JPS5548936A - Solder bonding of semiconductor ic device - Google Patents

Solder bonding of semiconductor ic device

Info

Publication number
JPS5548936A
JPS5548936A JP12150278A JP12150278A JPS5548936A JP S5548936 A JPS5548936 A JP S5548936A JP 12150278 A JP12150278 A JP 12150278A JP 12150278 A JP12150278 A JP 12150278A JP S5548936 A JPS5548936 A JP S5548936A
Authority
JP
Japan
Prior art keywords
chip
solder
bump
contact
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12150278A
Other languages
Japanese (ja)
Other versions
JPS6034813B2 (en
Inventor
Muneo Oshima
Masanori Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12150278A priority Critical patent/JPS6034813B2/en
Publication of JPS5548936A publication Critical patent/JPS5548936A/en
Publication of JPS6034813B2 publication Critical patent/JPS6034813B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To improve the connection between a chip and a bump, by mounting a semiconductor chip on the bottom surface of a box-type base, placing on the base a cap having a bump on its lower surface via bonding solder, melting the solder by heat treatment, and pushing the chip upward while reducing the cross section by surface tension.
CONSTITUTION: Semiconductor chip 1 is mounted inside depressed box-type base 1 via melted bonding solder 2. Cap 5 provided on its lower surface control bump 6 via solder heap 7 is placed on either end part of base 1 where bump 6 and chip 1 are kept from coming into contact. Next, the whole structure is subjected to heat treatment, and solder 7 on both end parts is melted and spread, and by lowering cap 5, bump 6 is brought into contact with the surface of chip 1. At the same time, by melting solder 2 placed on the lower surface of chip 1, the cross section is narrowed and the height is increased, and thereby chip 1 is pushed up. In this way, pump 6 in contact with chip 1 is deformed, and the areas of contact between these are made sufficiently large.
COPYRIGHT: (C)1980,JPO&Japio
JP12150278A 1978-10-04 1978-10-04 Solder connection method for semiconductor integrated circuit devices Expired JPS6034813B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12150278A JPS6034813B2 (en) 1978-10-04 1978-10-04 Solder connection method for semiconductor integrated circuit devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12150278A JPS6034813B2 (en) 1978-10-04 1978-10-04 Solder connection method for semiconductor integrated circuit devices

Publications (2)

Publication Number Publication Date
JPS5548936A true JPS5548936A (en) 1980-04-08
JPS6034813B2 JPS6034813B2 (en) 1985-08-10

Family

ID=14812765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12150278A Expired JPS6034813B2 (en) 1978-10-04 1978-10-04 Solder connection method for semiconductor integrated circuit devices

Country Status (1)

Country Link
JP (1) JPS6034813B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201392A (en) * 1982-05-19 1983-11-24 三菱電機株式会社 Method of mounting electronic part

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632020Y2 (en) * 1985-05-29 1988-01-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201392A (en) * 1982-05-19 1983-11-24 三菱電機株式会社 Method of mounting electronic part

Also Published As

Publication number Publication date
JPS6034813B2 (en) 1985-08-10

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