JPS60121791A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS60121791A JPS60121791A JP23037083A JP23037083A JPS60121791A JP S60121791 A JPS60121791 A JP S60121791A JP 23037083 A JP23037083 A JP 23037083A JP 23037083 A JP23037083 A JP 23037083A JP S60121791 A JPS60121791 A JP S60121791A
- Authority
- JP
- Japan
- Prior art keywords
- electric circuit
- printed wiring
- manufacturing
- wiring board
- base sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 11
- 238000012546 transfer Methods 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 229920005992 thermoplastic resin Polymers 0.000 claims description 6
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- 229920006393 polyether sulfone Polymers 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、印刷配線板、特に立体形状を呈する印刷配線
板の製造方法に関するものであり、更に詳しくは、射出
成形法にて印刷配線用基板を成形すると同時に、その基
板表面に電気回路を形成する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed wiring board, particularly a printed wiring board exhibiting a three-dimensional shape. The present invention relates to a method of forming an electric circuit on the surface of a substrate.
印刷配線板は、回路部品を接続する電気配線を回路設計
に基づいて配線パターンに表現したものを、絶縁基板上
に電気導体を再現したものであり、その用途は、機器の
電子化に伴い、全産業分野へと拡大されつつある。A printed wiring board is a reproduction of an electrical conductor on an insulated substrate, representing the electrical wiring that connects circuit components in a wiring pattern based on a circuit design. It is being expanded to all industrial fields.
従来、かかる印刷配線板の製造方法としては、印刷回路
用銅張積層板を用い、この上にレジストパターンを形成
し、その後、エツチング処理を施し、しかる後、前記レ
ジストパターンを除去することにより所望の電気回路を
有する印刷配線板を製造する方法が主流であった。しか
しながら、この方法は、印刷配線用基板の製造工程と電
気回路の形成工程とが別工程である上に、電気回路形成
後、回路部品を取り付けるための穴開けや面取り、打ち
抜きあるいは外形加工といった煩雑な機械的加」二が必
要なものであった。Conventionally, the method for manufacturing such printed wiring boards has been to use a copper-clad laminate for printed circuits, form a resist pattern thereon, then perform an etching process, and then remove the resist pattern to form the desired pattern. The mainstream method was to manufacture printed wiring boards with electrical circuits. However, in this method, the manufacturing process of the printed wiring board and the process of forming the electric circuit are separate processes, and after the electric circuit is formed, it requires complicated drilling, chamfering, punching, and external processing to attach the circuit components. A mechanical addition was necessary.
一方、最近、従来の印刷配線用基板を代替できる、充分
な耐熱性と誘電特性とを持った熱可塑性樹脂が開発され
、かかる樹脂を用いて射出成形法にて印刷配線用基板を
製造する方法が提案されている。この方法によると、印
刷配線用基板は、予め所望の形状に成形しておくことが
できるので、電気回路形成後の穴開けや面取り、打ち抜
きあるいは外形加工といった煩雑な機械的加工が殆ど要
らず、複雑な形状の基板でも容易にしかも安価に製造す
ることができるものである。そして将来的には、回路部
品を支えたり、集合的に取り付けるための突起や、段付
のコンタクト・バンド、配線部のアウトライン、コネク
タ・ハウジング等を備えた、公差の厳しい立体基板の製
造も可能なものである。On the other hand, recently, thermoplastic resins with sufficient heat resistance and dielectric properties that can replace conventional printed wiring boards have been developed, and there is a method of manufacturing printed wiring boards by injection molding using such resins. is proposed. According to this method, the printed wiring board can be formed into a desired shape in advance, so there is almost no need for complicated mechanical processing such as drilling, chamfering, punching, or contour processing after forming the electric circuit. Even substrates with complex shapes can be manufactured easily and at low cost. In the future, it will also be possible to produce three-dimensional boards with tight tolerances, including protrusions for supporting and collectively mounting circuit components, stepped contact bands, wiring outlines, connector housings, etc. It is something.
