JPH0557757B2 - - Google Patents
Info
- Publication number
- JPH0557757B2 JPH0557757B2 JP62186091A JP18609187A JPH0557757B2 JP H0557757 B2 JPH0557757 B2 JP H0557757B2 JP 62186091 A JP62186091 A JP 62186091A JP 18609187 A JP18609187 A JP 18609187A JP H0557757 B2 JPH0557757 B2 JP H0557757B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- conductive
- paste
- housing
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000004033 plastic Substances 0.000 claims description 15
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 14
- 229930195729 fatty acid Natural products 0.000 claims description 14
- 239000000194 fatty acid Substances 0.000 claims description 14
- 150000004665 fatty acids Chemical class 0.000 claims description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 239000013522 chelant Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000011134 resol-type phenolic resin Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0011—Electromagnetic wave shielding material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、電磁波遮蔽成形体に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an electromagnetic shielding molded article.
［従来の技術とその問題点］
従来、電気機器の軽量化を目的としてプラスチ
ツク成形体からなるハウジングが用いられてき
た。ところが、プラスチツクには電磁波遮蔽効果
がないため、電磁波ノイズによつてこの電気機器
が誤動作したり、この機器内で発生した電磁波が
外部に影響を及ぼすという問題があつた。したが
つて、プラスチツク製のハウジングに導電性を付
与して電磁波遮蔽成形体とすることが求められて
いる。[Prior Art and its Problems] Conventionally, housings made of plastic molded bodies have been used for the purpose of reducing the weight of electrical equipment. However, since plastic does not have the effect of shielding electromagnetic waves, there have been problems such as the electrical equipment malfunctioning due to electromagnetic noise and the electromagnetic waves generated within the equipment affecting the outside. Therefore, there is a need for a plastic housing to be made electroconductive and to be made into an electromagnetic shielding molded body.
従来、この電磁波遮蔽成形体として次のものが
知られているが、それぞれ問題があつた。 Conventionally, the following electromagnetic wave shielding molded bodies have been known, but each of them has had its problems.
例えば、ハウジングを形成するプラスチツク組
成物中に金属フイラーを混入したものがあるが、
これはコストアツプとなるばかりでなく、製造の
際に成形機を損傷するおそれがある。これとは別
に、成形済みハウジングの表面に亜鉛等を溶射し
て金属被膜を形成したものがあるが、被膜の厚さ
を均一にすることができないために十分な電磁波
遮蔽効果が得られない。また、成形済みハウジン
グの表面に金属フイラーを混入した導電性塗料を
スプレー塗りしたものは、ハウジングの表面に導
電性被膜を形成した点では亜鉛溶射によるものと
同一であつてコストを低くすることができるもの
の、膜厚を均一にすることができないため十分な
電磁波遮蔽効果が得られないばかりでなく、製造
中において乾燥時に出る溶剤によつて作業環境が
悪化するという問題があつた。 For example, some metal fillers are mixed into the plastic composition that forms the housing.
This not only increases costs, but also risks damaging the molding machine during manufacturing. Apart from this, there is a method in which a metal coating is formed by thermally spraying zinc or the like on the surface of a molded housing, but since the thickness of the coating cannot be made uniform, a sufficient electromagnetic wave shielding effect cannot be obtained. In addition, spray coating the surface of a pre-formed housing with conductive paint mixed with metal filler is the same as zinc spraying in that it forms a conductive coating on the surface of the housing, and can reduce costs. Although it is possible to do so, not only is it not possible to obtain a sufficient electromagnetic wave shielding effect because the film thickness cannot be made uniform, but there are also problems in that the working environment is deteriorated by the solvent released during drying during manufacturing.
本発明は、軽量であつて、しかも上記の問題の
ない電磁波遮蔽成形体を提供することを目的とす
る。 SUMMARY OF THE INVENTION An object of the present invention is to provide an electromagnetic shielding molded article that is lightweight and free from the above-mentioned problems.
