JPS6420643A - High heat sink semiconductor device - Google Patents

High heat sink semiconductor device

Info

Publication number
JPS6420643A
JPS6420643A JP62176485A JP17648587A JPS6420643A JP S6420643 A JPS6420643 A JP S6420643A JP 62176485 A JP62176485 A JP 62176485A JP 17648587 A JP17648587 A JP 17648587A JP S6420643 A JPS6420643 A JP S6420643A
Authority
JP
Japan
Prior art keywords
heat sink
plate
semiconductor device
high heat
externally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62176485A
Other languages
Japanese (ja)
Inventor
Takatoshi Takigawa
Tadashi Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP62176485A priority Critical patent/JPS6420643A/en
Publication of JPS6420643A publication Critical patent/JPS6420643A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To enhance heat sink effect by simple steps with a simple structure by widely exposing externally at least a part of the rear face of a metal plate to which a semiconductor pellet is secured. CONSTITUTION:An IC pellet 5 is secured to the upper face 11 of a metal plate 2, and the lower face 9 is externally exposed. The entirety is sealed with resin 1 except the rear face 9 of the plate and a lead frame 3. The heat carried to the lower face 9 of the plate 2 is externally dissipated, and since the lateral sectional area of the plate 2 is wide, its heat sink effect is large.
JP62176485A 1987-07-15 1987-07-15 High heat sink semiconductor device Pending JPS6420643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62176485A JPS6420643A (en) 1987-07-15 1987-07-15 High heat sink semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62176485A JPS6420643A (en) 1987-07-15 1987-07-15 High heat sink semiconductor device

Publications (1)

Publication Number Publication Date
JPS6420643A true JPS6420643A (en) 1989-01-24

Family

ID=16014489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62176485A Pending JPS6420643A (en) 1987-07-15 1987-07-15 High heat sink semiconductor device

Country Status (1)

Country Link
JP (1) JPS6420643A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216283A (en) * 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
US5537342A (en) * 1990-08-28 1996-07-16 Lsi Logic Corporation Encapsulation of electronic components
JPH08288428A (en) * 1995-04-20 1996-11-01 Nec Corp Resin-sealed semiconductor device
JP2013030597A (en) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd Heat generation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216283A (en) * 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
US5537342A (en) * 1990-08-28 1996-07-16 Lsi Logic Corporation Encapsulation of electronic components
JPH08288428A (en) * 1995-04-20 1996-11-01 Nec Corp Resin-sealed semiconductor device
JP2013030597A (en) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd Heat generation device

Similar Documents

Publication Publication Date Title
JPS6420643A (en) High heat sink semiconductor device
JPS5740966A (en) Semiconductor device
JPS5610938A (en) Press-fit type semiconductor device
JPS56146263A (en) Manufacture of semiconductor device
JPS51138179A (en) Semi-conductor device
JPS5339067A (en) Production of semiconductor device
JPS53135579A (en) Liquid sealing semiconductor device
JPS56105659A (en) Multichip lsi
JPS53117968A (en) Production of semiconductor device
JPS5364470A (en) Lead frame of semiconductor device
JPS5414676A (en) Carrier tape and electronic parts using it
JPS5468165A (en) Manufacture for semiconductor device
JPS5790992A (en) Semiconductor laser device
JPS5460564A (en) Resin mold semiconductor device
JPS54577A (en) Resin seal semiconductor device
JPS5412270A (en) Integrated circuit rackage
JPS5766656A (en) Lead frame for semiconductor device
JPS57128046A (en) Semiconductor device
JPS5442986A (en) Menufacture of semiconductor device
JPS5472682A (en) Semiconductor device
JPS5418280A (en) Resin sealed semiconductor device
JPS5285470A (en) Lead frame fixing jig for wire bonding
JPS5295973A (en) Manufacture of semiconductor unit with heat sink
JPS55157247A (en) Lead frame for semiconductor element
JPS5763848A (en) Lead frame for semiconductor device