molded during injection molding of the board.
すなわち、上述した従来技術にあつては、基板
の射出成形後に、回路部の形成工程を必要とする
のであるが、この発明では、基板の射出成形と同
時に回路部を形成することによつて、この種のプ
リント回路基板の製造工程を飛躍的に簡略化し、
かつ効率化しようとするものである。 That is, in the above-mentioned conventional technology, a step of forming the circuit part is required after the injection molding of the board, but in the present invention, by forming the circuit part at the same time as the injection molding of the board, This dramatically simplifies the manufacturing process for this type of printed circuit board,
It also aims to improve efficiency.
（問題点を解決するための手段）
すなわち、この発明に係るプリント回路基板の
製造方法は、射出成形装置の金型装置の固定盤側
に、所定の基板形状を有しかつ透孔部を形成する
ためのピンを立設したキヤビテイを設け、可動盤
側には、基板の表面形状を規定するキヤビテイプ
レートを設けかつ該キヤビテイプレートをはさん
で送りローラおよび巻取りローラを配置し、該両
ローラによつて、キヤリアシートの上面側にプリ
ント回路を構成する回路パターンおよびその上面
に接着層が形成されたパターンシートを前記キヤ
リアシートが前記キヤビテイプレート側となるよ
うに配し、型閉め後、前記キヤビテイに基板を構
成する溶融樹脂を注入して前記接着層を介して前
記回路パターンと一体に基板を成形し、しかる
後、可動盤を移動して型開きすることによつて、
前記成形品表面のキヤリアシートを成形品表面か
ら分離除去して透孔部を有するプリント回路基板
を得ることを特徴とするプリント回路基板の製造
方法に係る。(Means for Solving the Problems) That is, the method for manufacturing a printed circuit board according to the present invention includes forming a board having a predetermined shape and a through hole on the fixed platen side of a mold device of an injection molding device. A cavity is provided with pins erected therein to prevent the substrate from being removed, and a cavity plate is provided on the movable platen side to define the surface shape of the substrate, and a feed roller and a take-up roller are placed across the cavity plate. Using both rollers, a pattern sheet having a circuit pattern constituting a printed circuit and an adhesive layer formed on the upper surface of the carrier sheet is arranged so that the carrier sheet faces the cavity plate, and the mold is closed. After that, a molten resin constituting the substrate is injected into the cavity to mold the substrate integrally with the circuit pattern via the adhesive layer, and then, by moving the movable platen and opening the mold,
The present invention relates to a method for producing a printed circuit board, characterized in that the carrier sheet on the surface of the molded product is separated and removed from the surface of the molded product to obtain a printed circuit board having a through hole.
（作用）
この発明では、射出成形装置の金型装置の固定
盤側に、所定の基板形状を有しかつ透孔部を形成
するためのピンを立設したキヤビテイが設けられ
ている。一方の可動盤側には、基板の表面形状を
規定するキヤビテイプレートが設けられていると
ともに、該キヤビテイプレートをはさんで送りロ
ーラおよび巻取りローラが配置される。(Function) In the present invention, a cavity having a predetermined substrate shape and having a pin for forming a through hole is provided on the fixed platen side of a mold device of an injection molding apparatus. On one side of the movable platen, a cavity plate is provided that defines the surface shape of the substrate, and a feed roller and a take-up roller are arranged with the cavity plate in between.
そして、前記送りローラおよび巻取りローラに
はプリント回路を構成するパターンシートが配さ
れる。パターンシートはキヤリアシートの上面側
にプリント回路を構成する回路パターンおよびそ
の上面に接着層が形成されたもので、そのキヤリ
アシートがキヤビテイシート側となるように金型
に配される。 A pattern sheet constituting a printed circuit is placed on the feed roller and take-up roller. The pattern sheet has a circuit pattern constituting a printed circuit on the upper surface side of a carrier sheet and an adhesive layer formed on the upper surface thereof, and is placed in a mold so that the carrier sheet faces the cavity sheet side.