しかしながら、前記方法においても、印刷配線用基板の
成形後に、電気回路を形成するという工程が必要であり
、しかも銅張りが不可能なため銅クラツドがなく、従っ
て、フルアディティブ・メッキ法等を用いて電気回路を
形成する工程、即ち、該基板上に紫外線硬化型の触媒層
を塗布し、次にマスクを通して紫外光を照射して配線部
だけ触媒層のパターンを残し、その後、無電解メッキを
施すことによって電気回路を形成するという工程が必要
なものであった。従って、この電気回路形成工程が煩雑
な上に、特に立体形状を呈する基板上に電気回路を形成
することは、技術的に困難なものであった。However, even in the above method, a step of forming an electric circuit is required after molding the printed wiring board, and there is no copper cladding because copper plating is not possible, so full additive plating method etc. The process of forming an electric circuit by applying an ultraviolet curing catalyst layer onto the substrate, then irradiating ultraviolet light through a mask to leave a pattern of the catalyst layer only in the wiring area, and then electroless plating is applied. This required the process of forming an electric circuit by applying the method. Therefore, not only is this process of forming an electric circuit complicated, but it is also technically difficult to form an electric circuit on a substrate having a three-dimensional shape.
本発明者らは、前記した問題点を解消するため、印刷配
線板、特に立体形状を呈する印刷配線板を容易な工程に
て効率的に製造する方法を得ることを目的として種々研
究した結果、本発明を完成するに至ったものである。即
ち、本発明は、剥離性を有する基体シート上に電気回路
パターンが形成された転写シートを射出成形用金型内に
載置し、その後、溶融した耐熱性の熱可塑性樹脂を該金
型内に射出することにより前記電気回路パターンを成形
された基板上に設け、しかる後、前記基体シートを剥離
することを特徴とする印刷配線板の１造方法である。In order to solve the above-mentioned problems, the present inventors conducted various research aimed at obtaining a method for efficiently manufacturing printed wiring boards, especially printed wiring boards exhibiting a three-dimensional shape, through easy steps. This has led to the completion of the present invention. That is, in the present invention, a transfer sheet in which an electric circuit pattern is formed on a releasable base sheet is placed in an injection mold, and then a molten heat-resistant thermoplastic resin is poured into the mold. This method of manufacturing a printed wiring board is characterized in that the electric circuit pattern is provided on a molded substrate by injection, and then the base sheet is peeled off.
以下、本発明について図面を用い詳細に説明する。Hereinafter, the present invention will be explained in detail using the drawings.
先ず、本発明に使用する転写シートについて説明する。First, the transfer sheet used in the present invention will be explained.
本発明に使用する転写シートは、剥離性を有する基体シ
ート上に電気回路パターンを形成してなるものである。The transfer sheet used in the present invention has an electrical circuit pattern formed on a releasable base sheet.
基体シートとしては、耐熱性を有するプラスチックスフ
ィルムを使用することができ、例えば、ポリエステルフ
ィルム、ポリエチレンフィルム、ポリプロピレンフィル
ム、ナイロンフィルム等があり、中でも耐熱性、成形性
、寸法安定性等の性質に優れたポリエステルフィルムが
好適である。As the base sheet, heat-resistant plastic films can be used, such as polyester films, polyethylene films, polypropylene films, nylon films, etc. A superior polyester film is preferred.
前記基体シート上に適宜の手段にて離型処理を施した後
、その上に、所望の電気回路パターンを形成する。After performing a mold release treatment on the base sheet by an appropriate means, a desired electric circuit pattern is formed thereon.
電気回路パターンは、銀、銅、カーボン等の導電性ベー
ストインキを用い、スクリーン印刷法、オフセット印刷
法、グラビア印刷法等の適宜の手段にて形成する。The electric circuit pattern is formed using a conductive base ink such as silver, copper, or carbon by an appropriate method such as screen printing, offset printing, or gravure printing.
形成手段として前記したような印刷法を用いた場合は、
複雑なパターンでも容易に形成することができるもので
あり、且つ連続的に形成することも容易である。When the above-mentioned printing method is used as a forming means,
Even complex patterns can be easily formed, and it is also easy to form them continuously.
