JPS5393787A - Production of semiconductor - Google Patents

Production of semiconductor

Info

Publication number
JPS5393787A
JPS5393787A JP833777A JP833777A JPS5393787A JP S5393787 A JPS5393787 A JP S5393787A JP 833777 A JP833777 A JP 833777A JP 833777 A JP833777 A JP 833777A JP S5393787 A JPS5393787 A JP S5393787A
Authority
JP
Japan
Prior art keywords
elements
semiconductor
production
unit
output capacities
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP833777A
Other languages
Japanese (ja)
Inventor
Shigenori Yokoyama
Makoto Tomita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP833777A priority Critical patent/JPS5393787A/en
Publication of JPS5393787A publication Critical patent/JPS5393787A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

PURPOSE: To obtain multiple kinds of elements of different output capacities at low cost by forming a multiplicity of unit semiconductor elements on a semiconductor wafer, cutting and separating arbitrary plural pieces according to required output capacities thereafter parallel connecting the electrodes of the unit elements.
COPYRIGHT: (C)1978,JPO&Japio
JP833777A 1977-01-27 1977-01-27 Production of semiconductor Pending JPS5393787A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP833777A JPS5393787A (en) 1977-01-27 1977-01-27 Production of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP833777A JPS5393787A (en) 1977-01-27 1977-01-27 Production of semiconductor

Publications (1)

Publication Number Publication Date
JPS5393787A true JPS5393787A (en) 1978-08-17

Family

ID=11690372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP833777A Pending JPS5393787A (en) 1977-01-27 1977-01-27 Production of semiconductor

Country Status (1)

Country Link
JP (1) JPS5393787A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561059A (en) * 1978-10-31 1980-05-08 Nec Corp Semiconductor ic device
JPS5690548A (en) * 1979-11-20 1981-07-22 Fujitsu Ltd Manufacture of semiconductor device by master slice system
JPS5795660A (en) * 1980-12-03 1982-06-14 Matsushita Electric Ind Co Ltd Semiconductor device
JPS61109152U (en) * 1984-12-20 1986-07-10

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149776A (en) * 1975-06-17 1976-12-22 Mitsubishi Electric Corp Semiconductor device for power

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149776A (en) * 1975-06-17 1976-12-22 Mitsubishi Electric Corp Semiconductor device for power

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561059A (en) * 1978-10-31 1980-05-08 Nec Corp Semiconductor ic device
JPS5690548A (en) * 1979-11-20 1981-07-22 Fujitsu Ltd Manufacture of semiconductor device by master slice system
JPS6349376B2 (en) * 1979-11-20 1988-10-04 Fujitsu Ltd
JPS5795660A (en) * 1980-12-03 1982-06-14 Matsushita Electric Ind Co Ltd Semiconductor device
JPS61109152U (en) * 1984-12-20 1986-07-10

Similar Documents

Publication Publication Date Title
JPS5393787A (en) Production of semiconductor
JPS53114685A (en) Manufacture for semiconductor device
JPS51135383A (en) Semiconductor variable capacitance device
JPS51118395A (en) Semiconductor emitting unit and manufacturing process
JPS526465A (en) Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPS5296865A (en) Crystal grown unit for chemical compound semiconductor
JPS54984A (en) Containing tool for semiconductor wafer
JPS52149954A (en) Sample holding circuit
JPS5385159A (en) Production of using semiconductor support and semiconductor device usingsemiconductor support
JPS5346222A (en) Solid state pick up unit
JPS5274280A (en) Semiconductor device and its production
JPS5395591A (en) Manufacture for photo electric conversion unit
JPS5390763A (en) Semiconductor element and mask for producing semiconductor element
JPS5410682A (en) Production of semiconductor elements
JPS51113120A (en) Hole current converter
JPS5363866A (en) Production of semiconductor device
JPS5421258A (en) Separation method for semiconductor element
JPS52117059A (en) Preparation of semiconductor wafer
JPS5342575A (en) Semiconductor device
JPS53108315A (en) Light receiving unit
JPS5363885A (en) Production apparatus of solid device
JPS52134387A (en) Semiconductor laser device
JPS5339862A (en) Production of beam lead type semiconductor device
JPS52129302A (en) Power source circuit
JPS53132278A (en) Semiconductor capacity element