［問題点を解決するための手段］
本発明は、プラスチツク成形ハウジングの表面
に、フイルムに導電ペーストを塗布し熱硬化処理
を施して得られた導電性層を熱転写してなる電磁
波遮蔽層を設けてなる成形体であつて、前記導電
性層となる導電ペーストが、金属銅粉と、レゾー
ル形フエノール樹脂と、脂肪酸もしくは脂肪酸の
金属塩と、金属キレート形成剤とを配合してなる
ペーストで、前記金属銅粉の樹脂成分との配合に
おける配合量が60〜95重量％である導電性銅ペー
ストからなることを特徴とする。[Means for Solving the Problems] The present invention provides an electromagnetic shielding layer on the surface of a plastic molded housing by thermally transferring a conductive layer obtained by applying a conductive paste to a film and subjecting it to thermosetting treatment. The conductive paste serving as the conductive layer is a paste formed by blending metallic copper powder, a resol type phenolic resin, a fatty acid or a metal salt of a fatty acid, and a metal chelate forming agent, It is characterized in that it consists of a conductive copper paste in which the blending amount of the metallic copper powder and the resin component is 60 to 95% by weight.
［作用］
本発明に係る成形体は、ハウジング本体がプラ
スチツクからなるため軽量であつて、その表面に
設けられた均一な厚みの電磁波遮蔽層によつて電
磁波エネルギーを十分に減衰させることができ
る。[Function] The molded article according to the present invention is lightweight because the housing body is made of plastic, and the electromagnetic wave energy can be sufficiently attenuated by the electromagnetic wave shielding layer of uniform thickness provided on the surface.
［実施例］
第１図は、本発明の実施例に係る電磁波遮蔽成
形体２の断面図である。[Example] FIG. 1 is a sectional view of an electromagnetic shielding molded body 2 according to an example of the present invention.
電磁波遮蔽成形体２は、ハウジング４とその内
面に設けられた電磁波遮蔽層６とからなる。ハウ
ジング４は、１つの矩形上底板４ａとその外縁に
接する４つの側板４ｂとからなり、射出成形によ
つて形成されるプラスチツク成形体である。電磁
波遮蔽層６は、以下に説明するように、フイルム
に導電ペーストを印刷法により塗布し熱硬化処理
を施して得られた導電性層を、ハウジング４の射
出成形の際にフイルムからこのハウジング４の内
面全体に熱転写したものであつて、ハウジング４
の１上底板４ａと４側板４ｂとにそれぞれ対応し
て、１つの底面部分６ａと４つの側面部分６ｂと
からなる。なお、ハウジング４の形状は一例であ
つてこれにかぎらず、電磁波遮蔽層６は、このハ
ウジング４の形状に応じてその内面又は外面全体
に熱転写される。 The electromagnetic shielding molded body 2 consists of a housing 4 and an electromagnetic shielding layer 6 provided on its inner surface. The housing 4 is a plastic molded body formed by injection molding, and includes one rectangular upper base plate 4a and four side plates 4b that are in contact with the outer edge of the upper base plate 4a. As will be explained below, the electromagnetic wave shielding layer 6 is formed by applying a conductive paste to a film by a printing method and subjecting it to a thermosetting process. The housing 4 is thermally transferred to the entire inner surface of the housing 4.
It consists of one bottom part 6a and four side parts 6b corresponding to one upper bottom plate 4a and four side plates 4b, respectively. Note that the shape of the housing 4 is merely an example, and the electromagnetic wave shielding layer 6 is thermally transferred to the entire inner or outer surface of the housing 4 depending on the shape thereof.
第２図は、この電磁波遮蔽成形体２を製造する
ために用いられる導電性層を形成したフイルムの
製造工程を示す平面図であつて、第１図に対して
縮小して描かれている。第３図は、第２図の−
断面図である。 FIG. 2 is a plan view showing the manufacturing process of a film on which a conductive layer is formed, which is used to manufacture the electromagnetic shielding molded body 2, and is drawn on a smaller scale than in FIG. 1. Figure 3 shows - of Figure 2.
FIG.
