JPS5433665A - Manufacture for resin sealed type semiconductor device and resin sealed metal mold - Google Patents
Manufacture for resin sealed type semiconductor device and resin sealed metal moldInfo
- Publication number
- JPS5433665A JPS5433665A JP9960477A JP9960477A JPS5433665A JP S5433665 A JPS5433665 A JP S5433665A JP 9960477 A JP9960477 A JP 9960477A JP 9960477 A JP9960477 A JP 9960477A JP S5433665 A JPS5433665 A JP S5433665A
- Authority
- JP
- Japan
- Prior art keywords
- resin sealed
- metal mold
- manufacture
- semiconductor device
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To surely eliminate burr of resin and to increase the working efficiency, by providing the projection at the inner end in contact with the header retainer fixing semiconductors at upper metal mold and pouring resin with the projection closely contacted to the header at resin sealing.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9960477A JPS5433665A (en) | 1977-08-22 | 1977-08-22 | Manufacture for resin sealed type semiconductor device and resin sealed metal mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9960477A JPS5433665A (en) | 1977-08-22 | 1977-08-22 | Manufacture for resin sealed type semiconductor device and resin sealed metal mold |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5433665A true JPS5433665A (en) | 1979-03-12 |
Family
ID=14251686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9960477A Pending JPS5433665A (en) | 1977-08-22 | 1977-08-22 | Manufacture for resin sealed type semiconductor device and resin sealed metal mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5433665A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62175763U (en) * | 1986-04-22 | 1987-11-07 | ||
US5098630A (en) * | 1985-03-08 | 1992-03-24 | Olympus Optical Co., Ltd. | Method of molding a solid state image pickup device |
US5151276A (en) * | 1990-02-13 | 1992-09-29 | Kabushiki Kaisha Toshiba | Resin molding apparatus |
US5609889A (en) * | 1995-05-26 | 1997-03-11 | Hestia Technologies, Inc. | Apparatus for encapsulating electronic packages |
JP2014192447A (en) * | 2013-03-28 | 2014-10-06 | Denso Corp | Electronic control unit and manufacturing method of the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4828955A (en) * | 1971-08-20 | 1973-04-17 | ||
JPS501662A (en) * | 1973-05-07 | 1975-01-09 |
-
1977
- 1977-08-22 JP JP9960477A patent/JPS5433665A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4828955A (en) * | 1971-08-20 | 1973-04-17 | ||
JPS501662A (en) * | 1973-05-07 | 1975-01-09 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5098630A (en) * | 1985-03-08 | 1992-03-24 | Olympus Optical Co., Ltd. | Method of molding a solid state image pickup device |
JPS62175763U (en) * | 1986-04-22 | 1987-11-07 | ||
US5151276A (en) * | 1990-02-13 | 1992-09-29 | Kabushiki Kaisha Toshiba | Resin molding apparatus |
US5609889A (en) * | 1995-05-26 | 1997-03-11 | Hestia Technologies, Inc. | Apparatus for encapsulating electronic packages |
US5776512A (en) * | 1995-05-26 | 1998-07-07 | Hestia Technologies, Inc. | Apparatus for encapsulating electronic packages |
JP2014192447A (en) * | 2013-03-28 | 2014-10-06 | Denso Corp | Electronic control unit and manufacturing method of the same |
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