JPS5472682A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5472682A JPS5472682A JP14051777A JP14051777A JPS5472682A JP S5472682 A JPS5472682 A JP S5472682A JP 14051777 A JP14051777 A JP 14051777A JP 14051777 A JP14051777 A JP 14051777A JP S5472682 A JPS5472682 A JP S5472682A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- projection
- semiconductor device
- simply
- external mounted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To simply fit the heat sink external mounted, by providing the projection on a part of the heat sink utilizing a part of the lead frame.
CONSTITUTION: The heat sink 10 is introduced for the resin sealed semiconductor 14, and the projection 12 is formed on the plane of heat sink. The heat sink can simply be externally mounted by inserting the projection to the external mounted heat sink 11 having slightly greater hole 12' at the position corresponding to the projection 12 and shifting it.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14051777A JPS5472682A (en) | 1977-11-21 | 1977-11-21 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14051777A JPS5472682A (en) | 1977-11-21 | 1977-11-21 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5472682A true JPS5472682A (en) | 1979-06-11 |
Family
ID=15270485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14051777A Pending JPS5472682A (en) | 1977-11-21 | 1977-11-21 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5472682A (en) |
-
1977
- 1977-11-21 JP JP14051777A patent/JPS5472682A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5435689A (en) | Semiconductor integrated circuit device | |
| JPS5211784A (en) | Photo semiconductor device | |
| JPS548462A (en) | Manufacture for semiconductor | |
| JPS5472682A (en) | Semiconductor device | |
| JPS53133371A (en) | Lead frame of plastic package for integrated circuit | |
| JPS5275180A (en) | Package for integrated circuits | |
| JPS5325360A (en) | Production of semiconductor device | |
| JPS5433665A (en) | Manufacture for resin sealed type semiconductor device and resin sealed metal mold | |
| JPS5342659A (en) | Semiconductor integrated circuit | |
| JPS538072A (en) | Semiconductor device | |
| JPS5418280A (en) | Resin sealed semiconductor device | |
| JPS53142877A (en) | Manufacture for compound semiconductor device | |
| JPS54577A (en) | Resin seal semiconductor device | |
| JPS5315759A (en) | Electronic parts | |
| JPS51127678A (en) | Semiconductor device and its manufacturing method | |
| JPS52106674A (en) | Semiconductor device | |
| JPS53117968A (en) | Production of semiconductor device | |
| JPS52136576A (en) | Semiconductor device | |
| JPS5330874A (en) | Semiconductor element mounting device | |
| JPS533071A (en) | Semiconductor device | |
| JPS52117067A (en) | Semiconductor device | |
| JPS535574A (en) | Manufacture of semiconductor device | |
| JPS5295973A (en) | Manufacture of semiconductor unit with heat sink | |
| JPS53112667A (en) | Plastic sealing semiconductor device and its manufacture | |
| JPS5353968A (en) | Electronic circuit device |