JPS63164294A - Injection molding of printed circuit board - Google Patents
Injection molding of printed circuit boardInfo
- Publication number
- JPS63164294A JPS63164294A JP26252986A JP26252986A JPS63164294A JP S63164294 A JPS63164294 A JP S63164294A JP 26252986 A JP26252986 A JP 26252986A JP 26252986 A JP26252986 A JP 26252986A JP S63164294 A JPS63164294 A JP S63164294A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit pattern
- cavity
- injection molding
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001746 injection moulding Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 238000000465 moulding Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 （産業上の利用分野） この発明はプリント回路基板の射出成形方法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for injection molding printed circuit boards.
（従来の技術）
従来のプリント回路基板の製法としては、例えば銅板と
ノ＾板材をホ・ントプレスで積層した後この銅板面をエ
ツチングによって回路パターンに加工する方Ｕ、や、あ
るいは基板材に導電性インクをスクリーン印刷したり無
電解メッキによって回路パターンを形成する方法が多用
されている。(Prior art) Conventional methods for producing printed circuit boards include, for example, laminating copper plates and plate materials using a hot press and then etching the surface of the copper plate to form a circuit pattern. Methods of forming circuit patterns by screen-printing transparent ink or electroless plating are often used.
近年、基板の素材として、従来のガラスエポキシ等に代
って、耐熱性および電気特性に優れたポリサルフォン、
ポリエーテルサルフォン、ポリエーテルイミド等の熱可
塑性樹脂が出現し、この熱可塑性樹脂によって基板本体
を射出成形する試みが行なわれている。この射出成形に
よるノ＾板本体の成形にあっては、該素材樹脂が有する
耐熱性および誘電率、誘電正接等の電気特性の向上に加
えて、基板形状１孔および取付部等の付加形状を一体に
成形でき、従来のような爾後の切削やプレス等の後加工
が不要になるという大きな利点を有している。この射出
成形によって得られた基板本体は前述した印刷またはメ
ッキ等の手段によってその表面に回路パターンが形成さ
れる。In recent years, polysulfone, which has excellent heat resistance and electrical properties, has been used as a material for substrates, replacing conventional glass epoxy.
Thermoplastic resins such as polyether sulfone and polyetherimide have appeared, and attempts have been made to injection mold substrate bodies using these thermoplastic resins. In molding the main body of the plate by injection molding, in addition to improving the heat resistance, dielectric constant, and electrical properties of the resin material, such as dielectric loss tangent, we also improve the additional shapes such as the board shape 1 hole and the mounting part. It has the great advantage of being able to be molded in one piece and eliminating the need for post-processing such as cutting and pressing as in the past. A circuit pattern is formed on the surface of the substrate body obtained by this injection molding by the above-mentioned printing, plating, or other means.
（５ｉ！明が解決しようとする問題点）この発明は、−
ヒ述の従来技術を背景として、ノ＾板の射出成形時に、
回路部も一体に成形することを提案するものである。(Problem that 5i! Ming tries to solve) This invention is -
Based on the conventional technology mentioned above, during injection molding of the plate,
It is proposed that the circuit section also be integrally molded.
すなわち、上述した従来技術にあっては、７！板の射出
成形後に１回路部の形成工程を必要とするのであるが、
この発明では、基板の射出成形と同時に回路部を形成す
ることによって、この種のプリント回路基板の製造工程
を飛躍的に簡略化し、かつ効率化しようとするものであ
る。That is, in the prior art described above, 7! It requires a process to form one circuit part after injection molding of the plate, but
The present invention aims to dramatically simplify and improve the efficiency of the manufacturing process for this type of printed circuit board by forming the circuit portion at the same time as the injection molding of the board.
