JPS52104058A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS52104058A
JPS52104058A JP1987876A JP1987876A JPS52104058A JP S52104058 A JPS52104058 A JP S52104058A JP 1987876 A JP1987876 A JP 1987876A JP 1987876 A JP1987876 A JP 1987876A JP S52104058 A JPS52104058 A JP S52104058A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
solder
sealing
contacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987876A
Other languages
Japanese (ja)
Inventor
Minoru Toida
Yoshitsugu Imahashi
Shizuya Togashi
Hisashi Sakamoto
Toshitaka Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1987876A priority Critical patent/JPS52104058A/en
Publication of JPS52104058A publication Critical patent/JPS52104058A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To elevate the sealing effect, by means of sealing with airthight, externally adding and heating the solder on contacting position by contacting cap and stem by installing solder on a solder flow use ditch previously.
COPYRIGHT: (C)1977,JPO&Japio
JP1987876A 1976-02-27 1976-02-27 Production of semiconductor device Pending JPS52104058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987876A JPS52104058A (en) 1976-02-27 1976-02-27 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987876A JPS52104058A (en) 1976-02-27 1976-02-27 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS52104058A true JPS52104058A (en) 1977-09-01

Family

ID=12011457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987876A Pending JPS52104058A (en) 1976-02-27 1976-02-27 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS52104058A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11227850B2 (en) 2020-03-17 2022-01-18 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11227850B2 (en) 2020-03-17 2022-01-18 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same

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