フイルム８は、例えばポリエステルフイルムで
ある。ポリイミドフイルム等の他のプラスチツク
フイルムを用いることもできる。フイルム８の一
方の面には、導電ペーストがスクリーン印刷法に
よつて所望の形状に印刷されて後、熱硬化処理が
施されて導電性層５が形成される。この導電性層
５は、電磁波遮蔽成形体２の内面すなわち射出成
形しようとするハウジング４の内面を展開した形
状であつて、１つの底面部分５ａとその外周縁に
外接する４つの側面部分５ｂとを有する。なお、
印刷法は、スクリーン印刷にかぎらず凹版印刷等
でもよい。 The film 8 is, for example, a polyester film. Other plastic films such as polyimide films can also be used. On one side of the film 8, a conductive paste is printed in a desired shape by screen printing, and then subjected to a thermosetting treatment to form the conductive layer 5. This conductive layer 5 has a shape developed from the inner surface of the electromagnetic shielding molded body 2, that is, the inner surface of the housing 4 to be injection molded, and has one bottom portion 5a and four side portions 5b circumscribing the outer periphery thereof. has. In addition,
The printing method is not limited to screen printing, but may also be intaglio printing or the like.
前記の導電ペーストとしては、抵抗率が低くし
かもコストが安いことから、導電性銅ペーストを
用いる。その膜厚は、数十μｍが適当である。さ
らに詳細には、この導電性銅ペーストは、金属銅
粉、熱硬化性樹脂であるレゾール型フエノール樹
脂、脂肪酸又は脂肪酸の金属塩及び金属キレート
形成剤からなる。金属銅粉の配合量は、樹脂成分
との配合において60〜95重量％が適当である。前
記レゾール形フエノール樹脂は、金属銅粉及び他
の成分をバインドする作用を有する。 As the conductive paste, conductive copper paste is used because it has low resistivity and low cost. The film thickness is suitably several tens of μm. More specifically, this conductive copper paste consists of metallic copper powder, a resol type phenolic resin which is a thermosetting resin, a fatty acid or a metal salt of a fatty acid, and a metal chelate forming agent. The appropriate amount of metallic copper powder to be blended with the resin component is 60 to 95% by weight. The resol type phenolic resin has the function of binding the metallic copper powder and other components.
なお、金属銅粉の配合量が60重量％未満では、
導電性が低下し、逆に95重量％を越えるときは、
樹脂成分の配合量が小さくなるために金属銅粉が
十分にバインドされず、得られる塗膜が脆くな
り、印刷性が悪くなるとともに、かえつて導電性
が低下する。さらに、脂肪酸又は脂肪酸の金属塩
の添加によつて、樹脂成分への金属銅粉の微細分
散を促進し、導電性の良好な塗膜を形成すること
ができる。また、金属キレート形成剤の添加によ
つて、金属銅粉の酸化を防止し、高導電性を長期
間にわたつて持続させることができる。 In addition, if the amount of metallic copper powder is less than 60% by weight,
When the conductivity decreases and exceeds 95% by weight,
Since the blended amount of the resin component is small, the metallic copper powder is not sufficiently bound, and the resulting coating film becomes brittle, resulting in poor printability and even lower conductivity. Furthermore, by adding a fatty acid or a metal salt of a fatty acid, fine dispersion of the metallic copper powder into the resin component can be promoted, and a coating film with good conductivity can be formed. Furthermore, by adding a metal chelate forming agent, oxidation of the metallic copper powder can be prevented and high conductivity can be maintained for a long period of time.
塗布された導電ペーストは、フイルム８ととも
に、例えば130〜180℃で10〜60分間加熱され、熱
硬化処理がなされる。前記組成の導電性銅ペース
トを用いることにより、ここにおいて、膜質及び
膜厚が均一であつて体積固有抵抗率が10-4〜10-5
Ω・cm級の導電性層５が得られる。 The applied conductive paste is heated together with the film 8 at, for example, 130 to 180° C. for 10 to 60 minutes to undergo a thermosetting treatment. By using the conductive copper paste having the above composition, the film quality and thickness are uniform and the specific volume resistivity is 10 -4 to 10 -5.
A conductive layer 5 of Ω·cm class is obtained.
