JPS57111050A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57111050A
JPS57111050A JP18687080A JP18687080A JPS57111050A JP S57111050 A JPS57111050 A JP S57111050A JP 18687080 A JP18687080 A JP 18687080A JP 18687080 A JP18687080 A JP 18687080A JP S57111050 A JPS57111050 A JP S57111050A
Authority
JP
Japan
Prior art keywords
stage
semiconductor device
plating layer
face
whole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18687080A
Other languages
Japanese (ja)
Inventor
Masahiro Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18687080A priority Critical patent/JPS57111050A/en
Publication of JPS57111050A publication Critical patent/JPS57111050A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To enable to form a plating layer on the whole of the face of a stage to face with a chip of a semiconductor device by a method wherein the area of upper surface of the stage is made smaller than the area of the lower surface. CONSTITUTION:The stage is formed in a pedestal type 8 having taper at the sided, the plating layer 5 is applied on the stage 8, and the semiconductor chip 6 is adhered on the upper face thereof. Accordingly even when the stage 8 is provided close by a frame part 1, a gap exists between the frame part 1 and the stage 8, the plating layer 5 can be formed on the whole of the sides of the stage 8, and manufacturing yield of the semiconductor device is enhanced.
JP18687080A 1980-12-26 1980-12-26 Semiconductor device Pending JPS57111050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18687080A JPS57111050A (en) 1980-12-26 1980-12-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18687080A JPS57111050A (en) 1980-12-26 1980-12-26 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57111050A true JPS57111050A (en) 1982-07-10

Family

ID=16196105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18687080A Pending JPS57111050A (en) 1980-12-26 1980-12-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57111050A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5976450A (en) * 1982-10-23 1984-05-01 Fujitsu Ltd Semiconductor device
JPS6420727U (en) * 1987-07-27 1989-02-01

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114271A (en) * 1974-07-26 1976-02-04 Nippon Electric Co HANDO TAIYOKI

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114271A (en) * 1974-07-26 1976-02-04 Nippon Electric Co HANDO TAIYOKI

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5976450A (en) * 1982-10-23 1984-05-01 Fujitsu Ltd Semiconductor device
JPS6420727U (en) * 1987-07-27 1989-02-01

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