（問題点を解決するための手段）
すなわち、この発明に係るプリント回路基板の射出成形
方法は、基板形状を有しかつ透孔部を形成するためのピ
ンを立設したキャビティ内に、プリント回路を構成する
回路パターンをキャリアシートとともに、その回路パタ
ーンがキャビティ側となるように配し、該キャビティに
基板を構成する溶融樹脂を注入して前記回路パターンと
一体に基板を成形し、しかる後前記成形品表面のキャリ
アシートを除去して透孔部を有するプリント回路基板を
得ることを特徴とする方法に係る。(Means for Solving the Problems) That is, in the injection molding method for a printed circuit board according to the present invention, a printed circuit board is molded into a cavity having a board shape and in which a pin for forming a through hole is provided. A circuit pattern constituting the circuit pattern is placed together with a carrier sheet so that the circuit pattern is on the cavity side, and a molten resin constituting the substrate is injected into the cavity to mold the substrate integrally with the circuit pattern. The present invention relates to a method characterized by removing a carrier sheet on the surface of a molded product to obtain a printed circuit board having through holes.
（作用）
この発明では、基板の射出成形時に、プリント回路を構
成する回路パターンがキャリアシートとともにキャビテ
ィに配設される。このとき回路パターンがキャビティ側
となるように配され、基板を構成する溶融樹脂の注入に
よって該回路パターンは一体に接合される。このキャビ
ティ内には透孔部を形成するためのピンがケ設されてい
て、該ピンの先端は回路パターンに密に当接される。(Function) In the present invention, a circuit pattern constituting a printed circuit is placed in a cavity together with a carrier sheet during injection molding of a substrate. At this time, the circuit pattern is arranged so as to face the cavity, and the circuit pattern is joined together by injecting the molten resin constituting the substrate. A pin for forming a through hole is provided in this cavity, and the tip of the pin is brought into close contact with the circuit pattern.
基板が回路パターンとともに一体に成形された後、１核
成形品からその表面のキャリアシート部分が除去される
。キャリアシートの除去によって回路パターンが成形基
板表面に現出し、これによって透孔部を一体に有するプ
リント基板が得られる。After the substrate is integrally molded with the circuit pattern, the surface carrier sheet portion is removed from the mononuclear molded product. By removing the carrier sheet, the circuit pattern is exposed on the surface of the molded substrate, thereby obtaining a printed circuit board having integrally formed through holes.
（実施例） 以下添付の図面に従って実施例を説明する。(Example) Embodiments will be described below with reference to the accompanying drawings.
添付の図面の第１図はこの発明によって得られたプリン
ト回路基板の全体斜視図、第２図はこの発り１方法を実
施する射出成形金型の要部の断面図。FIG. 1 of the accompanying drawings is an overall perspective view of a printed circuit board obtained by the present invention, and FIG. 2 is a cross-sectional view of the main parts of an injection mold for carrying out this first method.
第３図はこの発明に使用されるパターンシートの断面図
、第４図は成形状態を示す金型の一部拡大断面図、第５
図は同じく成形後の取出状態を表す一部拡大断面図であ
る。Fig. 3 is a sectional view of a pattern sheet used in the present invention, Fig. 4 is a partially enlarged sectional view of a mold showing the molding state, and Fig. 5
The figure is also a partially enlarged sectional view showing the state of removal after molding.
第１図に図示したように、この発明は透孔部１４．１４
・・・と必要に応じて設けられる取付部１２等とを一体
に有する基板本体１１の表面に銅箔等の導電材からなる
回路パターン１５を形成したプリント基板１０を得る方
法に係る。As illustrated in FIG.
The present invention relates to a method for obtaining a printed circuit board 10 in which a circuit pattern 15 made of a conductive material such as copper foil is formed on the surface of a board main body 11 that integrally has a mounting portion 12 and the like provided as necessary.
第２図には、この発明方法を実施する金型装置が示され
る。すなわち、一方の金型、実施例では固定＠４０側に
は基板形状を有しかつ透孔部を形成するためのピン３５
．３５・・・を立設したキャビティ３０が、底部キャビ
ティプレート３１および側部キャビティプレート３２に
よって形成される。FIG. 2 shows a mold apparatus for carrying out the method of the invention. That is, one of the molds, in the example, the fixed @ 40 side has a pin 35 that has a substrate shape and is used to form a through hole.