このようにして印刷及び熱硬化処理の各工程が
終了すると、裁断が行われる。第４図はこの裁断
結果を示す平面図であつて、第５図は第４図の
−断面図である。裁断は、導電性層５の外形に
沿つて行われ、フイルム８も前記展開形状とな
る。なお、裁断に代えて打抜を行つてもよい。以
上に説明したように印刷及びこれに引続く熱硬化
処理の各工程が終了した後に裁断を行うようにす
れば、流れ作業による大量生産にとつて好都合で
ある。ただし、フイルム８の裁断後に印刷及び熱
硬化処理の各工程を実行してもよい。以上のよう
にして、ハウジング４の内面展開形状であつて導
電性層５を有するフイルム８が得られる。 After each step of printing and thermosetting treatment is completed in this way, cutting is performed. FIG. 4 is a plan view showing the result of this cutting, and FIG. 5 is a sectional view taken along the line "--" in FIG. The cutting is performed along the outer shape of the conductive layer 5, and the film 8 also assumes the developed shape. Note that punching may be performed instead of cutting. As explained above, if the cutting is performed after each step of printing and subsequent heat curing treatment is completed, it is convenient for mass production by assembly line operations. However, the printing and thermosetting processes may be performed after cutting the film 8. In the manner described above, the film 8 having the developed shape of the inner surface of the housing 4 and having the conductive layer 5 is obtained.
第６図は、このフイルム８を金型に装着した状
態を示す断面図である。符号１０は、突出部１２
を有する雄型であつて、この突出部１２は、製造
しようとする電磁波遮蔽成形体２の内面形状と同
一の形状に形成されている。フイルム８は、この
突出部１２の表面に装着される。すなわち、この
装着の際、フイルム８は、導電性層５の底面部分
５ａ及び側面部分５ｂにそれぞれ対応するフイル
ム８の底面部分８ａ及び側面部分が８ｂが、それ
ぞれ突出部１２の正面及び側面に密着するように
折曲して配される。したがつて、導電性層５が外
側に向けて配される。そして、雄型１０とこれに
対応する形状の雌型１４とからなる金型が閉じら
れ、この雌型１４と導電性層５との間にキヤビテ
イ１６が形成される。 FIG. 6 is a sectional view showing the film 8 mounted on a mold. Reference numeral 10 indicates a protrusion 12
This protrusion 12 is formed in the same shape as the inner surface of the electromagnetic shielding molded body 2 to be manufactured. The film 8 is attached to the surface of this protrusion 12. That is, during this mounting, the bottom surface portion 8a and side surface portion 8b of the film 8, which correspond to the bottom surface portion 5a and side surface portion 5b of the conductive layer 5, respectively, are in close contact with the front and side surfaces of the protruding portion 12, respectively. It is arranged by folding it so that it looks like this. Therefore, the conductive layer 5 is arranged towards the outside. Then, the mold consisting of the male mold 10 and the female mold 14 having a corresponding shape is closed, and a cavity 16 is formed between the female mold 14 and the conductive layer 5.
第７図は、プラスチツクの射出成形が完了した
状態を示す断面図である。雌型１４に形成された
スプルー１８及びゲート２０を通してプラスチツ
クが射出される。したがつて、前記キヤビテイ１
６内においてプラスチツクが射出成形され、所望
の形状のハウジング４が形成される。この際、前
記導電性層５は、プラスチツクの熱によつてこの
ハウジング４の内面に転写し、その内面全体を完
全に覆う電磁波遮蔽層６となる。なお、本実施例
においては、従来のように金属フイラーを混入し
たプラスチツクを射出成形するのではないため、
この成形の際に射出成形機を損傷することがな
い。また、ハウジング４の射出成形の完了と同時
に導電性層５の熱転写を完了して電磁波遮蔽層６
を形成するため、生産性が高い。 FIG. 7 is a sectional view showing a state in which plastic injection molding is completed. Plastic is injected through a sprue 18 and a gate 20 formed in the female mold 14. Therefore, the cavity 1
Plastic is injection molded within 6 to form the housing 4 of the desired shape. At this time, the conductive layer 5 is transferred to the inner surface of the housing 4 by the heat of the plastic, and becomes an electromagnetic wave shielding layer 6 that completely covers the entire inner surface. In addition, in this example, plastic mixed with metal filler was not injection molded as in the conventional case, so
The injection molding machine is not damaged during this molding. Further, at the same time as the injection molding of the housing 4 is completed, the thermal transfer of the conductive layer 5 is completed and the electromagnetic wave shielding layer 6 is completed.
productivity is high.
