JPS5726439A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5726439A
JPS5726439A JP10147680A JP10147680A JPS5726439A JP S5726439 A JPS5726439 A JP S5726439A JP 10147680 A JP10147680 A JP 10147680A JP 10147680 A JP10147680 A JP 10147680A JP S5726439 A JPS5726439 A JP S5726439A
Authority
JP
Japan
Prior art keywords
machined
grindstones
pellet
bevel
good reproducibility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10147680A
Other languages
Japanese (ja)
Inventor
Yoshio Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10147680A priority Critical patent/JPS5726439A/en
Publication of JPS5726439A publication Critical patent/JPS5726439A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To obtain the prescribed bevel part uniformly with good reproducibility by holding and rotating a semiconductor element and contacting two types of diamond grindstones having suitable grain size and the prescribed shape with a part to be machined of the element. CONSTITUTION:When a semiconductor pellet 1 is soldered at 2 to a substrate 3, is held with upper and lower rotary chucks 14, 15 and the surfaces 11, 13 of grindstones 10, 12 are contacted with the periphery of the pellet 1, the latter is machined at two-step bevel structure. By variously altering the shapes of the surfaces 11, 13 of the grindstones, the pellet can be uniformly machined at the bevel shape with good reproducibility.
JP10147680A 1980-07-24 1980-07-24 Manufacture of semiconductor device Pending JPS5726439A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10147680A JPS5726439A (en) 1980-07-24 1980-07-24 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10147680A JPS5726439A (en) 1980-07-24 1980-07-24 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5726439A true JPS5726439A (en) 1982-02-12

Family

ID=14301776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10147680A Pending JPS5726439A (en) 1980-07-24 1980-07-24 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5726439A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793102A (en) * 1986-10-13 1988-12-27 Bbc Brown Boveri Ag Method of producing a beveled peripheral profile on a semiconductor disc

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793102A (en) * 1986-10-13 1988-12-27 Bbc Brown Boveri Ag Method of producing a beveled peripheral profile on a semiconductor disc

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