JPS5548936A - Solder bonding of semiconductor ic device - Google Patents
Solder bonding of semiconductor ic deviceInfo
- Publication number
- JPS5548936A JPS5548936A JP12150278A JP12150278A JPS5548936A JP S5548936 A JPS5548936 A JP S5548936A JP 12150278 A JP12150278 A JP 12150278A JP 12150278 A JP12150278 A JP 12150278A JP S5548936 A JPS5548936 A JP S5548936A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- solder
- bump
- contact
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To improve the connection between a chip and a bump, by mounting a semiconductor chip on the bottom surface of a box-type base, placing on the base a cap having a bump on its lower surface via bonding solder, melting the solder by heat treatment, and pushing the chip upward while reducing the cross section by surface tension.
CONSTITUTION: Semiconductor chip 1 is mounted inside depressed box-type base 1 via melted bonding solder 2. Cap 5 provided on its lower surface control bump 6 via solder heap 7 is placed on either end part of base 1 where bump 6 and chip 1 are kept from coming into contact. Next, the whole structure is subjected to heat treatment, and solder 7 on both end parts is melted and spread, and by lowering cap 5, bump 6 is brought into contact with the surface of chip 1. At the same time, by melting solder 2 placed on the lower surface of chip 1, the cross section is narrowed and the height is increased, and thereby chip 1 is pushed up. In this way, pump 6 in contact with chip 1 is deformed, and the areas of contact between these are made sufficiently large.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12150278A JPS6034813B2 (en) | 1978-10-04 | 1978-10-04 | Solder connection method for semiconductor integrated circuit devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12150278A JPS6034813B2 (en) | 1978-10-04 | 1978-10-04 | Solder connection method for semiconductor integrated circuit devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5548936A true JPS5548936A (en) | 1980-04-08 |
JPS6034813B2 JPS6034813B2 (en) | 1985-08-10 |
Family
ID=14812765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12150278A Expired JPS6034813B2 (en) | 1978-10-04 | 1978-10-04 | Solder connection method for semiconductor integrated circuit devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6034813B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58201392A (en) * | 1982-05-19 | 1983-11-24 | 三菱電機株式会社 | Method of mounting electronic part |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS632020Y2 (en) * | 1985-05-29 | 1988-01-19 |
-
1978
- 1978-10-04 JP JP12150278A patent/JPS6034813B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58201392A (en) * | 1982-05-19 | 1983-11-24 | 三菱電機株式会社 | Method of mounting electronic part |
Also Published As
Publication number | Publication date |
---|---|
JPS6034813B2 (en) | 1985-08-10 |
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