JPS5552250A - Connecting structure in semiconductor integrated circuit - Google Patents

Connecting structure in semiconductor integrated circuit

Info

Publication number
JPS5552250A
JPS5552250A JP12490978A JP12490978A JPS5552250A JP S5552250 A JPS5552250 A JP S5552250A JP 12490978 A JP12490978 A JP 12490978A JP 12490978 A JP12490978 A JP 12490978A JP S5552250 A JPS5552250 A JP S5552250A
Authority
JP
Japan
Prior art keywords
integrated circuit
patch plate
semiconductor integrated
electrodes
bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12490978A
Other languages
Japanese (ja)
Inventor
Norio Matsui
Takaaki Osaki
Taichi Kon
Norio Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP12490978A priority Critical patent/JPS5552250A/en
Publication of JPS5552250A publication Critical patent/JPS5552250A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To provide a connecting structure in a semiconductor integrated circuit where the lead conection is made on the same level and, at the same time, shortened by a manner such that a semiconductor integrated circuit chip is placed in an area provided as depressed below the surface of a patch plate and both the semiconductor chip and the patch plate are connected through their respective electrodes by connecting leads at the same time in accordance with film carrier techiques.
CONSTITUTION: A patch plate 21 is provided with an area 22 depressed below the surface in which a semiconductor integrated circuit chip 23 is deposited, with its own electrodes and those of patch plate 21 being situated on an approximately same level. Each of the former electrodes has a metal bump 25 while each of the latter electrodes has a metal bump 24, the upper ends of these bumps being on the same level. The bumps 24 of the patch plate 21 and the bumps 25 of the semiconductor integrated circuit chip 23 are pressed with heat to be connected to each other at the same time by means of a plurality of connecting leads 27 provided on a film 26 of an organic insulator, such as polyamide. Thus the connected surface of the semiconductor chip and the patch plate is made identical, while each connecting lead 27 as set remains free from bending up- or downward, making it available to obtain fine connection in the shortest distance.
COPYRIGHT: (C)1980,JPO&Japio
JP12490978A 1978-10-11 1978-10-11 Connecting structure in semiconductor integrated circuit Pending JPS5552250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12490978A JPS5552250A (en) 1978-10-11 1978-10-11 Connecting structure in semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12490978A JPS5552250A (en) 1978-10-11 1978-10-11 Connecting structure in semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5552250A true JPS5552250A (en) 1980-04-16

Family

ID=14897102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12490978A Pending JPS5552250A (en) 1978-10-11 1978-10-11 Connecting structure in semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5552250A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4860087A (en) * 1986-03-26 1989-08-22 Hitachi, Ltd. Semiconductor device and process for producing the same
US4907061A (en) * 1986-10-08 1990-03-06 Mitsubishi Denki Kabushiki Kaisha Electronic device
JPH02121343A (en) * 1988-10-28 1990-05-09 Ibiden Co Ltd Film carrier
JPH039973A (en) * 1989-06-07 1991-01-17 Shinko Electric Ind Co Ltd Tape for tab and semiconductor device using it
JPH05129507A (en) * 1991-10-31 1993-05-25 Hitachi Cable Ltd Composite lead frame
US5675684A (en) * 1995-01-23 1997-10-07 Hitachi, Ltd. Optical module having semiconductor elements fixedly mounted thereon with improved accuracy

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4860087A (en) * 1986-03-26 1989-08-22 Hitachi, Ltd. Semiconductor device and process for producing the same
US4907061A (en) * 1986-10-08 1990-03-06 Mitsubishi Denki Kabushiki Kaisha Electronic device
JPH02121343A (en) * 1988-10-28 1990-05-09 Ibiden Co Ltd Film carrier
JPH039973A (en) * 1989-06-07 1991-01-17 Shinko Electric Ind Co Ltd Tape for tab and semiconductor device using it
JPH05129507A (en) * 1991-10-31 1993-05-25 Hitachi Cable Ltd Composite lead frame
US5675684A (en) * 1995-01-23 1997-10-07 Hitachi, Ltd. Optical module having semiconductor elements fixedly mounted thereon with improved accuracy

Similar Documents

Publication Publication Date Title
JPS57143838A (en) Manufacture of semiconductor device
JPS528785A (en) Semiconductor device electrode structure
JPS5513933A (en) Circuit element substrate and its manufacturing method
JPS5552250A (en) Connecting structure in semiconductor integrated circuit
JPS5350686A (en) Production of semiconductor integrated circuit
JPS5348469A (en) Production of hybrid integrated circuit device
JPS5412286A (en) Semiconductor device
JPS57115850A (en) Chip carrier for semiconductor ic
JPS5240968A (en) Process for production of semiconductor device
JPS5412263A (en) Semiconductor element and production of the same
JPS5516415A (en) Diode
JPS5380183A (en) Semiconductor device
JPS5380161A (en) Electrode formation of semiconductor
JPS5265666A (en) Semiconductor device
JPS5496366A (en) Semiconductor device
JPS5259576A (en) Semiconductor device
JPS542076A (en) Manufacture for semiconductor device
JPS535571A (en) Circuit block and its manufacture
JPS554946A (en) Board circuit device
JPS5414159A (en) Manufacture for semiconductor device
JPS5571053A (en) Circuit device
JPS53108372A (en) Substrate for wireless bonding
JPS5379462A (en) Manufacture of semiconductor integrated circuit
JPS52103983A (en) Semiconductor integrated circuit
JPS5344172A (en) Semiconductor integrated circuit