JPS5698840A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPS5698840A
JPS5698840A JP99480A JP99480A JPS5698840A JP S5698840 A JPS5698840 A JP S5698840A JP 99480 A JP99480 A JP 99480A JP 99480 A JP99480 A JP 99480A JP S5698840 A JPS5698840 A JP S5698840A
Authority
JP
Japan
Prior art keywords
preparation
border
substrate
manner
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP99480A
Other languages
Japanese (ja)
Inventor
Toshihiro Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP99480A priority Critical patent/JPS5698840A/en
Publication of JPS5698840A publication Critical patent/JPS5698840A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To increase the strength of the substrate, by making grooves around the part from within which the semiconductor chips are obtained in a manner that the groove does not border on the neighboring ones. CONSTITUTION:With the usual size and arrangement of the part 3, the circular groove 2a is prepared around it so that it does not border on the neighboring circular groove. In this manner the substrate does not break during the preparation and the better yield can be obtained in the form of hexagonal chips by cutting the line 4 after the preparation finished.
JP99480A 1980-01-08 1980-01-08 Preparation of semiconductor device Pending JPS5698840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP99480A JPS5698840A (en) 1980-01-08 1980-01-08 Preparation of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP99480A JPS5698840A (en) 1980-01-08 1980-01-08 Preparation of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5698840A true JPS5698840A (en) 1981-08-08

Family

ID=11489141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP99480A Pending JPS5698840A (en) 1980-01-08 1980-01-08 Preparation of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5698840A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014126872A1 (en) * 2013-02-18 2014-08-21 Microchip Technology Incorporated Non-conventional method of silicon wafer sawing using a plurality of wafer saw rotational angles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014126872A1 (en) * 2013-02-18 2014-08-21 Microchip Technology Incorporated Non-conventional method of silicon wafer sawing using a plurality of wafer saw rotational angles

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