．． A cavity 30 having 35 . . . erected is formed by a bottom cavity plate 31 and a side cavity plate 32.
他方の金型、実施例では可動盤４１側には基板表面形状
を規定する上部キャビティプレート３３が設けられる。The other mold, in the embodiment, the movable platen 41 side is provided with an upper cavity plate 33 that defines the substrate surface shape.
Ｌ部キャビティプレート３３は平面（または必要に応じ
て曲面）の板面状に形成されていて、この所定位置にプ
リント回路を構成する回路パターン２３がキャリアシー
ト２１とともに配される。The L-portion cavity plate 33 is formed into a flat (or curved, if necessary) plate shape, and a circuit pattern 23 constituting a printed circuit is disposed at a predetermined position along with the carrier sheet 21.
図示の実施例では、キャリアシート２１に回路パターン
２３が一体に形成されたパターンシート２０が使用され
る。In the illustrated embodiment, a pattern sheet 20 in which a circuit pattern 23 is integrally formed on a carrier sheet 21 is used.
第３図にはこのパターンシート２０の一例が示される。An example of this pattern sheet 20 is shown in FIG.
すなわち、このパターンシート２０は。That is, this pattern sheet 20 is.
ＰＥＴ等よりなるキャリアシー）２１に剥離剤２２を介
して銅箔等の導電材からなるよりなる回路パターン２３
が形成されてなるもので、回路パターン２３の上面側に
は成形時における基材樹脂との付着性を高めるために接
着層２４が形成されている。なお、キャリアシート２１
の背面側には成形時における該シートのずれを防ぐため
に粘着層２５が形成されている。A circuit pattern 23 made of a conductive material such as copper foil is applied to a carrier sheet 21 made of PET etc. via a release agent 22.
An adhesive layer 24 is formed on the upper surface side of the circuit pattern 23 to improve adhesion to the base resin during molding. In addition, carrier sheet 21
An adhesive layer 25 is formed on the back side of the sheet to prevent the sheet from shifting during molding.
パターンシート２０は、その回路パターン２３側がキャ
ビティ３０側となるように、所定のキャビティ位置に配
設される。第２図の符号４５は送りローラ、４６は巻き
取りローラ、４７はガイドローラである。The pattern sheet 20 is placed at a predetermined cavity position so that the circuit pattern 23 side thereof faces the cavity 30 side. Reference numeral 45 in FIG. 2 is a feed roller, 46 is a take-up roller, and 47 is a guide roller.
光電管（図示せず）等によって回路パターン２３が所定
のキャビティ３０位置に配されていることが確認された
後、型締めされて基材を構成する溶融樹脂が射出機５０
のノズル５２からスプル一孔３７を経て当該キャビティ
３０内に注入される。After confirming that the circuit pattern 23 is placed in the predetermined position of the cavity 30 using a phototube (not shown) or the like, the mold is clamped and the molten resin constituting the base material is transferred to the injection machine 50.
The sprue is injected from the nozzle 52 into the cavity 30 through the sprue hole 37.
なお、ここで使用される基材樹脂は例えばＰＥＳ。Note that the base resin used here is, for example, PES.
ＵＬＴＥＭ、ＰＰＳ、ＰＳＦ等の高融点（約４００℃）
を有する耐熱性樹脂であるので、射出機５０も高温用の
カートリッジ型ヒータ（リップヒータ）５５を用いた高
温仕様のものが用いられる。High melting point (approximately 400℃) such as ULTEM, PPS, PSF, etc.
Since the resin is heat-resistant, the injection machine 50 also uses a high-temperature specification using a cartridge-type heater (lip heater) 55 for high temperatures.
第３図の符号５１はスクリューを示す。Reference numeral 51 in FIG. 3 indicates a screw.
第４図は基板を構成する溶融樹脂Ｍ１がキャビティ３０
に充満した状態を示す拡大断面図であるが、同図のよう
に回路パターン２３は基板樹脂と一体に接合される。と
同時に、キャビティ３０内に立設されたピン３５．３５
・・・の先端は該回路パターン２３に密に当接する。Figure 4 shows that the molten resin M1 constituting the substrate is in the cavity 30.