パターンシートが所定位置に配された後、型閉
めがなされ、前記キヤビテイに基板を構成する溶
融樹脂が注入される。回路パターンの上面には接
着層が形成されているので、この接着層を介して
前記回路パターンは基板と一体に成形される。ま
た、このとき、キヤビテイ内には透孔部を形成す
るためのピンが立設されていて、該ピンの先端は
回路パターンに密に当接され、この部分に透孔部
が形成される。 After the pattern sheet is placed in a predetermined position, the mold is closed and molten resin constituting the substrate is injected into the cavity. Since an adhesive layer is formed on the upper surface of the circuit pattern, the circuit pattern is integrally formed with the substrate via this adhesive layer. Further, at this time, a pin for forming a through hole is provided upright in the cavity, and the tip of the pin is brought into close contact with the circuit pattern, and the through hole is formed in this portion.
基板が回路パターンとともに一体に成形された
後、可動盤を移動して型開きすることによつて、
前記成形品からその表面のキヤリアシート部分が
除去される。キヤリアシートの除去によつて回路
パターンが成形基板表面に現出し、これによつて
透孔部を一体に有するプリント基板が得られる。 After the board is integrally molded with the circuit pattern, by moving the movable platen and opening the mold,
The carrier sheet portion on the surface of the molded article is removed. By removing the carrier sheet, the circuit pattern is exposed on the surface of the molded substrate, thereby obtaining a printed circuit board having integrally formed through holes.
（実施例） 以下添付の図面に従つて実施例を説明する。(Example) Embodiments will be described below with reference to the accompanying drawings.
添付の図面の第１図はこの発明によつて得られ
たプリント回路基板の全体斜視図、第２図はこの
発明方法を実施する射出成形金型の要部の断面
図、第３図はこの発明に使用されるパターンシー
トの断面図、第４図は成形状態を示す金型の一部
拡大断面図、第５図は同じく成形後の取出状態を
表す一部拡大断面図である。 FIG. 1 of the accompanying drawings is an overall perspective view of a printed circuit board obtained by the present invention, FIG. 2 is a sectional view of the main parts of an injection mold for implementing the method of the present invention, and FIG. A sectional view of the pattern sheet used in the invention, FIG. 4 is a partially enlarged sectional view of a mold showing a molding state, and FIG. 5 is a partially enlarged sectional view showing a state of removal after molding.
第１図に図示したように、この発明は透孔部１
４，１４……と必要に応じて設けられる取付部１
２等とを一体に有する基板本体１１の表面に銅箔
等の導電材からなる回路パターン１５を形成した
プリント基板１０を得る方法に係る。 As shown in FIG.
4, 14... and the mounting part 1 provided as necessary
The present invention relates to a method for obtaining a printed circuit board 10 in which a circuit pattern 15 made of a conductive material such as copper foil is formed on the surface of a circuit board body 11 that integrally has a circuit board body 11 having a circuit board body 11 having a circuit board body 11 having a circuit pattern 15 made of a conductive material such as copper foil.
第２図には、この発明方法を実施する金型装置
が示される。すなわち、一方の金型、実施例では
固定盤４０側には基板形状を有しかつ透孔部を形
成するためのピン３５，３５……を立設したキヤ
ビテイ３０が、底部キヤビテイプレート３１およ
び側部キヤビテイプレート３２によつて形成され
る。 FIG. 2 shows a mold apparatus for carrying out the method of the invention. That is, one mold, in the embodiment, a cavity 30 on the fixed platen 40 side has a substrate shape and has pins 35, 35, . It is formed by side cavity plates 32.
他方の金型、実施例では可動盤４１側には基板
表面形状を規定するキヤビテイプレート３３が設
けられる。そして、該キヤビテイプレート３３を
はさんで送りローラ４５および巻取りローラ４６
が配置される。 The other mold, in the embodiment, the movable platen 41 side is provided with a cavity plate 33 that defines the surface shape of the substrate. Then, the feed roller 45 and the winding roller 46 are sandwiched between the cavity plate 33.
is placed.