本発明に係る転写シートは、基体シート上に前記電気回
路パターンを形成しておく他、印刷配線板のパッケージ
の固有番号、部品の取付場所及び部品記号等を標示する
シンボルマーク、はんだ付は時の細線又は端子間のはん
だブリッジ防止用はんだレジスト等を成形しておくこと
も可能である。In addition to forming the electric circuit pattern on the base sheet, the transfer sheet according to the present invention also includes a symbol mark indicating the unique number of the package of the printed wiring board, the mounting location of the component, the component symbol, etc., and the soldering time. It is also possible to form a thin wire or a solder resist for preventing solder bridges between terminals.
次に前記した構成からなる転写シートを用い、電気回路
を有するプリント基板を製造する工程について説明する
。Next, a process of manufacturing a printed circuit board having an electric circuit using a transfer sheet having the above-described structure will be described.
先ず、前記転写シートを印刷配線板成形用の射出成形用
金型内の所定の位置に載置する。この際、電気回路パタ
ーンと後述する射出成形用材料とが接するように載置す
る。First, the transfer sheet is placed at a predetermined position in an injection mold for molding a printed wiring board. At this time, the electrical circuit pattern is placed so as to be in contact with the injection molding material described later.
次に、前記金型を閉じた後、射出成形用溶融樹脂を前記
金型内に射出する。本発明において使用することができ
る樹脂は、充分な耐熱性と誘電特性とを持った熱可塑性
樹脂であり、例えば、ポリサルホン、ポリエーテルサル
ホン、ポリエーテルイミド等を使用することができる。Next, after closing the mold, a molten resin for injection molding is injected into the mold. The resin that can be used in the present invention is a thermoplastic resin having sufficient heat resistance and dielectric properties, such as polysulfone, polyethersulfone, polyetherimide, and the like.
これらの樹脂は、従来、一般的に用いられていたガラス
・エポキシ積層板と比較して温度特性、誘電特性におい
て極めて優れたものであり、特に連続使用温度は１５０
℃以上であり、誘電正接や誘電率が低く、通常の温度及
び周波数範囲では殆ど一定である。また、長時間使用し
ても絶縁抵抗は高く、ＣＡ、 Ｆ成長（導電性陽極繊維
成長）に対し”ζ高い抵抗値を示すものである。なお、
これらの樹脂中に、材料の特性等を調整するために、適
宜、ガラス繊維やタルク、酸化チタンといったフィシま
たは添加剤を加えてもよい。These resins have extremely superior temperature characteristics and dielectric properties compared to conventionally commonly used glass-epoxy laminates, and in particular, the continuous use temperature is 150°C.
℃ or higher, the dielectric loss tangent and dielectric constant are low, and are almost constant in normal temperature and frequency ranges. In addition, the insulation resistance is high even when used for a long time, and it shows a high resistance value against CA and F growth (conductive anode fiber growth).
In order to adjust the properties of the material, fibers or additives such as glass fiber, talc, and titanium oxide may be added to these resins as appropriate.
次に、前記金型内から成型された基板を取り出す。この
際、基板表面から前記基体シートを剥離する。Next, the molded substrate is taken out from the mold. At this time, the base sheet is peeled off from the substrate surface.
このようにすることによって、前記電気回路パターンは
基体シートから離れ基板に密着し、所望の電気回路を有
する印刷配線板を得ることができる。By doing so, the electric circuit pattern is separated from the base sheet and brought into close contact with the substrate, thereby making it possible to obtain a printed wiring board having a desired electric circuit.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
〈実施例１〉
メラミン樹脂で離型処理を施した厚さ２５μｍのポリエ
チレンテレフタレートフィルム上に、導電ペースト（藤
倉化成製ドータイｌ−Ｆ７４６）を用いてスクリーン印
刷し、その上に接着剤（大日精華製Ｐ−２７）を用いて
グラビア印刷法にて３μｍ厚にオーバーコートして転写
シートを作製した。<Example 1> A conductive paste (Dotai l-F746 manufactured by Fujikura Kasei Co., Ltd.) was screen printed on a polyethylene terephthalate film with a thickness of 25 μm that had been subjected to mold release treatment with melamine resin, and an adhesive (Dainichi Co., Ltd. A transfer sheet was prepared by overcoating to a thickness of 3 μm using Gravure printing using Seika P-27).
