JPS52104058A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS52104058A JPS52104058A JP1987876A JP1987876A JPS52104058A JP S52104058 A JPS52104058 A JP S52104058A JP 1987876 A JP1987876 A JP 1987876A JP 1987876 A JP1987876 A JP 1987876A JP S52104058 A JPS52104058 A JP S52104058A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- solder
- sealing
- contacting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To elevate the sealing effect, by means of sealing with airthight, externally adding and heating the solder on contacting position by contacting cap and stem by installing solder on a solder flow use ditch previously.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987876A JPS52104058A (en) | 1976-02-27 | 1976-02-27 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987876A JPS52104058A (en) | 1976-02-27 | 1976-02-27 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52104058A true JPS52104058A (en) | 1977-09-01 |
Family
ID=12011457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987876A Pending JPS52104058A (en) | 1976-02-27 | 1976-02-27 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52104058A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11227850B2 (en) | 2020-03-17 | 2022-01-18 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same |
-
1976
- 1976-02-27 JP JP1987876A patent/JPS52104058A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11227850B2 (en) | 2020-03-17 | 2022-01-18 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same |
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