JPS54121677A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS54121677A
JPS54121677A JP2961078A JP2961078A JPS54121677A JP S54121677 A JPS54121677 A JP S54121677A JP 2961078 A JP2961078 A JP 2961078A JP 2961078 A JP2961078 A JP 2961078A JP S54121677 A JPS54121677 A JP S54121677A
Authority
JP
Japan
Prior art keywords
pellet
chuck
substrate
fixed
bevelling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2961078A
Other languages
Japanese (ja)
Inventor
Yoshio Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2961078A priority Critical patent/JPS54121677A/en
Publication of JPS54121677A publication Critical patent/JPS54121677A/en
Pending legal-status Critical Current

Links

Landscapes

  • Bipolar Transistors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To ensure the bevelling of a desired shape in a high reproducibility by forming the bevel part through contact between the pellet periphery part and the diamond grindstone after giving a fixed-speed turn to the semiconductor element obtained by adhering the semiconductor pellet to the substrate.
CONSTITUTION: Semiconductor pellet 1 is soldered onto substrate 3 via solder 2, and substrate 3 is held by chuck 8 and 8' and via buffering substance 10. Then chuck 8 is pushed up to actuate spring 11, and at the same time pellet 1 is made to touch upper tool 9. Under these conditions, a fixed-speed turn is given to chuck 8 and 8'. After this, diamond grindstone 12 containing fixed surface 19 to touch pellet 1 is turned in the opposite direction to chuck 8 and 8' and pressed to the periphery part of pellet 1. Thus, bevel part 18 is formed. In this way, the uniform bevelling can be formed with a desired angle by selecting grindstone surface 19.
COPYRIGHT: (C)1979,JPO&Japio
JP2961078A 1978-03-14 1978-03-14 Manufacture of semiconductor device Pending JPS54121677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2961078A JPS54121677A (en) 1978-03-14 1978-03-14 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2961078A JPS54121677A (en) 1978-03-14 1978-03-14 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS54121677A true JPS54121677A (en) 1979-09-20

Family

ID=12280826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2961078A Pending JPS54121677A (en) 1978-03-14 1978-03-14 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS54121677A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504544A (en) * 1972-10-05 1975-01-17
JPS52117059A (en) * 1976-03-27 1977-10-01 Toshiba Corp Preparation of semiconductor wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504544A (en) * 1972-10-05 1975-01-17
JPS52117059A (en) * 1976-03-27 1977-10-01 Toshiba Corp Preparation of semiconductor wafer

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