その後、この転写シートを印刷配線板成形用の射出成形
用金型内の所定の位置に載置した。この際、前記オーバ
ーコート層と射出成形用材料とが接するように載置する
。Thereafter, this transfer sheet was placed at a predetermined position in an injection mold for molding a printed wiring board. At this time, the overcoat layer and the injection molding material are placed so as to be in contact with each other.
次に前記金型を閉じた後、加熱溶融したポリザルホンを
下記の条件で射出した。Next, after closing the mold, heated and melted polysulfone was injected under the following conditions.
・シリンダ一温度（’Ｃ）
後部 ３００ 中部 ３３０ 前部 ３３０ノズル温度
（°Ｃ）
４０
・樹脂温度（’Ｃ）
２３０〜２４０
・金型温度（℃）
１０
・射出圧力（ｋｇ ／ ｃｄ）
一次圧 １００〇 二次圧 ７００〜８００背圧 ７
・スクリュー回転数（Ｒ１）Ｍ ）
０
次に、前記金型内から、成形された基板を取り出し、基
体シートを剥離した。・Cylinder temperature ('C) Rear 300 Middle 330 Front 330 Nozzle temperature (°C) 40 ・Resin temperature ('C) 230-240 ・Mold temperature (℃) 10 ・Injection pressure (kg/cd) Primary pressure 100〇 Secondary pressure 700-800 Back pressure 7 Screw rotation speed (R1) M) 0 Next, the molded substrate was taken out from the mold, and the base sheet was peeled off.
このようにすることによって、所望の電気回路を有する
印刷配線板を得た。By doing so, a printed wiring board having a desired electric circuit was obtained.
本発明に係る印刷配線板の製造方法は、以上のような構
成からなるものであるから次のような効果を有するもの
である。即ち、印刷配線用基板の成形加工と、成形後の
穴開け、面取り、打ち抜き等の２次的な機械加工と、所
望の電気回路形成加工とを一度に同時に形成することが
できるものであるから、所望の電気回路を有する印刷配
線板を容易な工程にて効率的に製造することができ、更
に立体形状を呈する印刷配線板をも容易に製造すること
ができるものである。しかも本発明に係る製造方法は、
連続的に行うことも容易なものであるから量産性にも優
れたものである。Since the method for manufacturing a printed wiring board according to the present invention has the above configuration, it has the following effects. That is, it is possible to simultaneously form the printed wiring board, secondary machining such as drilling, chamfering, punching, etc. after molding, and forming the desired electric circuit at the same time. , a printed wiring board having a desired electric circuit can be efficiently manufactured in a simple process, and furthermore, a printed wiring board having a three-dimensional shape can also be easily manufactured. Moreover, the manufacturing method according to the present invention
Since it is easy to carry out continuously, it is also excellent in mass production.
従って、本発明は、産業上、極めて有用な、価値のある
印刷配線板の製造方法である。Therefore, the present invention is an industrially extremely useful and valuable method for manufacturing printed wiring boards.
特許出願人 日本写真印刷株式会社patent applicant Nissha Printing Co., Ltd.
Claims (1)
が形成された転写シートを射出成形用金型内に載置し、
その後、溶融した耐熱性の熱可塑性樹脂を該金型内に射
出することにより前記電気回路パターンを成形された基
板上に設け、しかる後、前記基体シートを剥離すること
を特徴とする印刷配線板の製造方法。 （２）耐熱性の熱可塑性樹脂として、ポリサルホン、ポ
リエーテルサルホン及びポリエーテルイミドからなる群
より選ばれたひとつの熱可塑性樹脂を用いることを特徴
とする特許請求の範囲第１項記載の印刷配線様の製造方
法。 （３）転写シートが、離型処理が施された基体シート上
に、電気回路パターンが印刷法にて形成され、その上に
接着剤層が形成されたものであることを特徴とする特許
請求の範囲第１項記載の印刷配線板の製造方法。[Claims] (11) A transfer sheet having an electric circuit pattern formed on a releasable base sheet is placed in an injection mold,
Thereafter, the electrical circuit pattern is provided on the molded substrate by injecting a molten heat-resistant thermoplastic resin into the mold, and then the base sheet is peeled off. manufacturing method. (2) The printing according to claim 1, characterized in that one thermoplastic resin selected from the group consisting of polysulfone, polyethersulfone, and polyetherimide is used as the heat-resistant thermoplastic resin. Manufacturing method for wiring. (3) A patent claim characterized in that the transfer sheet is one in which an electric circuit pattern is formed by a printing method on a base sheet that has been subjected to a release treatment, and an adhesive layer is formed thereon. A method for manufacturing a printed wiring board according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23037083A JPS60121791A (en) | 1983-12-05 | 1983-12-05 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23037083A JPS60121791A (en) | 1983-12-05 | 1983-12-05 | Method of producing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60121791A true JPS60121791A (en) | 1985-06-29 |
