JPS5321569A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5321569A
JPS5321569A JP9651776A JP9651776A JPS5321569A JP S5321569 A JPS5321569 A JP S5321569A JP 9651776 A JP9651776 A JP 9651776A JP 9651776 A JP9651776 A JP 9651776A JP S5321569 A JPS5321569 A JP S5321569A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
smoothing
disconnection
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9651776A
Other languages
Japanese (ja)
Other versions
JPS5712536B2 (en
Inventor
Masaharu Noyori
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9651776A priority Critical patent/JPS5321569A/en
Publication of JPS5321569A publication Critical patent/JPS5321569A/en
Publication of JPS5712536B2 publication Critical patent/JPS5712536B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Abstract

PURPOSE: To prevent the disconnection of metal wirings by providing recesses to one layer of two layered resin films and smoothing the top surface thereof.
COPYRIGHT: (C)1978,JPO&Japio
JP9651776A 1976-08-11 1976-08-11 Production of semiconductor device Granted JPS5321569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9651776A JPS5321569A (en) 1976-08-11 1976-08-11 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9651776A JPS5321569A (en) 1976-08-11 1976-08-11 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5321569A true JPS5321569A (en) 1978-02-28
JPS5712536B2 JPS5712536B2 (en) 1982-03-11

Family

ID=14167321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9651776A Granted JPS5321569A (en) 1976-08-11 1976-08-11 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5321569A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117476A (en) * 2007-11-02 2009-05-28 Seiko Epson Corp Mounting structure of electronic component
US11718182B2 (en) 2020-01-02 2023-08-08 Crrc Qingdao Sifang Co., Ltd. Railway vehicle with aerodynamic lift control device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117476A (en) * 2007-11-02 2009-05-28 Seiko Epson Corp Mounting structure of electronic component
JP4525734B2 (en) * 2007-11-02 2010-08-18 セイコーエプソン株式会社 Electronic component mounting structure
US8227914B2 (en) 2007-11-02 2012-07-24 Seiko Epson Corporation Mounting structure of electronic component
US11718182B2 (en) 2020-01-02 2023-08-08 Crrc Qingdao Sifang Co., Ltd. Railway vehicle with aerodynamic lift control device

Also Published As

Publication number Publication date
JPS5712536B2 (en) 1982-03-11

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