JPS5793545A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5793545A
JPS5793545A JP17037580A JP17037580A JPS5793545A JP S5793545 A JPS5793545 A JP S5793545A JP 17037580 A JP17037580 A JP 17037580A JP 17037580 A JP17037580 A JP 17037580A JP S5793545 A JPS5793545 A JP S5793545A
Authority
JP
Japan
Prior art keywords
wafer
scribing
semiconductor device
dividing
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17037580A
Other languages
Japanese (ja)
Inventor
Masahiko Shimazaki
Kinshiro Kosemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17037580A priority Critical patent/JPS5793545A/en
Publication of JPS5793545A publication Critical patent/JPS5793545A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To suppress the damage of a semiconductor device at the time of dividing a semiconductor wafer by scribing the wafer along a scribing line, then selectively forming an etched groove at the scribing line part and then dividing the wafer. CONSTITUTION:A semiconductor wafer 10 formed with a semiconductor device is shallowly scribed along the center lie of a scribing metal 3. A resist film 7 is formed on a region except the scribing metal 3, with the film 7 as a mask the wafer 10 is selectively etched. Since the etching is advanced along the crack formed at the scribing time, the part applied with stress can be removed. Subsequently, the metal 3 is removed by etching. Eventually, the film 7 is removed, the back surface of the wafer is pressurized to divide the chip. Since the cracks due to the scribing is removed in advance, the chips of the wafer do not scatter at the dividing time.
JP17037580A 1980-12-03 1980-12-03 Manufacture of semiconductor device Pending JPS5793545A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17037580A JPS5793545A (en) 1980-12-03 1980-12-03 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17037580A JPS5793545A (en) 1980-12-03 1980-12-03 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5793545A true JPS5793545A (en) 1982-06-10

Family

ID=15903765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17037580A Pending JPS5793545A (en) 1980-12-03 1980-12-03 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5793545A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211674A (en) * 1993-12-30 1995-08-11 At & T Corp Manufacture of electrooptic device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS497624A (en) * 1972-05-23 1974-01-23
JPS4933907A (en) * 1972-07-28 1974-03-28
JPS5026903A (en) * 1973-07-12 1975-03-20

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS497624A (en) * 1972-05-23 1974-01-23
JPS4933907A (en) * 1972-07-28 1974-03-28
JPS5026903A (en) * 1973-07-12 1975-03-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211674A (en) * 1993-12-30 1995-08-11 At & T Corp Manufacture of electrooptic device

Similar Documents

Publication Publication Date Title
JPS5743438A (en) Semiconductor device and manufacture thereof
JPS5793545A (en) Manufacture of semiconductor device
JPS5243370A (en) Method of forming depression in semiconductor substrate
JPS52155494A (en) Process for w orking parallel plane of wafer
JPS5339058A (en) Production of semiconductor device
JPS5667933A (en) Scribe method of semiconductor wafer
JPS5658234A (en) Manufacture of semiconductor integrated circuit
JPS57100719A (en) Manufacture of semiconductor device
JPS5368578A (en) Photo mask
JPS531471A (en) Manufacture for semiconductor device
JPS5735368A (en) Manufacture of semiconductor device
JPS53112673A (en) Mask alignment method in semiconductor device manufacturing process and photo mask used for its execution
JPS5325350A (en) Dicing method of semiconductor substrates
JPS534476A (en) Mask alignment method to semiconductor substrate
JPS5797629A (en) Manufacture of semiconductor device
JPS5434766A (en) Manufacture of semiconductor device
JPS6450560A (en) Manufacture of semiconductor device
JPS52106681A (en) Etching method
JPS5766650A (en) Manufacture of semiconductor device
JPS55165638A (en) Semiconductor wafer
JPS6445168A (en) Manufacture of high breakdown voltage semiconductor element
JPS5797628A (en) Manufacture of mos integrated circuit
JPS5251872A (en) Production of semiconductor device
JPS56138922A (en) Manufacture of semiconductor device
JPS5743431A (en) Manufacture of semiconductor device