JPH0142392Y2 - - Google Patents
Info
- Publication number
- JPH0142392Y2 JPH0142392Y2 JP1982151506U JP15150682U JPH0142392Y2 JP H0142392 Y2 JPH0142392 Y2 JP H0142392Y2 JP 1982151506 U JP1982151506 U JP 1982151506U JP 15150682 U JP15150682 U JP 15150682U JP H0142392 Y2 JPH0142392 Y2 JP H0142392Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive sheet
- case
- resin
- conductive
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 239000003973 paint Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Description
【考案の詳細な説明】 本考案は電磁波シールドケースに関する。[Detailed explanation of the idea] The present invention relates to an electromagnetic wave shielding case.
近年電子計算器の普及に伴い電子計算器から発
生する電磁波が周辺のテレビ、ラジオに悪影響を
与え、さらには他の電子計算器の誤動作を招く要
因となつており、電磁波をシールドする必要を生
じている。電磁波をシールドするには電磁波を発
生する電子回路を阻むケースの材質を導電性にす
るのが簡便である。 In recent years, with the spread of electronic calculators, the electromagnetic waves emitted by electronic calculators are having a negative impact on nearby televisions and radios, and are even causing other electronic calculators to malfunction, making it necessary to shield electromagnetic waves. ing. An easy way to shield electromagnetic waves is to make the material of the case that blocks the electronic circuit that generates electromagnetic waves conductive.
従来ケースに導電性を有せしめて電磁波シール
ド効果を向上させるにはニツケル、銅、炭素など
の導電性物質粉末を混入した導電性塗料をケース
に塗布するか、ケース全体を銅板にするか、ある
いは樹脂に金属または炭素の粉末または繊維を混
入、混練してケースを成形すること等が行なわれ
ている。しかし導電性塗料をケースの内側に塗装
した場合、塗料が剥離して電子回路上に落ち回路
をシヨートさせる問題がある。またケースの外側
に導電性塗料を塗装した場合は製品の外観をよく
するためさらに上塗り塗装しなければならず、そ
れだけコスト高となる。また銅板加工によつてケ
ースとした場合は形状的に制約があり、ケースが
重くなる欠点がある。さらに樹脂に金属または炭
素の粉末または繊維を混入してケースを成形した
場合、導電体と導電体の間に絶縁体である樹脂が
介在していることから十分なシールド効果が期待
できない。しかも導電体が成形品の表面に露出す
るため塗装をする必要がありコスト高となる。 Conventionally, in order to make the case conductive and improve the electromagnetic shielding effect, it was necessary to apply conductive paint mixed with conductive material powder such as nickel, copper, or carbon to the case, or to make the entire case a copper plate. Metal or carbon powder or fibers are mixed into resin and kneaded to form a case. However, when a conductive paint is applied to the inside of the case, there is a problem in that the paint peels off and falls onto the electronic circuit, causing the circuit to be shot. Furthermore, if a conductive paint is applied to the outside of the case, an additional top coat must be applied to improve the appearance of the product, which increases the cost accordingly. Furthermore, if the case is made by processing a copper plate, there are restrictions on the shape and the case becomes heavy. Furthermore, if the case is molded by mixing metal or carbon powder or fibers into the resin, a sufficient shielding effect cannot be expected because the resin, which is an insulator, is interposed between the conductors. Moreover, since the conductor is exposed on the surface of the molded product, it is necessary to paint it, which increases the cost.
本考案は以上のような導電層が成形品表面に露
出することによつて生じる従来のシールド方式の
欠点を解消し安価で信頼性の高い電磁波シールド
ケースについて検討した結果、プラスチツク層と
エツチングした金属層とからなる導電性シートを
インサート成形することによつて目的を達するこ
とを見出し本考案を完成した。 The present invention was developed after studying an inexpensive and highly reliable electromagnetic shielding case that eliminates the drawbacks of conventional shielding methods caused by the conductive layer being exposed on the surface of the molded product. They discovered that the objective could be achieved by insert molding a conductive sheet consisting of layers, and completed the present invention.
以下本考案を図によつて説明する。 The present invention will be explained below using figures.
図は本考案の電磁波シールドケースを製造する
工程を示したもので、第1図はプラスチツク層1
と金属層2とからなる導電性シート3である。プ
ラスチツク層のプラスチツクは熱可塑性樹脂、と
くに高密度ポリエチレン、ポリプロピレン、ポリ
スチレン、ポリカーボネート、フツ素樹脂、酢酸
ビニル樹脂が良い。また金属層の金属は銅、アル
ミニウム、ニツケル、スズあるいは鉄が良い。 The figure shows the process of manufacturing the electromagnetic shielding case of the present invention, and Figure 1 shows the plastic layer 1.
and a metal layer 2. The plastic for the plastic layer is preferably a thermoplastic resin, particularly high-density polyethylene, polypropylene, polystyrene, polycarbonate, fluororesin, or vinyl acetate resin. Further, the metal of the metal layer is preferably copper, aluminum, nickel, tin, or iron.
