JPS6417458A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS6417458A
JPS6417458A JP17287187A JP17287187A JPS6417458A JP S6417458 A JPS6417458 A JP S6417458A JP 17287187 A JP17287187 A JP 17287187A JP 17287187 A JP17287187 A JP 17287187A JP S6417458 A JPS6417458 A JP S6417458A
Authority
JP
Japan
Prior art keywords
lead
hole
semiconductor package
bent
molding resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17287187A
Other languages
Japanese (ja)
Inventor
Shoichi Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP17287187A priority Critical patent/JPS6417458A/en
Publication of JPS6417458A publication Critical patent/JPS6417458A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To easily bend an outer lead and to eliminate the crack of a molding resin by providing a through hole at the position at which the lead is bent. CONSTITUTION:A through hole 5 is provided at the center of an outer lead 3 at a bending position 4. When the lead 3 is bent, it can be easily bent due to the hole 5, and the stress of the other part of the lead 3 is reduced. Accordingly, its bending stress does not affect an inner lead 2. Thus, a molding resin 1 is not cracked.
JP17287187A 1987-07-13 1987-07-13 Semiconductor package Pending JPS6417458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17287187A JPS6417458A (en) 1987-07-13 1987-07-13 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17287187A JPS6417458A (en) 1987-07-13 1987-07-13 Semiconductor package

Publications (1)

Publication Number Publication Date
JPS6417458A true JPS6417458A (en) 1989-01-20

Family

ID=15949848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17287187A Pending JPS6417458A (en) 1987-07-13 1987-07-13 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS6417458A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283684A (en) * 1996-04-09 1997-10-31 Omron Corp Electronic component and manufacture thereof
US7961454B2 (en) * 2005-05-18 2011-06-14 Sanyo Electric Co., Ltd. Multi-layered solid electrolytic capacitor and method of manufacturing same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283684A (en) * 1996-04-09 1997-10-31 Omron Corp Electronic component and manufacture thereof
US7961454B2 (en) * 2005-05-18 2011-06-14 Sanyo Electric Co., Ltd. Multi-layered solid electrolytic capacitor and method of manufacturing same

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