JPS5763848A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5763848A
JPS5763848A JP13958480A JP13958480A JPS5763848A JP S5763848 A JPS5763848 A JP S5763848A JP 13958480 A JP13958480 A JP 13958480A JP 13958480 A JP13958480 A JP 13958480A JP S5763848 A JPS5763848 A JP S5763848A
Authority
JP
Japan
Prior art keywords
lead
internal lead
lead frame
tip
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13958480A
Other languages
Japanese (ja)
Inventor
Shigeru Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13958480A priority Critical patent/JPS5763848A/en
Publication of JPS5763848A publication Critical patent/JPS5763848A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate the move of the tip of an internal lead and to increase thereby the positional precision thereof by fixing a metal softer than a lead frame element to the region of the internal lead. CONSTITUTION:In a dual-in-line type lead frame 15 wherein an internal lead 11 extending outward from the periphery of the fixed part of the element and an external lead 12 being led outside from the region of a package 13 sealed with an insulating substance form a monolithic body, the metal softer than the element of the lead frame is fixed, in a crushed state, to the bonding region excluding the tip part of the internal lead 11 and thus forms a metal-fixed part 16. By constituting the frame in this way, the positional precision of the internal lead is secured, the wiring of the tip of the internal lead with a semiconductor element in automatic assembly can be assured, and thereby the quality of a product is improved.
JP13958480A 1980-10-06 1980-10-06 Lead frame for semiconductor device Pending JPS5763848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13958480A JPS5763848A (en) 1980-10-06 1980-10-06 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13958480A JPS5763848A (en) 1980-10-06 1980-10-06 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5763848A true JPS5763848A (en) 1982-04-17

Family

ID=15248658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13958480A Pending JPS5763848A (en) 1980-10-06 1980-10-06 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5763848A (en)

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