キヤビテイプレート３３は平面（または必要に
応じて曲面）の板面状に形成されていて、この所
定位置に、前記送りローラ４５および巻取りロー
ラ４６によつて、プリント回路を構成する回路パ
ターン２３がキヤリアシート２１に一体に形成さ
れたパターンシート２０が配置される。 The cavity plate 33 is formed into a flat (or curved, if necessary) plate shape, and a circuit pattern 23 constituting a printed circuit is formed at a predetermined position by the feed roller 45 and the winding roller 46. A pattern sheet 20 in which a pattern sheet 20 is integrally formed with a carrier sheet 21 is arranged.
第３図にこのパターンシート２０の一例が示さ
れる。すなわち、このパターンシート２０は、
PET等よりなるキヤリアシート２１に剥離剤２
２を介して銅箔等の導電材からなる回路パターン
２３が形成されてなるもので、回路パターン２３
の上面側には成形時における基材樹脂との付着性
を高めるために接着層２４が形成されている。ま
た、キヤリアシート２１の裏面側には成形時にお
ける該シートのずれを防ぐために粘着層２５が形
成されている。 An example of this pattern sheet 20 is shown in FIG. That is, this pattern sheet 20 is
A release agent 2 is applied to a carrier sheet 21 made of PET, etc.
A circuit pattern 23 made of a conductive material such as copper foil is formed through the circuit pattern 23.
An adhesive layer 24 is formed on the upper surface side of the substrate to enhance adhesion to the base resin during molding. Further, an adhesive layer 25 is formed on the back side of the carrier sheet 21 in order to prevent the sheet from shifting during molding.
パターンシート２０は、そのキヤリアシート２
１側がキヤビテイプレート３３側となるように、
所定のキヤビテイ位置に配設される。 The pattern sheet 20 is the carrier sheet 2
so that the 1 side is the cavity plate 33 side,
It is arranged at a predetermined cavity position.
光電管（図示せず）等によつて回路パターン２
３が所定のキヤビテイ３０位置に配されているこ
とが確認された後、型締めされて基材を構成する
溶融樹脂が射出機５０のノズル５２からスプルー
孔３７を経て当該キヤビテイ３０内に注入され
る。なお、ここで使用される基材樹脂は例えば
PES、UITEM、PPS、PSF等の高融点（約400
℃）を有する耐熱性樹脂であるので、射出機５０
も高温用のカートリツジ型ヒータ（リツプヒー
タ）５５を用いた高温仕様のものが用いられる。
第３図の符号５１はスクリユーを示す。 Circuit pattern 2 is formed by a phototube (not shown), etc.
3 is placed in a predetermined position of the cavity 30, the mold is clamped, and the molten resin constituting the base material is injected into the cavity 30 from the nozzle 52 of the injection machine 50 through the sprue hole 37. Ru. The base resin used here is, for example,
High melting points such as PES, UITEM, PPS, PSF (approximately 400
Since it is a heat-resistant resin with a temperature of
A high-temperature specification using a cartridge type heater (lip heater) 55 for high temperature is also used.
Reference numeral 51 in FIG. 3 indicates a screw.
第４図は基板を構成する溶融樹脂M1がキヤビ
テイ３０に充満した状態を示す拡大断面図である
が、同図のように回路パターン２３は基板樹脂と
一体に接合される。と同時に、キヤビテイ３０内
に立設されたピン３５，３５……の先端は該回路
パターン２３に密に当接する。 FIG. 4 is an enlarged sectional view showing a state in which the cavity 30 is filled with the molten resin M1 constituting the substrate, and as shown in the figure, the circuit pattern 23 is integrally joined to the substrate resin. At the same time, the tips of the pins 35, 35, .
上述した工程によつて、基板本体が回路パター
ン２３とともに一体成形された後、該成形品から
その表面のキヤリアシート２１部分が除去され
る。この発明では、第２図から明らかなように、
パターンシート２０が送りローラ４５および巻取
りローラ４６に保持されているので、型開きによ
つて自然にキヤリアシート２１の剥離がなされ
る。 After the substrate main body is integrally molded with the circuit pattern 23 through the steps described above, the carrier sheet 21 portion on the surface thereof is removed from the molded product. In this invention, as is clear from FIG.
