JPS5321568A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5321568A
JPS5321568A JP9651576A JP9651576A JPS5321568A JP S5321568 A JPS5321568 A JP S5321568A JP 9651576 A JP9651576 A JP 9651576A JP 9651576 A JP9651576 A JP 9651576A JP S5321568 A JPS5321568 A JP S5321568A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
wirings
smoothing
disconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9651576A
Other languages
Japanese (ja)
Other versions
JPS5712535B2 (en
Inventor
Masaharu Noyori
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9651576A priority Critical patent/JPS5321568A/en
Publication of JPS5321568A publication Critical patent/JPS5321568A/en
Publication of JPS5712535B2 publication Critical patent/JPS5712535B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • H01L2224/921Connecting a surface with connectors of different types
    • H01L2224/9212Sequential connecting processes
    • H01L2224/92142Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Abstract

PURPOSE: To prevent the disconnection of vapor-deposited wirings by providing recesses to one layer of two layered resin films and smoothing the top surface thereof.
COPYRIGHT: (C)1978,JPO&Japio
JP9651576A 1976-08-11 1976-08-11 Production of semiconductor device Granted JPS5321568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9651576A JPS5321568A (en) 1976-08-11 1976-08-11 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9651576A JPS5321568A (en) 1976-08-11 1976-08-11 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5321568A true JPS5321568A (en) 1978-02-28
JPS5712535B2 JPS5712535B2 (en) 1982-03-11

Family

ID=14167266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9651576A Granted JPS5321568A (en) 1976-08-11 1976-08-11 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5321568A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59163230A (en) * 1983-03-02 1984-09-14 Daifuku Co Ltd Heavy cargo carrying device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247813U (en) * 1985-09-12 1987-03-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59163230A (en) * 1983-03-02 1984-09-14 Daifuku Co Ltd Heavy cargo carrying device

Also Published As

Publication number Publication date
JPS5712535B2 (en) 1982-03-11

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