JPS5793545A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5793545A JPS5793545A JP17037580A JP17037580A JPS5793545A JP S5793545 A JPS5793545 A JP S5793545A JP 17037580 A JP17037580 A JP 17037580A JP 17037580 A JP17037580 A JP 17037580A JP S5793545 A JPS5793545 A JP S5793545A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- scribing
- semiconductor device
- dividing
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
PURPOSE:To suppress the damage of a semiconductor device at the time of dividing a semiconductor wafer by scribing the wafer along a scribing line, then selectively forming an etched groove at the scribing line part and then dividing the wafer. CONSTITUTION:A semiconductor wafer 10 formed with a semiconductor device is shallowly scribed along the center lie of a scribing metal 3. A resist film 7 is formed on a region except the scribing metal 3, with the film 7 as a mask the wafer 10 is selectively etched. Since the etching is advanced along the crack formed at the scribing time, the part applied with stress can be removed. Subsequently, the metal 3 is removed by etching. Eventually, the film 7 is removed, the back surface of the wafer is pressurized to divide the chip. Since the cracks due to the scribing is removed in advance, the chips of the wafer do not scatter at the dividing time.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17037580A JPS5793545A (en) | 1980-12-03 | 1980-12-03 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17037580A JPS5793545A (en) | 1980-12-03 | 1980-12-03 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5793545A true JPS5793545A (en) | 1982-06-10 |
Family
ID=15903765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17037580A Pending JPS5793545A (en) | 1980-12-03 | 1980-12-03 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5793545A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07211674A (en) * | 1993-12-30 | 1995-08-11 | At & T Corp | Manufacture of electrooptic device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS497624A (en) * | 1972-05-23 | 1974-01-23 | ||
JPS4933907A (en) * | 1972-07-28 | 1974-03-28 | ||
JPS5026903A (en) * | 1973-07-12 | 1975-03-20 |
-
1980
- 1980-12-03 JP JP17037580A patent/JPS5793545A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS497624A (en) * | 1972-05-23 | 1974-01-23 | ||
JPS4933907A (en) * | 1972-07-28 | 1974-03-28 | ||
JPS5026903A (en) * | 1973-07-12 | 1975-03-20 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07211674A (en) * | 1993-12-30 | 1995-08-11 | At & T Corp | Manufacture of electrooptic device |
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