JPS5310969A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5310969A
JPS5310969A JP8512976A JP8512976A JPS5310969A JP S5310969 A JPS5310969 A JP S5310969A JP 8512976 A JP8512976 A JP 8512976A JP 8512976 A JP8512976 A JP 8512976A JP S5310969 A JPS5310969 A JP S5310969A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
chip
lapping
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8512976A
Other languages
Japanese (ja)
Inventor
Masao Tsuruoka
Takayuki Wakui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8512976A priority Critical patent/JPS5310969A/en
Publication of JPS5310969A publication Critical patent/JPS5310969A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent the increase in contact resistance by depositing the same conductivity type layer of a high impurity concentration on the main surface of a chip, fitting the chip into a glass layer and lapping the surface.
COPYRIGHT: (C)1978,JPO&Japio
JP8512976A 1976-07-19 1976-07-19 Production of semiconductor device Pending JPS5310969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8512976A JPS5310969A (en) 1976-07-19 1976-07-19 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8512976A JPS5310969A (en) 1976-07-19 1976-07-19 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5310969A true JPS5310969A (en) 1978-01-31

Family

ID=13850031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8512976A Pending JPS5310969A (en) 1976-07-19 1976-07-19 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5310969A (en)

Similar Documents

Publication Publication Date Title
JPS52101990A (en) Semiconductor device for photoelectric transducer and its manufacture
JPS5356972A (en) Mesa type semiconductor device
JPS5363993A (en) Production of semiconductor device
JPS5310969A (en) Production of semiconductor device
JPS5379378A (en) Semoconductor davice and its production
JPS5228879A (en) Semiconductor device and method for its production
JPS5261960A (en) Production of semiconductor device
JPS531471A (en) Manufacture for semiconductor device
JPS5240986A (en) Process for production of semiconductor element
JPS52117063A (en) Preparation of ohmic ontact layer in semiconductor device
JPS53121483A (en) Semiconductor device
JPS5317286A (en) Production of semiconductor device
JPS5287373A (en) Production of semiconductor device
JPS5377168A (en) Production of semiconductor device
JPS5329668A (en) Production of semiconductor device
JPS5353965A (en) Semiconductor device and its production
JPS5372482A (en) Manufacture for semiconductor device
JPS52153382A (en) Preparation of semiconductor device
JPS5251872A (en) Production of semiconductor device
JPS5380184A (en) Manufacture of semiconductor device
JPS5354989A (en) Semiconductor device
JPS5272186A (en) Production of mis type semiconductor device
JPS5362481A (en) Production of semiconductor device
JPS5263067A (en) Production of semiconductor device
JPS526081A (en) Semiconductor wafer