JPS6417458A - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- JPS6417458A JPS6417458A JP17287187A JP17287187A JPS6417458A JP S6417458 A JPS6417458 A JP S6417458A JP 17287187 A JP17287187 A JP 17287187A JP 17287187 A JP17287187 A JP 17287187A JP S6417458 A JPS6417458 A JP S6417458A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- hole
- semiconductor package
- bent
- molding resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To easily bend an outer lead and to eliminate the crack of a molding resin by providing a through hole at the position at which the lead is bent. CONSTITUTION:A through hole 5 is provided at the center of an outer lead 3 at a bending position 4. When the lead 3 is bent, it can be easily bent due to the hole 5, and the stress of the other part of the lead 3 is reduced. Accordingly, its bending stress does not affect an inner lead 2. Thus, a molding resin 1 is not cracked.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17287187A JPS6417458A (en) | 1987-07-13 | 1987-07-13 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17287187A JPS6417458A (en) | 1987-07-13 | 1987-07-13 | Semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6417458A true JPS6417458A (en) | 1989-01-20 |
Family
ID=15949848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17287187A Pending JPS6417458A (en) | 1987-07-13 | 1987-07-13 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6417458A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09283684A (en) * | 1996-04-09 | 1997-10-31 | Omron Corp | Electronic component and manufacture thereof |
US7961454B2 (en) * | 2005-05-18 | 2011-06-14 | Sanyo Electric Co., Ltd. | Multi-layered solid electrolytic capacitor and method of manufacturing same |
-
1987
- 1987-07-13 JP JP17287187A patent/JPS6417458A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09283684A (en) * | 1996-04-09 | 1997-10-31 | Omron Corp | Electronic component and manufacture thereof |
US7961454B2 (en) * | 2005-05-18 | 2011-06-14 | Sanyo Electric Co., Ltd. | Multi-layered solid electrolytic capacitor and method of manufacturing same |
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