第2図は導電性シート3の金属層2に第7,8
図に示すパターンをプリント回路を製作する方法
と同様、印刷法または写真法を用いてエツチング
したものである。パターンの大きさはシールド効
果を高めるため可能な限り細かいものが望ましく
線の幅は0.2mm程度がよい。第7図のパターンは
一方向、第8図のパターンは二方向に導電性シー
ト3を伸ばすことが可能となる。 FIG. 2 shows the conductive sheet 3 with 7 and
The pattern shown in the figure is etched using printing or photographic methods similar to the methods used to fabricate printed circuits. The size of the pattern is preferably as small as possible in order to enhance the shielding effect, and the line width is preferably about 0.2 mm. The pattern shown in FIG. 7 allows the conductive sheet 3 to be stretched in one direction, and the pattern shown in FIG. 8 allows the conductive sheet 3 to be stretched in two directions.
従つて導電性シート3を用いてインサート成形
する際、導電性シートが伸びるので切断しない。 Therefore, when performing insert molding using the conductive sheet 3, the conductive sheet stretches and is not cut.
第3図はエツチング処理した導電性シート3を
真空成形によつてプリフオームしたものを成形品
の金型にインサートし成形する工程の断面図であ
る。成形する樹脂は流動性のよい汎用熱可塑性樹
脂また熱硬化性樹脂であればよい。 FIG. 3 is a sectional view showing the process of inserting the etched conductive sheet 3 into a preform by vacuum forming into a mold for a molded product. The resin to be molded may be any general-purpose thermoplastic resin or thermosetting resin with good fluidity.
さらに別の方法として第4図〜第6図に示すも
のは、第4図において、エツチング処理した導電
性シート3を金型キヤビテイクにクランプ8でセ
ツトし、さらに第5図に示すように型を閉じ、第
6図に示すように樹脂を射出注入することによつ
て導電性シート3の金属層2が成形品表面に露出
することなく成形できる。 Another method shown in FIGS. 4 to 6 is to set the etched conductive sheet 3 in the mold cavity with a clamp 8 in FIG. 4, and then set the mold as shown in FIG. By closing the molded product and injecting the resin as shown in FIG. 6, the metal layer 2 of the conductive sheet 3 can be molded without being exposed on the surface of the molded product.
本考案の電磁波シールドケースは製造方法が簡
便でかつ高い信頼性の電磁波シールド効果を有
し、しかも安価である。 The electromagnetic shielding case of the present invention is easy to manufacture, has a highly reliable electromagnetic shielding effect, and is inexpensive.
第1図は導電性シートであり、第2図は導電性
シートの金属層をエツチングしたものである。第
3図はエツチング処理した導電性シートを真空成
形する工程の断面図を示す。第4図は導電性シー
トを金型キヤビテイにセツとし、第5図は型を閉
じ、第6図は樹脂を射出注入する工程のそれぞれ
断面図である。第7図及び第8図はエツチングパ
ターンの一実施例を示す(白い部分をエツチング
によつて除去する)。
1……プラスチツク層、2……金属層、3……
導電性シート、4……金型キヤビテイ、5……金
型コア、6……樹脂、7……ゲート、8……クラ
ンプ。
FIG. 1 shows a conductive sheet, and FIG. 2 shows an etched metal layer of the conductive sheet. FIG. 3 shows a cross-sectional view of the step of vacuum forming the etched conductive sheet. FIG. 4 is a sectional view showing the steps of setting the conductive sheet into the mold cavity, FIG. 5 showing the closing of the mold, and FIG. 6 showing the steps of injecting the resin. FIGS. 7 and 8 show an example of an etching pattern (the white portion is removed by etching). 1...Plastic layer, 2...Metal layer, 3...
Conductive sheet, 4... Mold cavity, 5... Mold core, 6... Resin, 7... Gate, 8... Clamp.
Claims (1)
トをインサート成形することによつて得られる電
磁波シールドケースにおいて、インサート成形前
に導電性シートの金属層を予めエツチングしてお
くことを特徴とする電磁波シールドケース。 An electromagnetic shielding case obtained by insert molding a conductive sheet consisting of a plastic layer and a metal layer, characterized in that the metal layer of the conductive sheet is etched in advance before insert molding. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15150682U JPS5956797U (en) | 1982-10-07 | 1982-10-07 | Electromagnetic shield case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15150682U JPS5956797U (en) | 1982-10-07 | 1982-10-07 | Electromagnetic shield case |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5956797U JPS5956797U (en) | 1984-04-13 |
JPH0142392Y2 true JPH0142392Y2 (en) | 1989-12-12 |
Family
ID=30335715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15150682U Granted JPS5956797U (en) | 1982-10-07 | 1982-10-07 | Electromagnetic shield case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5956797U (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6428998A (en) * | 1987-07-24 | 1989-01-31 | Tatsuta Densen Kk | Manufacture of electromagnetic wave shield molding |
JPH0671153B2 (en) * | 1989-08-30 | 1994-09-07 | 株式会社細川製作所 | Method for manufacturing electromagnetically shielded housing |
JP6181630B2 (en) * | 2014-11-14 | 2017-08-16 | トヨタ自動車株式会社 | Method for manufacturing electromagnetic shielding housing |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5791600A (en) * | 1980-11-29 | 1982-06-07 | Asahi Dow Ltd | Synthetic resin housing with electromagnetic shieldability |
-
1982
- 1982-10-07 JP JP15150682U patent/JPS5956797U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5791600A (en) * | 1980-11-29 | 1982-06-07 | Asahi Dow Ltd | Synthetic resin housing with electromagnetic shieldability |
Also Published As
Publication number | Publication date |
---|---|
JPS5956797U (en) | 1984-04-13 |
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