JPS6482554A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS6482554A
JPS6482554A JP24184687A JP24184687A JPS6482554A JP S6482554 A JPS6482554 A JP S6482554A JP 24184687 A JP24184687 A JP 24184687A JP 24184687 A JP24184687 A JP 24184687A JP S6482554 A JPS6482554 A JP S6482554A
Authority
JP
Japan
Prior art keywords
island
resin
coupling
sealing resin
lower face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24184687A
Other languages
Japanese (ja)
Inventor
Tatsuhiko Akiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP24184687A priority Critical patent/JPS6482554A/en
Publication of JPS6482554A publication Critical patent/JPS6482554A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To enhance the coupling force between various components, particularly between the lower face of an island and a sealing resin, by projecting a coupling member from the lower face of the island so as to enclose the sealing resin therein for providing sufficiently strong coupling force therebetween. CONSTITUTION:When a lead frame island 3 on which a semiconductor element 2 is mounted and bonded with an adhesive 4 is molded with resin, a coupling member 3a suspended by their four legs 3b are integrally fixed to the island such that it is projected from the island while providing a coupling space 3c. Electrodes of the semiconductor element 2 are connected to leads 5 of a lead frame by means of inner wires 6 and they are sealed with a sealing resin 7 except the external terminal sections of the leads 5. In this manner, sufficiently strong coupling force can be ensured between the resin and the components also by the resin flowing into the coupling space. Further, internal stress acting on the coupling section between the lower face of the island and the sealing resin can be cancelled to some extent with thermal stress. Thus, the device is allowed to have enhanced rupture strength.
JP24184687A 1987-09-24 1987-09-24 Resin-sealed semiconductor device Pending JPS6482554A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24184687A JPS6482554A (en) 1987-09-24 1987-09-24 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24184687A JPS6482554A (en) 1987-09-24 1987-09-24 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS6482554A true JPS6482554A (en) 1989-03-28

Family

ID=17080375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24184687A Pending JPS6482554A (en) 1987-09-24 1987-09-24 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS6482554A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0392053U (en) * 1990-01-09 1991-09-19
JPH0415945A (en) * 1990-05-09 1992-01-21 Toshiba Corp Resin sealing type semiconductor device
US5190314A (en) * 1990-07-04 1993-03-02 Mazda Motor Corporation Glove box structure of vehicle
US5397915A (en) * 1991-02-12 1995-03-14 Matsushita Electronics Corporation Semiconductor element mounting die pad including a plurality of extending portions
DE19639181A1 (en) * 1996-09-24 1998-04-02 Siemens Ag Lead frame for a microelectronic component

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0392053U (en) * 1990-01-09 1991-09-19
JPH0415945A (en) * 1990-05-09 1992-01-21 Toshiba Corp Resin sealing type semiconductor device
US5190314A (en) * 1990-07-04 1993-03-02 Mazda Motor Corporation Glove box structure of vehicle
US5397915A (en) * 1991-02-12 1995-03-14 Matsushita Electronics Corporation Semiconductor element mounting die pad including a plurality of extending portions
DE19639181A1 (en) * 1996-09-24 1998-04-02 Siemens Ag Lead frame for a microelectronic component
WO1998013868A1 (en) * 1996-09-24 1998-04-02 Siemens Aktiengesellschaft Leadframe for a microelectronic component
DE19639181B4 (en) * 1996-09-24 2006-08-17 Infineon Technologies Ag Microelectronic component with a lead frame and an integrated circuit

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