この射出成形の完了の後、雄型１０雌型１４と
からなる金型を開いて雌型１４から成形品を引き
抜き、さらに電磁波遮蔽層６からフイルム８を剥
離すれば、前記の電磁波遮蔽成形体２が得られ
る。なお、ハウジング４と電磁波遮蔽層６との緊
密な接着が得られない場合には、熱硬化処理を行
つた後フイルム８を金型に接着する前に、例えば
印刷法によつて導電性層５の上に接着剤を塗布し
てもよい。この接着剤の材質は、ハウジング４と
電磁波遮蔽層６との材質の組合せに応じて適宜選
択することができる。フイルム８の剥離性を高め
るためには、フイルム８の表面に離型層を形成し
ておき、この離型層の上に前記導電性層５を形成
すればよい。また、塗布する導電ペーストの組成
を制御することによつて、フイルム８との密着性
を制御することもできる。ただし、電磁波遮蔽成
形体２の形状によつては、フイルム８を剥離しな
いままこれを電気機器に用いても、均一な厚さの
電磁波遮蔽層６が形成されているため、電磁波を
十分に遮蔽することができる。 After the injection molding is completed, the mold consisting of the male mold 10 and the female mold 14 is opened, the molded product is pulled out from the female mold 14, and the film 8 is peeled off from the electromagnetic shielding layer 6, thereby producing the electromagnetic shielding molded product. 2 is obtained. Note that if tight adhesion between the housing 4 and the electromagnetic shielding layer 6 cannot be obtained, the conductive layer 5 may be bonded to the conductive layer 5 by a printing method, for example, before adhering the film 8 to the mold after the heat curing treatment. Adhesive may be applied over it. The material of this adhesive can be appropriately selected depending on the combination of materials of the housing 4 and the electromagnetic shielding layer 6. In order to improve the releasability of the film 8, a release layer may be formed on the surface of the film 8, and the conductive layer 5 may be formed on this release layer. Furthermore, the adhesion to the film 8 can also be controlled by controlling the composition of the conductive paste to be applied. However, depending on the shape of the electromagnetic wave shielding molded body 2, even if the film 8 is not peeled off and is used in electrical equipment, the electromagnetic wave shielding layer 6 with a uniform thickness is formed, so it can sufficiently shield electromagnetic waves. can do.
［発明の効果］
以上説明したように、本発明に係る電磁波遮蔽
成形体は、ハウジング本体がプラスチツクからな
るため軽量であり、その表面に、フイルムに導電
ペーストを塗布し熱硬化処理を施して得られた導
電性層を熱転写してなる電磁波遮蔽層を設けたも
のであるから、この電磁波遮蔽層が電磁波エネル
ギーを十分に減衰し、極めて良好な電磁波遮蔽効
果を発揮する。[Effects of the Invention] As explained above, the electromagnetic wave shielding molded article according to the present invention is lightweight because the housing body is made of plastic, and the electromagnetic wave shielding molded article according to the present invention is lightweight because the housing body is made of plastic. Since the electromagnetic wave shielding layer is provided by thermally transferring the electroconductive layer, this electromagnetic wave shielding layer sufficiently attenuates the electromagnetic wave energy and exhibits an extremely good electromagnetic wave shielding effect.
特に、導電性層となる導電ペーストが、金属銅
粉と、レゾール型フエノール樹脂と、脂肪酸もし
くは脂肪酸の金属塩と、金属キレート形成剤とを
配合したペーストで、前記金属銅粉の樹脂成分と
の配合における配合量が60〜95重量％である導電
性銅ペーストからなるものであるため、電磁波遮
蔽層が全域にわたり均一な厚みでかつ高い導電性
を長期にわたり良好に保持できる。 In particular, the conductive paste that becomes the conductive layer is a paste containing metallic copper powder, a resol-type phenolic resin, a fatty acid or a metal salt of fatty acid, and a metal chelate forming agent, and the conductive paste is a paste containing metallic copper powder, a resol type phenolic resin, a fatty acid or a metal salt of fatty acid, and a metal chelate forming agent. Since it is made of conductive copper paste with a blending amount of 60 to 95% by weight, the electromagnetic wave shielding layer has a uniform thickness over the entire area and can maintain high conductivity for a long period of time.
すなわち、脂肪酸又は脂肪酸の金属塩の添加に
よつて、樹脂成分への金属銅粉の微細分散を促進
し、導電性の良好な塗膜を形成することができ
る。また、金属キレート形成剤の添加によつて、
金属銅粉の酸化を防止し、高導電性を長期間にわ
たつて持続させることができる。 That is, by adding a fatty acid or a metal salt of a fatty acid, fine dispersion of the metallic copper powder into the resin component can be promoted, and a coating film with good conductivity can be formed. In addition, by adding a metal chelate forming agent,
It prevents oxidation of metallic copper powder and maintains high conductivity over a long period of time.
