JPS5698840A - Preparation of semiconductor device - Google Patents
Preparation of semiconductor deviceInfo
- Publication number
- JPS5698840A JPS5698840A JP99480A JP99480A JPS5698840A JP S5698840 A JPS5698840 A JP S5698840A JP 99480 A JP99480 A JP 99480A JP 99480 A JP99480 A JP 99480A JP S5698840 A JPS5698840 A JP S5698840A
- Authority
- JP
- Japan
- Prior art keywords
- preparation
- border
- substrate
- manner
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Dicing (AREA)
Abstract
PURPOSE:To increase the strength of the substrate, by making grooves around the part from within which the semiconductor chips are obtained in a manner that the groove does not border on the neighboring ones. CONSTITUTION:With the usual size and arrangement of the part 3, the circular groove 2a is prepared around it so that it does not border on the neighboring circular groove. In this manner the substrate does not break during the preparation and the better yield can be obtained in the form of hexagonal chips by cutting the line 4 after the preparation finished.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP99480A JPS5698840A (en) | 1980-01-08 | 1980-01-08 | Preparation of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP99480A JPS5698840A (en) | 1980-01-08 | 1980-01-08 | Preparation of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5698840A true JPS5698840A (en) | 1981-08-08 |
Family
ID=11489141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP99480A Pending JPS5698840A (en) | 1980-01-08 | 1980-01-08 | Preparation of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5698840A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014126872A1 (en) * | 2013-02-18 | 2014-08-21 | Microchip Technology Incorporated | Non-conventional method of silicon wafer sawing using a plurality of wafer saw rotational angles |
-
1980
- 1980-01-08 JP JP99480A patent/JPS5698840A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014126872A1 (en) * | 2013-02-18 | 2014-08-21 | Microchip Technology Incorporated | Non-conventional method of silicon wafer sawing using a plurality of wafer saw rotational angles |
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