JPS6482554A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPS6482554A JPS6482554A JP24184687A JP24184687A JPS6482554A JP S6482554 A JPS6482554 A JP S6482554A JP 24184687 A JP24184687 A JP 24184687A JP 24184687 A JP24184687 A JP 24184687A JP S6482554 A JPS6482554 A JP S6482554A
- Authority
- JP
- Japan
- Prior art keywords
- island
- resin
- coupling
- sealing resin
- lower face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To enhance the coupling force between various components, particularly between the lower face of an island and a sealing resin, by projecting a coupling member from the lower face of the island so as to enclose the sealing resin therein for providing sufficiently strong coupling force therebetween. CONSTITUTION:When a lead frame island 3 on which a semiconductor element 2 is mounted and bonded with an adhesive 4 is molded with resin, a coupling member 3a suspended by their four legs 3b are integrally fixed to the island such that it is projected from the island while providing a coupling space 3c. Electrodes of the semiconductor element 2 are connected to leads 5 of a lead frame by means of inner wires 6 and they are sealed with a sealing resin 7 except the external terminal sections of the leads 5. In this manner, sufficiently strong coupling force can be ensured between the resin and the components also by the resin flowing into the coupling space. Further, internal stress acting on the coupling section between the lower face of the island and the sealing resin can be cancelled to some extent with thermal stress. Thus, the device is allowed to have enhanced rupture strength.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24184687A JPS6482554A (en) | 1987-09-24 | 1987-09-24 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24184687A JPS6482554A (en) | 1987-09-24 | 1987-09-24 | Resin-sealed semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6482554A true JPS6482554A (en) | 1989-03-28 |
Family
ID=17080375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24184687A Pending JPS6482554A (en) | 1987-09-24 | 1987-09-24 | Resin-sealed semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6482554A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0392053U (en) * | 1990-01-09 | 1991-09-19 | ||
JPH0415945A (en) * | 1990-05-09 | 1992-01-21 | Toshiba Corp | Resin sealing type semiconductor device |
US5190314A (en) * | 1990-07-04 | 1993-03-02 | Mazda Motor Corporation | Glove box structure of vehicle |
US5397915A (en) * | 1991-02-12 | 1995-03-14 | Matsushita Electronics Corporation | Semiconductor element mounting die pad including a plurality of extending portions |
DE19639181A1 (en) * | 1996-09-24 | 1998-04-02 | Siemens Ag | Lead frame for a microelectronic component |
-
1987
- 1987-09-24 JP JP24184687A patent/JPS6482554A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0392053U (en) * | 1990-01-09 | 1991-09-19 | ||
JPH0415945A (en) * | 1990-05-09 | 1992-01-21 | Toshiba Corp | Resin sealing type semiconductor device |
US5190314A (en) * | 1990-07-04 | 1993-03-02 | Mazda Motor Corporation | Glove box structure of vehicle |
US5397915A (en) * | 1991-02-12 | 1995-03-14 | Matsushita Electronics Corporation | Semiconductor element mounting die pad including a plurality of extending portions |
DE19639181A1 (en) * | 1996-09-24 | 1998-04-02 | Siemens Ag | Lead frame for a microelectronic component |
WO1998013868A1 (en) * | 1996-09-24 | 1998-04-02 | Siemens Aktiengesellschaft | Leadframe for a microelectronic component |
DE19639181B4 (en) * | 1996-09-24 | 2006-08-17 | Infineon Technologies Ag | Microelectronic component with a lead frame and an integrated circuit |
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