Family
ID=16906792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23037083A Pending JPS60121791A (en) | 1983-12-05 | 1983-12-05 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60121791A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1987004315A1 (en) * | 1985-12-28 | 1987-07-16 | Nissha Printing Co., Ltd. | Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof |
| JPS62165993A (en) * | 1986-01-17 | 1987-07-22 | 凸版印刷株式会社 | Manufacturing method of three-dimensional circuit wiring molded product |
| JPS63104396A (en) * | 1986-10-21 | 1988-05-09 | 宇部興産株式会社 | Method of forming circuit pattern on housing surface in one-piece |
| US4867839A (en) * | 1987-09-04 | 1989-09-19 | Shinko Electric Industries Co., Ltd. | Process for forming a circuit substrate |
| US4868047A (en) * | 1987-02-20 | 1989-09-19 | Furukawa Denki Kogyo Kabushiki Kaisha | Printed wiring board |
| US4908940A (en) * | 1987-06-22 | 1990-03-20 | The Furukawa Electric Co., Ltd. | Method of manufacturing two-layer printed circuit sheet |
| US4914259A (en) * | 1987-09-08 | 1990-04-03 | The Furukawa Electric Co., Ltd. | Molded circuit board |
| JPH05283849A (en) * | 1992-03-31 | 1993-10-29 | Nitto Boseki Co Ltd | Method and apparatus for manufacturing three-dimensional molding circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55153392A (en) * | 1979-05-17 | 1980-11-29 | Sumitomo Bakelite Co | Method of forming circuit |
| JPS564460A (en) * | 1979-04-30 | 1981-01-17 | Kollmorgen Tech Corp | Laminate blank which its surface is made of polysulfon |
| JPS56100492A (en) * | 1973-05-03 | 1981-08-12 | Exxon Research Engineering Co | Fine air bubble heterocyclic polymer structure |
-
1983
- 1983-12-05 JP JP23037083A patent/JPS60121791A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100492A (en) * | 1973-05-03 | 1981-08-12 | Exxon Research Engineering Co | Fine air bubble heterocyclic polymer structure |
| JPS564460A (en) * | 1979-04-30 | 1981-01-17 | Kollmorgen Tech Corp | Laminate blank which its surface is made of polysulfon |
| JPS55153392A (en) * | 1979-05-17 | 1980-11-29 | Sumitomo Bakelite Co | Method of forming circuit |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1987004315A1 (en) * | 1985-12-28 | 1987-07-16 | Nissha Printing Co., Ltd. | Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof |
| JPS62165993A (en) * | 1986-01-17 | 1987-07-22 | 凸版印刷株式会社 | Manufacturing method of three-dimensional circuit wiring molded product |
| JPS63104396A (en) * | 1986-10-21 | 1988-05-09 | 宇部興産株式会社 | Method of forming circuit pattern on housing surface in one-piece |
| US4868047A (en) * | 1987-02-20 | 1989-09-19 | Furukawa Denki Kogyo Kabushiki Kaisha | Printed wiring board |
| US4908940A (en) * | 1987-06-22 | 1990-03-20 | The Furukawa Electric Co., Ltd. | Method of manufacturing two-layer printed circuit sheet |
| US4867839A (en) * | 1987-09-04 | 1989-09-19 | Shinko Electric Industries Co., Ltd. | Process for forming a circuit substrate |
| US4914259A (en) * | 1987-09-08 | 1990-04-03 | The Furukawa Electric Co., Ltd. | Molded circuit board |
| JPH05283849A (en) * | 1992-03-31 | 1993-10-29 | Nitto Boseki Co Ltd | Method and apparatus for manufacturing three-dimensional molding circuit board |
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