JPS55157247A - Lead frame for semiconductor element - Google Patents

Lead frame for semiconductor element

Info

Publication number
JPS55157247A
JPS55157247A JP6547479A JP6547479A JPS55157247A JP S55157247 A JPS55157247 A JP S55157247A JP 6547479 A JP6547479 A JP 6547479A JP 6547479 A JP6547479 A JP 6547479A JP S55157247 A JPS55157247 A JP S55157247A
Authority
JP
Japan
Prior art keywords
semiconductor element
lead frame
recess
chip
island
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6547479A
Other languages
Japanese (ja)
Inventor
Seiji Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP6547479A priority Critical patent/JPS55157247A/en
Publication of JPS55157247A publication Critical patent/JPS55157247A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent displacement of a chip by forming a slightly larger recess than the chip at the center of an island. CONSTITUTION:A recess being slightly larger than a semiconductor chip 5 longitudinally and laterally and having infinitesimal size is formed at the center of an island 6. A gold plate 7 is coated on the recess, and molten at high temperature, and the semiconductor chip 5 is melt-stuck thereto.
JP6547479A 1979-05-25 1979-05-25 Lead frame for semiconductor element Pending JPS55157247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6547479A JPS55157247A (en) 1979-05-25 1979-05-25 Lead frame for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6547479A JPS55157247A (en) 1979-05-25 1979-05-25 Lead frame for semiconductor element

Publications (1)

Publication Number Publication Date
JPS55157247A true JPS55157247A (en) 1980-12-06

Family

ID=13288131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6547479A Pending JPS55157247A (en) 1979-05-25 1979-05-25 Lead frame for semiconductor element

Country Status (1)

Country Link
JP (1) JPS55157247A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62140755U (en) * 1986-02-28 1987-09-05
JPH06104294A (en) * 1992-09-17 1994-04-15 Nec Corp Lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62140755U (en) * 1986-02-28 1987-09-05
JPH06104294A (en) * 1992-09-17 1994-04-15 Nec Corp Lead frame

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