JPS5321568A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5321568A JPS5321568A JP9651576A JP9651576A JPS5321568A JP S5321568 A JPS5321568 A JP S5321568A JP 9651576 A JP9651576 A JP 9651576A JP 9651576 A JP9651576 A JP 9651576A JP S5321568 A JPS5321568 A JP S5321568A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- wirings
- smoothing
- disconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
Abstract
PURPOSE: To prevent the disconnection of vapor-deposited wirings by providing recesses to one layer of two layered resin films and smoothing the top surface thereof.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9651576A JPS5321568A (en) | 1976-08-11 | 1976-08-11 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9651576A JPS5321568A (en) | 1976-08-11 | 1976-08-11 | Production of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5321568A true JPS5321568A (en) | 1978-02-28 |
JPS5712535B2 JPS5712535B2 (en) | 1982-03-11 |
Family
ID=14167266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9651576A Granted JPS5321568A (en) | 1976-08-11 | 1976-08-11 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5321568A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59163230A (en) * | 1983-03-02 | 1984-09-14 | Daifuku Co Ltd | Heavy cargo carrying device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6247813U (en) * | 1985-09-12 | 1987-03-24 |
-
1976
- 1976-08-11 JP JP9651576A patent/JPS5321568A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59163230A (en) * | 1983-03-02 | 1984-09-14 | Daifuku Co Ltd | Heavy cargo carrying device |
Also Published As
Publication number | Publication date |
---|---|
JPS5712535B2 (en) | 1982-03-11 |
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