JPS60167334U - Semiconductor substrate manufacturing equipment - Google Patents
Semiconductor substrate manufacturing equipmentInfo
- Publication number
- JPS60167334U JPS60167334U JP5440384U JP5440384U JPS60167334U JP S60167334 U JPS60167334 U JP S60167334U JP 5440384 U JP5440384 U JP 5440384U JP 5440384 U JP5440384 U JP 5440384U JP S60167334 U JPS60167334 U JP S60167334U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- substrate manufacturing
- manufacturing equipment
- substrate
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図イは半導体基板の正面図、同図口は前記多結晶膜
成膜後の基板Ａ−Ａ線切断になる断面図、第２図は第１
図のエツジクラウン除去をなすエツジ研削の側面図、第
３図は本考案の研削砥石実施例とする側断面図である。
図中、１はｎ型半導体基板、２は多結晶シリコン膜、３
はエツジクラウン、４は従来の研削砥石、７は基板エツ
ジ、５と１１は回転軸、１０は本考案の研削砥石（研削
刃）、及び１３は１０のテーパ形成のベベル刃面である
。Figure 1A is a front view of the semiconductor substrate, the opening of the figure is a cross-sectional view taken along the line A-A of the substrate after the polycrystalline film has been formed, and Figure 2 is the front view of the semiconductor substrate.
FIG. 3 is a side view of edge grinding for removing the edge crown, and FIG. 3 is a side sectional view of an embodiment of the grinding wheel of the present invention. In the figure, 1 is an n-type semiconductor substrate, 2 is a polycrystalline silicon film, and 3 is a polycrystalline silicon film.
4 is an edge crown, 4 is a conventional grinding wheel, 7 is a substrate edge, 5 and 11 are rotating shafts, 10 is a grinding wheel (grinding blade) of the present invention, and 13 is a tapered beveled blade surface of 10.
Claims (1)
向に駆動されるベベル形状砥石により研削することを特
徴とする半導体基板の製造装置。A semiconductor substrate manufacturing device characterized in that the edge grinding device for semiconductor substrates performs grinding using a bevel-shaped grindstone driven in the thickness direction of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5440384U JPS60167334U (en) | 1984-04-13 | 1984-04-13 | Semiconductor substrate manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5440384U JPS60167334U (en) | 1984-04-13 | 1984-04-13 | Semiconductor substrate manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60167334U true JPS60167334U (en) | 1985-11-06 |
Family
ID=30576129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5440384U Pending JPS60167334U (en) | 1984-04-13 | 1984-04-13 | Semiconductor substrate manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60167334U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52117059A (en) * | 1976-03-27 | 1977-10-01 | Toshiba Corp | Preparation of semiconductor wafer |
-
1984
- 1984-04-13 JP JP5440384U patent/JPS60167334U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52117059A (en) * | 1976-03-27 | 1977-10-01 | Toshiba Corp | Preparation of semiconductor wafer |
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