しかも、この電子派遮蔽成形体は、低コストで
あり、これを製造するためのいずれの工程におい
ても作業環境を悪化させるおそれがない。 Moreover, this electronic shielding molded body is low cost, and there is no risk of deteriorating the working environment in any process for manufacturing it.
第１図は、本発明の実施例に係る電磁波遮蔽成
形体の断面図、第２図は、前図の電磁波遮蔽成形
体を製造するために用いられる導電性層を形成し
たフイルムの製造工程を示す平面図であつて、前
図に対して縮小して描かれたもの、第３図は、前
図の−断面図、第４図は、第２図のフイルム
を裁断した状態を示す平面図、第５図は、前図の
−断面図、第６図は、第４図のフイルムを金
型に装着した状態を示す断面図、第７図は、前図
の金型におけるプラスチツクの射出成形が完了し
た状態を示す断面図である。
符号の説明、２……電磁波遮蔽成形体、４……
ハウジング、５……導電性層、６……電磁波遮蔽
層、８……フイルム。
FIG. 1 is a cross-sectional view of an electromagnetic shielding molded article according to an embodiment of the present invention, and FIG. 2 shows the manufacturing process of a film on which a conductive layer is formed, which is used to manufacture the electromagnetic shielding molded article shown in the previous figure. FIG. 3 is a cross-sectional view of the previous figure, and FIG. 4 is a plan view of the film shown in FIG. 2 cut. , FIG. 5 is a cross-sectional view of the previous figure, FIG. 6 is a cross-sectional view showing the film shown in FIG. FIG. 3 is a cross-sectional view showing a completed state. Explanation of symbols, 2... Electromagnetic wave shielding molded body, 4...
Housing, 5... Conductive layer, 6... Electromagnetic shielding layer, 8... Film.
Claims (1)
ルムに導電ペーストを塗布し熱硬化処理を施して
得られた導電性層を熱転写してなる電磁波遮蔽層
を設けてなる成形体であつて、 前記導電性層となる導電ペーストが、金属銅粉
と、レゾール型フエノール樹脂と、脂肪酸もしく
は脂肪酸の金属塩と、金属キレート形成剤とを配
合してなるペーストで、前記金属銅粉の樹脂成分
との配合における配合量が60〜95重量％である導
電性銅ペーストからなることを特徴とする電磁波
遮蔽成形体。[Scope of Claims] 1. A molded body comprising an electromagnetic shielding layer formed by thermally transferring a conductive layer obtained by applying a conductive paste to a film and subjecting it to a thermosetting treatment, on the surface of a plastic molded housing. , the conductive paste forming the conductive layer is a paste formed by blending metallic copper powder, a resol type phenolic resin, a fatty acid or a metal salt of fatty acid, and a metal chelate forming agent, and the resin component of the metallic copper powder 1. An electromagnetic shielding molded article comprising a conductive copper paste in an amount of 60 to 95% by weight in combination with .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18609187A JPS6428997A (en) | 1987-07-24 | 1987-07-24 | Electromagnetic wave shield molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18609187A JPS6428997A (en) | 1987-07-24 | 1987-07-24 | Electromagnetic wave shield molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6428997A JPS6428997A (en) | 1989-01-31 |
| JPH0557757B2 true JPH0557757B2 (en) | 1993-08-24 |
Family
ID=16182211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18609187A Granted JPS6428997A (en) | 1987-07-24 | 1987-07-24 | Electromagnetic wave shield molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6428997A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2612520B2 (en) * | 1991-11-15 | 1997-05-21 | 日本写真印刷株式会社 | Method of manufacturing electromagnetic wave shielding molded body |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61225900A (en) * | 1985-03-29 | 1986-10-07 | 大日本印刷株式会社 | Transfer sheet for shielding electromagnetic wave |
-
1987
- 1987-07-24 JP JP18609187A patent/JPS6428997A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61225900A (en) * | 1985-03-29 | 1986-10-07 | 大日本印刷株式会社 | Transfer sheet for shielding electromagnetic wave |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6428997A (en) | 1989-01-31 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |