JPS5348469A - Production of hybrid integrated circuit device - Google Patents

Production of hybrid integrated circuit device

Info

Publication number
JPS5348469A
JPS5348469A JP12361776A JP12361776A JPS5348469A JP S5348469 A JPS5348469 A JP S5348469A JP 12361776 A JP12361776 A JP 12361776A JP 12361776 A JP12361776 A JP 12361776A JP S5348469 A JPS5348469 A JP S5348469A
Authority
JP
Japan
Prior art keywords
production
integrated circuit
circuit device
hybrid integrated
flip chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12361776A
Other languages
Japanese (ja)
Inventor
Masayuki Kataoka
Katsuhiko Fukumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12361776A priority Critical patent/JPS5348469A/en
Publication of JPS5348469A publication Critical patent/JPS5348469A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8113—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To readily assemble a flip chip onto the conductor electrodes on a base plate by a solder reflow system without causing any position deviation by providing a position-aligning spare bump on the insulation film of a flip chip.
COPYRIGHT: (C)1978,JPO&Japio
JP12361776A 1976-10-14 1976-10-14 Production of hybrid integrated circuit device Pending JPS5348469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12361776A JPS5348469A (en) 1976-10-14 1976-10-14 Production of hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12361776A JPS5348469A (en) 1976-10-14 1976-10-14 Production of hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5348469A true JPS5348469A (en) 1978-05-01

Family

ID=14865016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12361776A Pending JPS5348469A (en) 1976-10-14 1976-10-14 Production of hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5348469A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55163852A (en) * 1979-06-06 1980-12-20 Hitachi Ltd Connecting system
JPS5645041A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Semiconductor integrated circuit device
JPS5844733A (en) * 1981-09-10 1983-03-15 Mitsubishi Electric Corp Semiconductor device
JPS5891646A (en) * 1981-11-26 1983-05-31 Toshiba Corp Semiconductor device
JPS6155992A (en) * 1984-08-27 1986-03-20 松下電器産業株式会社 Part mounting method
JPH02503497A (en) * 1988-03-16 1990-10-18 ジーイーシー　―　マルコニ　リミテッド Vernier structure for flip-chip bonded devices
JP2001093935A (en) * 1999-09-20 2001-04-06 Rohm Co Ltd Semiconductor device and semiconductor chip used therefor
US6724084B1 (en) 1999-02-08 2004-04-20 Rohm Co., Ltd. Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55163852A (en) * 1979-06-06 1980-12-20 Hitachi Ltd Connecting system
JPS5645041A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Semiconductor integrated circuit device
JPS5844733A (en) * 1981-09-10 1983-03-15 Mitsubishi Electric Corp Semiconductor device
JPS5891646A (en) * 1981-11-26 1983-05-31 Toshiba Corp Semiconductor device
JPS6155992A (en) * 1984-08-27 1986-03-20 松下電器産業株式会社 Part mounting method
JPH02503497A (en) * 1988-03-16 1990-10-18 ジーイーシー　―　マルコニ　リミテッド Vernier structure for flip-chip bonded devices
US6724084B1 (en) 1999-02-08 2004-04-20 Rohm Co., Ltd. Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
US7045900B2 (en) 1999-02-08 2006-05-16 Rohm Co., Ltd Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
JP2001093935A (en) * 1999-09-20 2001-04-06 Rohm Co Ltd Semiconductor device and semiconductor chip used therefor

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