JPS52117059A - Preparation of semiconductor wafer - Google Patents
Preparation of semiconductor waferInfo
- Publication number
- JPS52117059A JPS52117059A JP3394876A JP3394876A JPS52117059A JP S52117059 A JPS52117059 A JP S52117059A JP 3394876 A JP3394876 A JP 3394876A JP 3394876 A JP3394876 A JP 3394876A JP S52117059 A JPS52117059 A JP S52117059A
- Authority
- JP
- Japan
- Prior art keywords
- preparation
- semiconductor wafer
- edgebite
- ingot
- bevel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To bevel an ingot by bringing it into contact with a multi-cutting edgebite in which a plurality of teeth each having a conical shape in section are arranged adjacent each other.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3394876A JPS52117059A (en) | 1976-03-27 | 1976-03-27 | Preparation of semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3394876A JPS52117059A (en) | 1976-03-27 | 1976-03-27 | Preparation of semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52117059A true JPS52117059A (en) | 1977-10-01 |
Family
ID=12400717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3394876A Pending JPS52117059A (en) | 1976-03-27 | 1976-03-27 | Preparation of semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52117059A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54121677A (en) * | 1978-03-14 | 1979-09-20 | Nec Corp | Manufacture of semiconductor device |
JPS60167334U (en) * | 1984-04-13 | 1985-11-06 | 富士通株式会社 | Semiconductor substrate manufacturing equipment |
-
1976
- 1976-03-27 JP JP3394876A patent/JPS52117059A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54121677A (en) * | 1978-03-14 | 1979-09-20 | Nec Corp | Manufacture of semiconductor device |
JPS60167334U (en) * | 1984-04-13 | 1985-11-06 | 富士通株式会社 | Semiconductor substrate manufacturing equipment |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS52128066A (en) | Manufacture of semiconductor device | |
JPS528785A (en) | Semiconductor device electrode structure | |
JPS52117059A (en) | Preparation of semiconductor wafer | |
JPS5296865A (en) | Crystal grown unit for chemical compound semiconductor | |
JPS5211525A (en) | Method of manufacturing headrests | |
JPS5393787A (en) | Production of semiconductor | |
JPS524082A (en) | Preparation method of a colored insulated wire | |
JPS5274280A (en) | Semiconductor device and its production | |
JPS51118187A (en) | Method of cutting brittle materials | |
JPS5410682A (en) | Production of semiconductor elements | |
JPS5363866A (en) | Production of semiconductor device | |
JPS5390763A (en) | Semiconductor element and mask for producing semiconductor element | |
JPS51112292A (en) | Semiconductor device | |
JPS5276872A (en) | Cutting method of semiconductor wafer | |
JPS536571A (en) | Preparation of semiconductor device | |
JPS53140976A (en) | Semiconductor device | |
JPS5230171A (en) | Method for fabrication of semiconductor device | |
JPS5441080A (en) | Semiconductor element for evaluation | |
JPS5211761A (en) | Method of cutting semiconductor wafers | |
JPS51132762A (en) | Heat-treatment method of semiconductor device | |
JPS52137982A (en) | Production of semiconductor device | |
JPS5432991A (en) | Manufacture of semiconductor | |
JPS5261956A (en) | Production of semiconductor device | |
JPS5240864A (en) | Manufacturing method of refigerator | |
JPS51140198A (en) | Crystal working process |