JPS5385159A - Production of using semiconductor support and semiconductor device usingsemiconductor support - Google Patents
Production of using semiconductor support and semiconductor device usingsemiconductor supportInfo
- Publication number
- JPS5385159A JPS5385159A JP47577A JP47577A JPS5385159A JP S5385159 A JPS5385159 A JP S5385159A JP 47577 A JP47577 A JP 47577A JP 47577 A JP47577 A JP 47577A JP S5385159 A JPS5385159 A JP S5385159A
- Authority
- JP
- Japan
- Prior art keywords
- support
- semiconductor
- production
- usingsemiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To make possible high accuracy and automation in the production of semiconductor devices by assembling semiconductor elements on a tape-form semiconductor support, fitting the elements to a circuit base plate in that state, thereafter separating the elements from the support.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47577A JPS5917855B2 (en) | 1977-01-05 | 1977-01-05 | Semiconductor support and method for manufacturing a semiconductor device using the semiconductor support |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47577A JPS5917855B2 (en) | 1977-01-05 | 1977-01-05 | Semiconductor support and method for manufacturing a semiconductor device using the semiconductor support |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5385159A true JPS5385159A (en) | 1978-07-27 |
JPS5917855B2 JPS5917855B2 (en) | 1984-04-24 |
Family
ID=11474797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP47577A Expired JPS5917855B2 (en) | 1977-01-05 | 1977-01-05 | Semiconductor support and method for manufacturing a semiconductor device using the semiconductor support |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5917855B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995011523A1 (en) * | 1993-10-18 | 1995-04-27 | Clayton James E | A thin multichip module |
US5517036A (en) * | 1992-10-30 | 1996-05-14 | Mitsubishi Denki Kabushiki Kaisha | Tape carrier, and test apparatus for the same |
US5661339A (en) * | 1992-09-16 | 1997-08-26 | Clayton; James E. | Thin multichip module |
KR101157366B1 (en) | 2008-05-21 | 2012-06-15 | 퀘리타우, 인크. | High temperature ceramic die package and dut board socket |
-
1977
- 1977-01-05 JP JP47577A patent/JPS5917855B2/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5661339A (en) * | 1992-09-16 | 1997-08-26 | Clayton; James E. | Thin multichip module |
US5731633A (en) * | 1992-09-16 | 1998-03-24 | Gary W. Hamilton | Thin multichip module |
US5517036A (en) * | 1992-10-30 | 1996-05-14 | Mitsubishi Denki Kabushiki Kaisha | Tape carrier, and test apparatus for the same |
US5578919A (en) * | 1992-10-30 | 1996-11-26 | Mitsubishi Denki Kabushiki Kaisha | Method of testing semiconductor device and test apparatus for the same |
WO1995011523A1 (en) * | 1993-10-18 | 1995-04-27 | Clayton James E | A thin multichip module |
KR101157366B1 (en) | 2008-05-21 | 2012-06-15 | 퀘리타우, 인크. | High temperature ceramic die package and dut board socket |
Also Published As
Publication number | Publication date |
---|---|
JPS5917855B2 (en) | 1984-04-24 |
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