JPS53112667A - Plastic sealing semiconductor device and its manufacture - Google Patents

Plastic sealing semiconductor device and its manufacture

Info

Publication number
JPS53112667A
JPS53112667A JP2821377A JP2821377A JPS53112667A JP S53112667 A JPS53112667 A JP S53112667A JP 2821377 A JP2821377 A JP 2821377A JP 2821377 A JP2821377 A JP 2821377A JP S53112667 A JPS53112667 A JP S53112667A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
plastic sealing
sealing semiconductor
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2821377A
Other languages
Japanese (ja)
Inventor
Kazunari Michii
Toshiaki Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2821377A priority Critical patent/JPS53112667A/en
Publication of JPS53112667A publication Critical patent/JPS53112667A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent the short circuit between the junction wire and the heat sink from being taken place and to enable automatic assembling, by using the organic insulating film having the metallic lead junctionable with the external lead corresponding to the external lead of the lead freme.
COPYRIGHT: (C)1978,JPO&Japio
JP2821377A 1977-03-14 1977-03-14 Plastic sealing semiconductor device and its manufacture Pending JPS53112667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2821377A JPS53112667A (en) 1977-03-14 1977-03-14 Plastic sealing semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2821377A JPS53112667A (en) 1977-03-14 1977-03-14 Plastic sealing semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
JPS53112667A true JPS53112667A (en) 1978-10-02

Family

ID=12242354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2821377A Pending JPS53112667A (en) 1977-03-14 1977-03-14 Plastic sealing semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS53112667A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164255A (en) * 1982-03-23 1983-09-29 Fujitsu Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164255A (en) * 1982-03-23 1983-09-29 Fujitsu Ltd Semiconductor device

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