JPS52117059A - Preparation of semiconductor wafer - Google Patents

Preparation of semiconductor wafer

Info

Publication number
JPS52117059A
JPS52117059A JP3394876A JP3394876A JPS52117059A JP S52117059 A JPS52117059 A JP S52117059A JP 3394876 A JP3394876 A JP 3394876A JP 3394876 A JP3394876 A JP 3394876A JP S52117059 A JPS52117059 A JP S52117059A
Authority
JP
Japan
Prior art keywords
preparation
semiconductor wafer
edgebite
ingot
bevel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3394876A
Other languages
Japanese (ja)
Inventor
Shozaburo Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3394876A priority Critical patent/JPS52117059A/en
Publication of JPS52117059A publication Critical patent/JPS52117059A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To bevel an ingot by bringing it into contact with a multi-cutting edgebite in which a plurality of teeth each having a conical shape in section are arranged adjacent each other.
COPYRIGHT: (C)1977,JPO&Japio
JP3394876A 1976-03-27 1976-03-27 Preparation of semiconductor wafer Pending JPS52117059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3394876A JPS52117059A (en) 1976-03-27 1976-03-27 Preparation of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3394876A JPS52117059A (en) 1976-03-27 1976-03-27 Preparation of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS52117059A true JPS52117059A (en) 1977-10-01

Family

ID=12400717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3394876A Pending JPS52117059A (en) 1976-03-27 1976-03-27 Preparation of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS52117059A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54121677A (en) * 1978-03-14 1979-09-20 Nec Corp Manufacture of semiconductor device
JPS60167334U (en) * 1984-04-13 1985-11-06 富士通株式会社 Semiconductor substrate manufacturing equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54121677A (en) * 1978-03-14 1979-09-20 Nec Corp Manufacture of semiconductor device
JPS60167334U (en) * 1984-04-13 1985-11-06 富士通株式会社 Semiconductor substrate manufacturing equipment

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