Since the pattern sheet 20 is held by the feed roller 45 and the take-up roller 46, the carrier sheet 21 is naturally peeled off when the mold is opened.
可動盤４１を移動して型開きすることによつ
て、成形品表面のキヤリアシート２１が分離除去
されて回路パターン２３が成形基板表面に現出
し、これによつて透孔部１４を一体に有するプリ
ント基板１０が得られる。 By moving the movable platen 41 and opening the mold, the carrier sheet 21 on the surface of the molded product is separated and removed, and the circuit pattern 23 appears on the surface of the molded substrate, thereby integrally having the through-hole portion 14. A printed circuit board 10 is obtained.
第５図は成形後の脱型状態を示す拡大断面図で
ある。実施例では、成形後の成形品の型離れを良
くするために、キヤビテイ３０を底部キヤビテイ
プレート３１と側部キヤビテイプレート３２とに
よつて構成し、成形後に両キヤビテイプレート３
１，３２が図のように離間することにより、成形
品Ｍからピン３５を抜去して成形品の取り出しが
容易となるようになつている。同図の符号６０は
吸盤を備えた取出機である。 FIG. 5 is an enlarged sectional view showing the demolded state after molding. In the embodiment, in order to improve the release of the molded product from the mold after molding, the cavity 30 is composed of a bottom cavity plate 31 and a side cavity plate 32, and both cavity plates 3 are separated after molding.
By separating pins 1 and 32 as shown in the figure, it becomes easy to remove the pin 35 from the molded product M and take out the molded product. The reference numeral 60 in the figure is a take-out machine equipped with a suction cup.
なお、成形時においてピン３５先端に密に当接
していた回路パターン２３の部分２３ａは、当然
溶融樹脂の付着がないので、成形品に接合せず、
キヤリアシート２１の剥ぎ取り時に該キヤリアシ
ート２１側に残留して一体に除去される。 Note that the portion 23a of the circuit pattern 23 that was in close contact with the tip of the pin 35 during molding is not bonded to the molded product because of course no molten resin is attached to it.
When the carrier sheet 21 is peeled off, it remains on the carrier sheet 21 side and is removed as a whole.
（効果）
以上図示し説明したように、この発明方法によ
れば、基板の射出成形と同時に該基板面に回路パ
ターンの形成ができるので、従来のような別工程
によつて回路パターンを形成するための手間なら
びに時間を省き、この種プリント回路基板の製造
工程を飛躍的に簡略化し、かつ効率化することが
できるようになつた。(Effects) As illustrated and explained above, according to the method of the present invention, a circuit pattern can be formed on the surface of the substrate at the same time as the injection molding of the substrate. It has now become possible to dramatically simplify and improve the efficiency of the manufacturing process for this type of printed circuit board by eliminating the effort and time required to do so.
また、この発明によれば、従来困難とされてい
た、曲面または異形面もしくは変形面等を有する
基板に対しても回路パターンをたやすく形成する
ことができ、プリント回路基板の用途を画期的に
拡大することが可能になつた。 Furthermore, according to the present invention, circuit patterns can be easily formed even on substrates having curved, irregularly shaped, or deformed surfaces, which has been considered difficult in the past, and the use of printed circuit boards is revolutionary. It became possible to expand to
このように、この発明は極めて実用性が高く、
その効果とするところは甚大である。 In this way, this invention is extremely practical,
The effects of this are enormous.