2 is an enlarged cross-sectional view showing a state where the resin is filled with resin. As shown in the figure, the circuit pattern 23 is integrally bonded to the substrate resin. At the same time, a pin 35.35 installed upright in the cavity 30
The tips of . . . are in close contact with the circuit pattern 23.
Ｌ述した工程によって、基板本体が回路パターン２３と
ともに一体成形された後、該成形品からその表面のキャ
リアシート２１部分が除去される。After the substrate main body is integrally molded with the circuit pattern 23 through the steps described above, the portion of the carrier sheet 21 on the surface thereof is removed from the molded product.
実施例では、第２図から明らかなように、パターンシー
ト２０が送りローラ４５および巻取ローラ４６に保持さ
れているので、型開きによって自然にキャリアシート２
１の剥離がなされる。In the embodiment, as is clear from FIG. 2, since the pattern sheet 20 is held by the feed roller 45 and the take-up roller 46, the carrier sheet 2 is naturally moved when the mold is opened.
1 peeling is performed.
キャリアシート２１の除去によって回路パターン２３が
成形ノ＾板表面に現出し、これによって透孔部１４を一
体に有するプリント基板ｌＯが得られる。By removing the carrier sheet 21, the circuit pattern 23 appears on the surface of the molded board, thereby obtaining a printed circuit board 10 having the through hole 14 integrally.
第５図は成形後の脱型状態を示す拡大断面図である。実
施例では、成形後の成形品の型離れを良くするために、
キャビティ３０を底部キャビティプレート３１と側部キ
ャビティプレート３２とによって構成し、成形後に両キ
ャビティプレート３１．３２が図のように離間すること
により、成形品Ｍからビン３５を抜去して成形品の取り
出しが容易となるようになっている。同図の符号６０は
吸盤を備えた取出機である。FIG. 5 is an enlarged sectional view showing the demolded state after molding. In the example, in order to improve the mold release of the molded product after molding,
The cavity 30 is constituted by a bottom cavity plate 31 and a side cavity plate 32, and by separating both cavity plates 31 and 32 as shown in the figure after molding, it is possible to remove the bottle 35 from the molded product M and take out the molded product. This makes it easier. The reference numeral 60 in the figure is a take-out machine equipped with a suction cup.
なお、成形時においてピン３５先端が密にち接していた
回路パターン２３の当該部分２３ａは、８然溶融樹脂の
付着がないので、成形品に接合せず、キャリアシート２
１の剥ぎ取り時に該キャリアシート２１側に残留して一
体に除去される。Note that the portion 23a of the circuit pattern 23 that was in close contact with the tip of the pin 35 during molding is not bonded to the molded product and is not bonded to the carrier sheet 2 because there is no adhesion of molten resin.
1 remains on the carrier sheet 21 side and is removed as a whole.
（効果）
以上図示し説明したように、この発明方法によれば、基
板の射出成形と同時に該基板面に回路パターンの形成が
できるので、従来のような別工程によって回路パターン
を形成するための手間ならびに時間を省き、この種プリ
ント回路基板の製造工程を飛躍的に簡略化し、かつ効率
化することができるようになった。(Effects) As shown and explained above, according to the method of the present invention, a circuit pattern can be formed on the surface of the substrate at the same time as the injection molding of the substrate. It has become possible to save time and effort, dramatically simplifying the manufacturing process of this type of printed circuit board, and making it more efficient.
また、この発明によれば、従来困難とされていた１曲面
または異形面もしくは変形面等を有する基板に対しても
回路パターンをたやすく形成することができ、プリント
回路基板の用途を画期的に拡大することが可能となった
。Furthermore, according to the present invention, circuit patterns can be easily formed even on substrates having curved surfaces, irregularly shaped surfaces, deformed surfaces, etc., which have been considered difficult in the past, and the use of printed circuit boards is revolutionary. It became possible to expand.
