JPS5468165A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS5468165A
JPS5468165A JP13553177A JP13553177A JPS5468165A JP S5468165 A JPS5468165 A JP S5468165A JP 13553177 A JP13553177 A JP 13553177A JP 13553177 A JP13553177 A JP 13553177A JP S5468165 A JPS5468165 A JP S5468165A
Authority
JP
Japan
Prior art keywords
semiconductor device
external
leads
clearance
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13553177A
Other languages
Japanese (ja)
Other versions
JPS6038869B2 (en
Inventor
Takashi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP52135531A priority Critical patent/JPS6038869B2/en
Publication of JPS5468165A publication Critical patent/JPS5468165A/en
Publication of JPS6038869B2 publication Critical patent/JPS6038869B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To increase the clearance of the bump and leads at the edge of the semiconductor device and adjacent semiconductor device, in bonding method of external leads to the semiconductor device.
CONSTITUTION: The semiconductor device 2 on the substrate 1 is connected with the lead frame 4 and a half of the bumps 6 inside are smashed since a pressure is exerted on with the heater chip 5, and a half at external keeps its essential height. Thus, at the edge of the semiconductor, the clearance with the leads is not spaced only with essential height, and since the leads sink at the internal part by taking the external half of the external half as a fulcrum and lift up at the external and the clearance is increased. With the same reason, the distance with the bump of the adjacent semiconductor device can be increased.
COPYRIGHT: (C)1979,JPO&Japio
JP52135531A 1977-11-10 1977-11-10 Manufacturing method of semiconductor device Expired JPS6038869B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52135531A JPS6038869B2 (en) 1977-11-10 1977-11-10 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52135531A JPS6038869B2 (en) 1977-11-10 1977-11-10 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5468165A true JPS5468165A (en) 1979-06-01
JPS6038869B2 JPS6038869B2 (en) 1985-09-03

Family

ID=15153940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52135531A Expired JPS6038869B2 (en) 1977-11-10 1977-11-10 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6038869B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615049A (en) * 1979-07-18 1981-02-13 Fujitsu Ltd Manufacture of semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6376019U (en) * 1986-11-04 1988-05-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615049A (en) * 1979-07-18 1981-02-13 Fujitsu Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS6038869B2 (en) 1985-09-03

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