第１図はこの発明によつて得られたプリント回
路基板の全体斜視図、第２図はこの発明方法を実
施する射出成形金型の要部の断面図、第３図はこ
の発明に使用されるパターンシートの断面図、第
４図は成形状態を示す金型の一部拡大断面図、第
５図は同じく成形後の取出状態を表す一部拡大断
面図である。
１０……プリント回路基板、１４……透孔部、
１５……回路パターン、２０……パターンシー
ト、２１……キヤリアシート、２３……回路パタ
ーン、３０……キヤビテイ、４０……固定盤、４
１……可動盤、５０……射出機。
Fig. 1 is an overall perspective view of a printed circuit board obtained by the present invention, Fig. 2 is a cross-sectional view of the main parts of an injection mold for carrying out the method of this invention, and Fig. 3 is a perspective view of the printed circuit board obtained by the present invention. FIG. 4 is a partially enlarged sectional view of a mold showing a molding state, and FIG. 5 is a partially enlarged sectional view showing a state of removal after molding. 10...Printed circuit board, 14...Through hole,
15... Circuit pattern, 20... Pattern sheet, 21... Carrier sheet, 23... Circuit pattern, 30... Cavity, 40... Fixed plate, 4
1...Movable plate, 50...Injection machine.
Claims (1)
の基板形状を有しかつ透孔部を形成するためのピ
ンを立設したキヤビテイを設け、 可動盤側には、基板の表面形状を規定するキヤ
ビテイプレートを設けかつ該キヤビテイプレート
をはさんで送りローラおよび巻取りローラを配置
し、該両ローラによつて、キヤリアシートの上面
側にプリント回路を構成する回路パターンおよび
その上面に接着層が形成されたパターンシートを
前記キヤリアシートが前記キヤビテイプレート側
となるように配し、 型閉め後、前記キヤビテイに基板を構成する溶
融樹脂を注入して前記接着層を介して前記回路パ
ターンと一体に基板を成形し、 しかる後、可動盤を移動して型開きすることに
よつて、前記成形品表面のキヤリアシートを成形
品表面から分離除去して透孔部を有するプリント
回路基板を得る ことを特徴とするプリント回路基板の製造方法。[Scope of Claims] 1. A cavity having a predetermined substrate shape and having pins erected thereon for forming through holes is provided on the fixed platen side of the mold device of the injection molding device, and on the movable platen side. A cavity plate is provided that defines the surface shape of the substrate, and a feed roller and a take-up roller are arranged across the cavity plate, and a printed circuit is configured on the upper surface side of the carrier sheet by these rollers. A pattern sheet with a circuit pattern and an adhesive layer formed on its upper surface is arranged with the carrier sheet facing the cavity plate, and after closing the mold, molten resin constituting the substrate is injected into the cavity to form the adhesive. A substrate is molded integrally with the circuit pattern through the layers, and then the carrier sheet on the surface of the molded product is separated and removed from the surface of the molded product by moving the movable platen and opening the mold. 1. A method of manufacturing a printed circuit board, the method comprising: obtaining a printed circuit board having a portion of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26252986A JPS63164294A (en) | 1986-11-04 | 1986-11-04 | Injection molding of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26252986A JPS63164294A (en) | 1986-11-04 | 1986-11-04 | Injection molding of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63164294A JPS63164294A (en) | 1988-07-07 |
| JPH0368554B2 true JPH0368554B2 (en) | 1991-10-28 |
Family
ID=17377062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26252986A Granted JPS63164294A (en) | 1986-11-04 | 1986-11-04 | Injection molding of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164294A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4944087A (en) * | 1988-10-05 | 1990-07-31 | Rogers Corporation | Method of making a curved plastic body with circuit pattern |
| JPH10163660A (en) * | 1996-11-29 | 1998-06-19 | Hitachi Ltd | Air-cooling electronic device |
| JP3552559B2 (en) * | 1998-03-11 | 2004-08-11 | 株式会社デンソー | Heating element cooling device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61102093A (en) * | 1984-10-25 | 1986-05-20 | シャープ株式会社 | Manufacture of printed circuit board |
-
1986
- 1986-11-04 JP JP26252986A patent/JPS63164294A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61102093A (en) * | 1984-10-25 | 1986-05-20 | シャープ株式会社 | Manufacture of printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63164294A (en) | 1988-07-07 |
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