このように、この発明は極めて実用性が高く、その効果
とするところは甚大である。As described above, this invention has extremely high practicality, and its effects are enormous.
第１図はこの発明によって得られたプリント回路基板の
全体斜視図、第２図はこの発明方法を実施する射出成形
金型の要部の断面図、第３図はこの発明に使用されるパ
ターンシートの断面図、第４図は成形状態を示す金型の
一部拡大断面図、第５図は回じ〈成形後の取出状態を表
す一部拡大断面図である。
ｌＯ・・・プリント回路基板、１４・・・透孔部、１５
・・・回路パターン、２０・・・パターンシート、２１
・・・キャリアシート、２３・・・ 回路パターン、３
０・・・キャビティ、４０・・・固定盤、４１・・・可
動盤。
５０・・・射出機。Fig. 1 is an overall perspective view of a printed circuit board obtained by this invention, Fig. 2 is a sectional view of the main parts of an injection mold for implementing the method of this invention, and Fig. 3 is a pattern used in this invention. A sectional view of the sheet, FIG. 4 is a partially enlarged sectional view of the mold showing the molding state, and FIG. 5 is a partially enlarged sectional view showing the state of removal after turning. lO...Printed circuit board, 14...Through hole, 15
...Circuit pattern, 20...Pattern sheet, 21
...Carrier sheet, 23... Circuit pattern, 3
0...Cavity, 40...Fixed plate, 41...Movable plate. 50... Injection machine.
Claims (1)
したキャビティ内に、プリント回路を構成する回路パタ
ーンをキャリアシートとともに、その回路パターンがキ
ャビティ側となるように配し、該キャビティに基板を構
成する溶融樹脂を注入して前記回路パターンと一体に基
板を成形し、しかる後前記成形品表面のキャリアシート
を除去して透孔部を有するプリント回路基板を得ること
を特徴とするプリント回路基板の射出成形方法。A circuit pattern constituting a printed circuit is placed together with a carrier sheet in a cavity having the shape of a substrate and in which pins are set up to form a through hole, and the circuit pattern is placed on the cavity side. A printed circuit board having a through hole is obtained by injecting a molten resin constituting the board into the board to mold the board integrally with the circuit pattern, and then removing the carrier sheet on the surface of the molded product. Injection molding method for printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26252986A JPS63164294A (en) | 1986-11-04 | 1986-11-04 | Injection molding of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26252986A JPS63164294A (en) | 1986-11-04 | 1986-11-04 | Injection molding of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63164294A true JPS63164294A (en) | 1988-07-07 |
| JPH0368554B2 JPH0368554B2 (en) | 1991-10-28 |
Family
ID=17377062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26252986A Granted JPS63164294A (en) | 1986-11-04 | 1986-11-04 | Injection molding of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164294A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03502025A (en) * | 1988-10-05 | 1991-05-09 | ロジヤース コーポレイシヨン | Curved plastic body with precision circuit pattern |
| US6135200A (en) * | 1998-03-11 | 2000-10-24 | Denso Corporation | Heat generating element cooling unit with louvers |
| US6185481B1 (en) * | 1996-11-29 | 2001-02-06 | Hitachi, Ltd. | Air cooled electronic equipment apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61102093A (en) * | 1984-10-25 | 1986-05-20 | シャープ株式会社 | Manufacture of printed circuit board |
-
1986
- 1986-11-04 JP JP26252986A patent/JPS63164294A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61102093A (en) * | 1984-10-25 | 1986-05-20 | シャープ株式会社 | Manufacture of printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03502025A (en) * | 1988-10-05 | 1991-05-09 | ロジヤース コーポレイシヨン | Curved plastic body with precision circuit pattern |
| US6185481B1 (en) * | 1996-11-29 | 2001-02-06 | Hitachi, Ltd. | Air cooled electronic equipment apparatus |
| US6135200A (en) * | 1998-03-11 | 2000-10-24 | Denso Corporation | Heat generating element cooling unit with louvers |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0368554B2 (en) | 1991-10-28 |
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