JPS6428997A - Electromagnetic wave shield molding - Google Patents

Electromagnetic wave shield molding

Info

Publication number
JPS6428997A
JPS6428997A JP18609187A JP18609187A JPS6428997A JP S6428997 A JPS6428997 A JP S6428997A JP 18609187 A JP18609187 A JP 18609187A JP 18609187 A JP18609187 A JP 18609187A JP S6428997 A JPS6428997 A JP S6428997A
Authority
JP
Japan
Prior art keywords
housing
electromagnetic wave
molding
film
wave shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18609187A
Other languages
Japanese (ja)
Other versions
JPH0557757B2 (en
Inventor
Shinichi Wakita
Fumio Nakaya
Hisatoshi Murakami
Tsunehiko Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP18609187A priority Critical patent/JPS6428997A/en
Publication of JPS6428997A publication Critical patent/JPS6428997A/en
Publication of JPH0557757B2 publication Critical patent/JPH0557757B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811Multilayered articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0011Electromagnetic wave shielding material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To obtain an electromagnetic shielding molding having a light weight and uniform thickness of a film by providing an electromagnetic wave shielding layer formed by thermally transferring a conductive layer on the surface of a plastic molding housing. CONSTITUTION:An electromagnetic wave shielding molding 2 is formed of a housing 4 and an electromagnetic wave shielding layer 6 provided on the inner surface of the housing. The housing 4 is formed of one rectangular upper bottom plate 4a, and 4 side plates 4b in contact with the outer edges, and of a plastic molding formed by injection molding. The layer 6 is formed by thermally transferring a conductive layer obtained by coating by a printing method conductive paste on a film and thermally curing it to the whole inner surface of the housing 4 from the film in case of injection molding the housing 4, and formed of one bottom portion 6a and 4 side faces 6b corresponding to one upper bottom plate 4a and 4 side plates 4b of the housing 4, respectively.
JP18609187A 1987-07-24 1987-07-24 Electromagnetic wave shield molding Granted JPS6428997A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18609187A JPS6428997A (en) 1987-07-24 1987-07-24 Electromagnetic wave shield molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18609187A JPS6428997A (en) 1987-07-24 1987-07-24 Electromagnetic wave shield molding

Publications (2)

Publication Number Publication Date
JPS6428997A true JPS6428997A (en) 1989-01-31
JPH0557757B2 JPH0557757B2 (en) 1993-08-24

Family

ID=16182211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18609187A Granted JPS6428997A (en) 1987-07-24 1987-07-24 Electromagnetic wave shield molding

Country Status (1)

Country Link
JP (1) JPS6428997A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05145265A (en) * 1991-11-15 1993-06-11 Nissha Printing Co Ltd Manufacture of electromagnetic wave shielding molded item

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61225900A (en) * 1985-03-29 1986-10-07 大日本印刷株式会社 Transfer sheet for shielding electromagnetic wave

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61225900A (en) * 1985-03-29 1986-10-07 大日本印刷株式会社 Transfer sheet for shielding electromagnetic wave

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05145265A (en) * 1991-11-15 1993-06-11 Nissha Printing Co Ltd Manufacture of electromagnetic wave shielding molded item

Also Published As

Publication number Publication date
JPH0557757B2 (en) 1993-08-24

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees