JPS5385159A - Production of using semiconductor support and semiconductor device usingsemiconductor support - Google Patents

Production of using semiconductor support and semiconductor device usingsemiconductor support

Info

Publication number
JPS5385159A
JPS5385159A JP47577A JP47577A JPS5385159A JP S5385159 A JPS5385159 A JP S5385159A JP 47577 A JP47577 A JP 47577A JP 47577 A JP47577 A JP 47577A JP S5385159 A JPS5385159 A JP S5385159A
Authority
JP
Japan
Prior art keywords
support
semiconductor
production
usingsemiconductor
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47577A
Other versions
JPS5917855B2 (en
Inventor
Hikari Fujita
Hiroshi Isotani
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP47577A priority Critical patent/JPS5917855B2/ja
Publication of JPS5385159A publication Critical patent/JPS5385159A/en
Publication of JPS5917855B2 publication Critical patent/JPS5917855B2/ja
Application status is Expired legal-status Critical

Links

Abstract

PURPOSE: To make possible high accuracy and automation in the production of semiconductor devices by assembling semiconductor elements on a tape-form semiconductor support, fitting the elements to a circuit base plate in that state, thereafter separating the elements from the support.
COPYRIGHT: (C)1978,JPO&Japio
JP47577A 1977-01-05 1977-01-05 Expired JPS5917855B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47577A JPS5917855B2 (en) 1977-01-05 1977-01-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47577A JPS5917855B2 (en) 1977-01-05 1977-01-05

Publications (2)

Publication Number Publication Date
JPS5385159A true JPS5385159A (en) 1978-07-27
JPS5917855B2 JPS5917855B2 (en) 1984-04-24

Family

ID=11474797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47577A Expired JPS5917855B2 (en) 1977-01-05 1977-01-05

Country Status (1)

Country Link
JP (1) JPS5917855B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995011523A1 (en) * 1993-10-18 1995-04-27 Clayton James E A thin multichip module
US5517036A (en) * 1992-10-30 1996-05-14 Mitsubishi Denki Kabushiki Kaisha Tape carrier, and test apparatus for the same
US5661339A (en) * 1992-09-16 1997-08-26 Clayton; James E. Thin multichip module
KR101157366B1 (en) 2008-05-21 2012-06-15 퀘리타우, 인크. High temperature ceramic die package and dut board socket

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661339A (en) * 1992-09-16 1997-08-26 Clayton; James E. Thin multichip module
US5731633A (en) * 1992-09-16 1998-03-24 Gary W. Hamilton Thin multichip module
US5517036A (en) * 1992-10-30 1996-05-14 Mitsubishi Denki Kabushiki Kaisha Tape carrier, and test apparatus for the same
US5578919A (en) * 1992-10-30 1996-11-26 Mitsubishi Denki Kabushiki Kaisha Method of testing semiconductor device and test apparatus for the same
WO1995011523A1 (en) * 1993-10-18 1995-04-27 Clayton James E A thin multichip module
KR101157366B1 (en) 2008-05-21 2012-06-15 퀘리타우, 인크. High temperature ceramic die package and dut board socket

Also Published As

Publication number Publication date
JPS5917855B2 (en) 1984-04-24

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