JPS5763849A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5763849A
JPS5763849A JP55139587A JP13958780A JPS5763849A JP S5763849 A JPS5763849 A JP S5763849A JP 55139587 A JP55139587 A JP 55139587A JP 13958780 A JP13958780 A JP 13958780A JP S5763849 A JPS5763849 A JP S5763849A
Authority
JP
Japan
Prior art keywords
lead
base
projection
glass
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55139587A
Other languages
Japanese (ja)
Other versions
JPS6042619B2 (en
Inventor
Kozo Sawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55139587A priority Critical patent/JPS6042619B2/en
Publication of JPS5763849A publication Critical patent/JPS5763849A/en
Publication of JPS6042619B2 publication Critical patent/JPS6042619B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/164—Material
    • H01L2924/16586—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/16588—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent a mechanical stress from being transmitted to glass by forming in a base a projection directed to a lead and formed to be monolithic with the base, by forming in the lead an opening corresponding to the projection of the base and by joining the projection and the opening at a time when a package is sealed. CONSTITUTION:In a space formed by the base 1 and a cap 2 is housed a semiconductor die 3, which is connected with the lead 5 by a fine wire 4. The lead 5 passes through sealing glass 6, and in a part where the lead passes through the glass, the projection 1a formed monolithically with the base 1 is connected with the opening 5a formed in the lead 5. By constituting the device in this way, the mechanical stress, even if applied to the lead, is absorbed in the base, not being transmitted to the sealing glass, and thus the positioning of the lead at the time of sealing can be attained with ease.
JP55139587A 1980-10-06 1980-10-06 semiconductor equipment Expired JPS6042619B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55139587A JPS6042619B2 (en) 1980-10-06 1980-10-06 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55139587A JPS6042619B2 (en) 1980-10-06 1980-10-06 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5763849A true JPS5763849A (en) 1982-04-17
JPS6042619B2 JPS6042619B2 (en) 1985-09-24

Family

ID=15248733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55139587A Expired JPS6042619B2 (en) 1980-10-06 1980-10-06 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6042619B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01268156A (en) * 1988-04-20 1989-10-25 Toshiba Corp Sealed semiconductor device and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01268156A (en) * 1988-04-20 1989-10-25 Toshiba Corp Sealed semiconductor device and manufacture thereof

Also Published As

Publication number Publication date
JPS6042619B2 (en) 1985-09-24

Similar Documents

Publication Publication Date Title
CA2092165A1 (en) Chip carrier for optical device
MY113280A (en) Resin mold type semiconductor device.
GB1300248A (en) Light activated semiconductor device
ES2037736T3 (en) HERMETIC TERMINAL GROUP AND ITS MANUFACTURING METHOD.
JPS5763849A (en) Semiconductor device
JPS564255A (en) Semiconductor device sealed up with resin
JPS5785244A (en) Semiconductor device
JPS6482554A (en) Resin-sealed semiconductor device
JPS5335378A (en) Bump type semiconductor device
JPS5325360A (en) Production of semiconductor device
JPS5624960A (en) Lead frame for semiconductor device
JPS5487183A (en) Package for semiconductor device
JPS5793536A (en) Semiconductor device
JPS56103435A (en) Semiconductor device
JPS5375859A (en) Glass sealing semiconductor
JPS537173A (en) Solder-sealed ceramic package
JPS5374368A (en) Package for semiconductor device
JPS5662344A (en) Resin sealed semiconductor device
JPS5745939A (en) Semiconductor device
JPS5610950A (en) Lead wire for semiconductor device
JPS5350678A (en) Semiconductor device
JPS56110273A (en) Photo semiconductor device
JPS5723254A (en) Semiconductor device
JPS5546573A (en) Electrode member for light emission device, method of fabricating the same and punch therefor
JPS5763848A (en) Lead frame for semiconductor device