JPS57211284A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS57211284A
JPS57211284A JP56096910A JP9691081A JPS57211284A JP S57211284 A JPS57211284 A JP S57211284A JP 56096910 A JP56096910 A JP 56096910A JP 9691081 A JP9691081 A JP 9691081A JP S57211284 A JPS57211284 A JP S57211284A
Authority
JP
Japan
Prior art keywords
leads
lead
lead frame
projected
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56096910A
Other languages
Japanese (ja)
Other versions
JPH0361349B2 (en
Inventor
Ikuo Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56096910A priority Critical patent/JPS57211284A/en
Publication of JPS57211284A publication Critical patent/JPS57211284A/en
Publication of JPH0361349B2 publication Critical patent/JPH0361349B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:To enable common use to different circuits employing two semiconductor pellets, and to reduce cost by forming the number of leads projected in parallel from the lead forming section of the lead frame in four and shaping bonding pads to wires to each tip. CONSTITUTION:The first and second leads 13, 14 are projected in parallel from the lead forming section 11 with an index hole 12 for forwarding the lead frame to a processor at a regular interval, and the third lead 18 positioned between the leads 13, 14 is also formed. These leads are fixed by a tie bar 17, and the leads 13, 14 are extended outside the tie bar 17. The fourth and fifth leads 20, 22 branched outside the tie bar 17 are projected while being opposed to the lead 18, the bonding pads 15, 16, 19, 21 of the wires are shaped to each tip of these leads 13, 14, 20, 22 extending in parallel, and the two pellets are mounted by utilizing these pads.
JP56096910A 1981-06-23 1981-06-23 Lead frame for semiconductor device Granted JPS57211284A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56096910A JPS57211284A (en) 1981-06-23 1981-06-23 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56096910A JPS57211284A (en) 1981-06-23 1981-06-23 Lead frame for semiconductor device

Publications (2)

Publication Number Publication Date
JPS57211284A true JPS57211284A (en) 1982-12-25
JPH0361349B2 JPH0361349B2 (en) 1991-09-19

Family

ID=14177510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56096910A Granted JPS57211284A (en) 1981-06-23 1981-06-23 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57211284A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59165472A (en) * 1983-03-09 1984-09-18 Idec Izumi Corp Lead substrate for light emitting diode lamp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59165472A (en) * 1983-03-09 1984-09-18 Idec Izumi Corp Lead substrate for light emitting diode lamp
JPH0329195B2 (en) * 1983-03-09 1991-04-23 Idec Izumi Corp

Also Published As

Publication number Publication date
JPH0361349B2 (en) 1991-09-19

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