JPS62154648U - - Google Patents
Info
- Publication number
- JPS62154648U JPS62154648U JP4239386U JP4239386U JPS62154648U JP S62154648 U JPS62154648 U JP S62154648U JP 4239386 U JP4239386 U JP 4239386U JP 4239386 U JP4239386 U JP 4239386U JP S62154648 U JPS62154648 U JP S62154648U
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chuck
- groove
- groove along
- outer periphery
- plate body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 1
Description
第１図ａ及びｂは本考案の真空チヤツクを説明
する図であり、第１図ａは真空チヤツクの平面図
、第１図ｂは第１図ａのＩ―Ｉ線断面図である。
また、第２図は第１図の真空チヤツクの作用を説
明する第１図ｂの部分拡大図である。３図はスピ
ンナ装置の断面図である。第４図は従来の真空チ
ヤツクを説明する図であり、第４図ａは平面図、
第４図ｂは第４図ａの―線断面図である。ま
た、第５図は液体の吸引作用を説明する第４図ｂ
の部分拡大図である。
３Ａ……真空チヤツク、５……ウエハ、８Ａ…
…上面、１２……第１の溝、１３……第２の溝、
１４……外周縁、１６，１７……穴部、１８……
下面、１９，２０……下面に形成された溝。
FIGS. 1a and 1b are diagrams illustrating the vacuum chuck of the present invention. FIG. 1a is a plan view of the vacuum chuck, and FIG. 1b is a sectional view taken along line II in FIG. 1a.
Further, FIG. 2 is a partially enlarged view of FIG. 1b for explaining the operation of the vacuum chuck of FIG. 1. FIG. 3 is a sectional view of the spinner device. Fig. 4 is a diagram explaining a conventional vacuum chuck, Fig. 4a is a plan view,
FIG. 4b is a sectional view taken along the line -- in FIG. 4a. In addition, Fig. 5 is Fig. 4b explaining the liquid suction action.
FIG. 3A...Vacuum chuck, 5...Wafer, 8A...
...Top surface, 12...First groove, 13...Second groove,
14... Outer periphery, 16, 17... Hole, 18...
Lower surface, 19, 20... Grooves formed on the lower surface.
Claims (1)
持する真空チヤツクにおいて、 外周縁に沿う溝が前記上面に形成され、この溝
には下面に開口する穴部が形成されていることを
特徴とする薄板体保持用真空チヤツク。 (2) 溝は、外周縁に沿う第１の溝と、この第１
の溝に沿う第２の溝とで構成されていることを特
徴とする実用新案登録請求の範囲第(1)項記載の
薄板体保持用真空チヤツク。[Claims for Utility Model Registration] (1) In a vacuum chuck that holds a thin plate body placed on the upper surface by vacuum suction, a groove along the outer periphery is formed on the upper surface, and this groove has an opening on the lower surface. A vacuum chuck for holding a thin plate body, characterized by having a hole formed therein. (2) The grooves include a first groove along the outer periphery and a first groove along the outer periphery;
A vacuum chuck for holding a thin plate body according to claim (1) of the utility model registration, characterized in that the vacuum chuck comprises a second groove along the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4239386U JPH019169Y2 (en) | 1986-03-25 | 1986-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4239386U JPH019169Y2 (en) | 1986-03-25 | 1986-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62154648U true JPS62154648U (en) | 1987-10-01 |
| JPH019169Y2 JPH019169Y2 (en) | 1989-03-13 |
Family
ID=30858258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4239386U Expired JPH019169Y2 (en) | 1986-03-25 | 1986-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH019169Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007067303A (en) * | 2005-09-01 | 2007-03-15 | Tokyo Electron Ltd | Substrate transfer device, method of transferring substrate, and coater and developing device |
| JP2013131709A (en) * | 2011-12-22 | 2013-07-04 | Disco Abrasive Syst Ltd | Wafer holding apparatus |
-
1986
- 1986-03-25 JP JP4239386U patent/JPH019169Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007067303A (en) * | 2005-09-01 | 2007-03-15 | Tokyo Electron Ltd | Substrate transfer device, method of transferring substrate, and coater and developing device |
| JP4616731B2 (en) * | 2005-09-01 | 2011-01-19 | 東京エレクトロン株式会社 | Coating and developing equipment |
| JP2013131709A (en) * | 2011-12-22 | 2013-07-04 | Disco Abrasive Syst Ltd | Wafer holding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH019169Y2 (en) | 1989-03-13 |