JPS5339063A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS5339063A
JPS5339063A JP11308876A JP11308876A JPS5339063A JP S5339063 A JPS5339063 A JP S5339063A JP 11308876 A JP11308876 A JP 11308876A JP 11308876 A JP11308876 A JP 11308876A JP S5339063 A JPS5339063 A JP S5339063A
Authority
JP
Japan
Prior art keywords
semiconductor package
fin
thermal
mounting
production cost
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11308876A
Other languages
Japanese (ja)
Inventor
Masayoshi Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11308876A priority Critical patent/JPS5339063A/en
Publication of JPS5339063A publication Critical patent/JPS5339063A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE: To facilitate fabricating of a connecting fin and lower production cost by mounting the connection fin, which is formed to block form by drawing from a stock material of a thermal-conductive metal, to the flange part of a semiconductor package.
COPYRIGHT: (C)1978,JPO&Japio
JP11308876A 1976-09-22 1976-09-22 Semiconductor package Pending JPS5339063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11308876A JPS5339063A (en) 1976-09-22 1976-09-22 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11308876A JPS5339063A (en) 1976-09-22 1976-09-22 Semiconductor package

Publications (1)

Publication Number Publication Date
JPS5339063A true JPS5339063A (en) 1978-04-10

Family

ID=14603166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11308876A Pending JPS5339063A (en) 1976-09-22 1976-09-22 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS5339063A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02303529A (en) * 1989-05-18 1990-12-17 Honda Motor Co Ltd Method and device for stirring high-viscosity paint

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02303529A (en) * 1989-05-18 1990-12-17 Honda Motor Co Ltd Method and device for stirring high-viscosity paint

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