JPS54121677A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS54121677A JPS54121677A JP2961078A JP2961078A JPS54121677A JP S54121677 A JPS54121677 A JP S54121677A JP 2961078 A JP2961078 A JP 2961078A JP 2961078 A JP2961078 A JP 2961078A JP S54121677 A JPS54121677 A JP S54121677A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- chuck
- substrate
- fixed
- bevelling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Bipolar Transistors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE: To ensure the bevelling of a desired shape in a high reproducibility by forming the bevel part through contact between the pellet periphery part and the diamond grindstone after giving a fixed-speed turn to the semiconductor element obtained by adhering the semiconductor pellet to the substrate.
CONSTITUTION: Semiconductor pellet 1 is soldered onto substrate 3 via solder 2, and substrate 3 is held by chuck 8 and 8' and via buffering substance 10. Then chuck 8 is pushed up to actuate spring 11, and at the same time pellet 1 is made to touch upper tool 9. Under these conditions, a fixed-speed turn is given to chuck 8 and 8'. After this, diamond grindstone 12 containing fixed surface 19 to touch pellet 1 is turned in the opposite direction to chuck 8 and 8' and pressed to the periphery part of pellet 1. Thus, bevel part 18 is formed. In this way, the uniform bevelling can be formed with a desired angle by selecting grindstone surface 19.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2961078A JPS54121677A (en) | 1978-03-14 | 1978-03-14 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2961078A JPS54121677A (en) | 1978-03-14 | 1978-03-14 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54121677A true JPS54121677A (en) | 1979-09-20 |
Family
ID=12280826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2961078A Pending JPS54121677A (en) | 1978-03-14 | 1978-03-14 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54121677A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS504544A (en) * | 1972-10-05 | 1975-01-17 | ||
JPS52117059A (en) * | 1976-03-27 | 1977-10-01 | Toshiba Corp | Preparation of semiconductor wafer |
-
1978
- 1978-03-14 JP JP2961078A patent/JPS54121677A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS504544A (en) * | 1972-10-05 | 1975-01-17 | ||
JPS52117059A (en) * | 1976-03-27 | 1977-10-01 | Toshiba Corp | Preparation of semiconductor wafer |
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