JPS5318960A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS5318960A
JPS5318960A JP9369376A JP9369376A JPS5318960A JP S5318960 A JPS5318960 A JP S5318960A JP 9369376 A JP9369376 A JP 9369376A JP 9369376 A JP9369376 A JP 9369376A JP S5318960 A JPS5318960 A JP S5318960A
Authority
JP
Japan
Prior art keywords
bonding method
sand
junction
reliability
improvement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9369376A
Other languages
Japanese (ja)
Inventor
Yoshiharu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP9369376A priority Critical patent/JPS5318960A/en
Publication of JPS5318960A publication Critical patent/JPS5318960A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE:To achieve the improvement in the reliability of junction sand the reduction in cost by providing more than 1 layer of elastic material layers on the substrate secured with semiconductor chips.
JP9369376A 1976-08-06 1976-08-06 Bonding method Pending JPS5318960A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9369376A JPS5318960A (en) 1976-08-06 1976-08-06 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9369376A JPS5318960A (en) 1976-08-06 1976-08-06 Bonding method

Publications (1)

Publication Number Publication Date
JPS5318960A true JPS5318960A (en) 1978-02-21

Family

ID=14089472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9369376A Pending JPS5318960A (en) 1976-08-06 1976-08-06 Bonding method

Country Status (1)

Country Link
JP (1) JPS5318960A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552229A (en) * 1978-10-11 1980-04-16 Nec Corp Manufacture of semiconductor device
JPH0159282U (en) * 1987-10-09 1989-04-13
JPH0329452U (en) * 1989-07-31 1991-03-25

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552229A (en) * 1978-10-11 1980-04-16 Nec Corp Manufacture of semiconductor device
JPS6130737B2 (en) * 1978-10-11 1986-07-15 Nippon Electric Co
JPH0159282U (en) * 1987-10-09 1989-04-13
JPH0513729Y2 (en) * 1987-10-09 1993-04-12
JPH0329452U (en) * 1989-07-31 1991-03-25

Similar Documents

Publication Publication Date Title
JPS5356972A (en) Mesa type semiconductor device
JPS5269589A (en) Semiconductor capacity element
JPS5318960A (en) Bonding method
JPS5258469A (en) Resin-molded type semiconductor device
JPS538566A (en) Mounting structure of semiconductor ic circuit
JPS5226164A (en) Semi-conductor unit
JPS5356969A (en) Production of tape for tape carrier
JPS51132764A (en) Semiconductor device
JPS53117970A (en) Resin seal type semiconductor device
JPS5316586A (en) Semiconductor device
JPS5317286A (en) Production of semiconductor device
JPS5258363A (en) Formation of semiconductor layer
JPS5411690A (en) Semiconductor laser unit
JPS5275280A (en) Semiconductor device
JPS5380182A (en) Semiconductor device
JPS538058A (en) Production of semiconductor device
JPS5259571A (en) Substrate for face down bonding
JPS5272189A (en) Production of semiconductor device
JPS52156561A (en) Resin molded semiconductor device and its production
JPS5321568A (en) Production of semiconductor device
JPS5310279A (en) Mesa type semiconductor device
JPS52104072A (en) High voltage semiconductor device
JPS5356983A (en) Multilayer wiring substrate
JPS5250182A (en) Semiconductor device
JPS5336180A (en) Production of semiconductor device

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050817

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20051018

R150 Certificate of patent (=grant) or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091028

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees