JPS57111050A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57111050A JPS57111050A JP18687080A JP18687080A JPS57111050A JP S57111050 A JPS57111050 A JP S57111050A JP 18687080 A JP18687080 A JP 18687080A JP 18687080 A JP18687080 A JP 18687080A JP S57111050 A JPS57111050 A JP S57111050A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- semiconductor device
- plating layer
- face
- whole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To enable to form a plating layer on the whole of the face of a stage to face with a chip of a semiconductor device by a method wherein the area of upper surface of the stage is made smaller than the area of the lower surface. CONSTITUTION:The stage is formed in a pedestal type 8 having taper at the sided, the plating layer 5 is applied on the stage 8, and the semiconductor chip 6 is adhered on the upper face thereof. Accordingly even when the stage 8 is provided close by a frame part 1, a gap exists between the frame part 1 and the stage 8, the plating layer 5 can be formed on the whole of the sides of the stage 8, and manufacturing yield of the semiconductor device is enhanced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18687080A JPS57111050A (en) | 1980-12-26 | 1980-12-26 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18687080A JPS57111050A (en) | 1980-12-26 | 1980-12-26 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57111050A true JPS57111050A (en) | 1982-07-10 |
Family
ID=16196105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18687080A Pending JPS57111050A (en) | 1980-12-26 | 1980-12-26 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57111050A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5976450A (en) * | 1982-10-23 | 1984-05-01 | Fujitsu Ltd | Semiconductor device |
JPS6420727U (en) * | 1987-07-27 | 1989-02-01 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5114271A (en) * | 1974-07-26 | 1976-02-04 | Nippon Electric Co | HANDO TAIYOKI |
-
1980
- 1980-12-26 JP JP18687080A patent/JPS57111050A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5114271A (en) * | 1974-07-26 | 1976-02-04 | Nippon Electric Co | HANDO TAIYOKI |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5976450A (en) * | 1982-10-23 | 1984-05-01 | Fujitsu Ltd | Semiconductor device |
JPS6420727U (en) * | 1987-07-27 | 1989-02-01 |
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